Electronic part and its manufacturing method

Abstract

An electronic part comprising: a functional element chip on which a functional element has been formed; a wiring member which is electrically connected to the functional element chip; and a protecting member for protecting the functional element chip, wherein the wiring member has a stair shape and is electrically connected to the functional element chip, so that an electronic part having a functional element chip which is hard to be distorted. An electronic part comprising: a functional element chip on which a functional element has been formed; and a protecting member for protecting the functional element chip, wherein a spacer is sandwiched between the functional element chip and the protecting member, so that a constant gap between a functional element chip and a protecting cap is easily held.

What is claimed is:  
     
         1 . An electronic part comprising: 
 a functional element chip on which a functional element has been formed;    a wiring member which is electrically connected to said functional element chip; and    a protecting member for protecting said functional element chip,    wherein said wiring member has a stair shape and is electrically connected to said functional element chip.    
     
     
         2 . A part according to  claim 1 , wherein said wiring member and said protecting member are adhered with an adhesive material.  
     
     
         3 . A part according to  claim 2 , wherein said electronic part has a connecting region in which said wiring member and said functional element chip are electrically connected and an adhesive region in which said wiring member and said protecting member are adhered, and 
 when a surface of said functional element chip on which said functional element has been formed is assumed to be a reference of a height, the connecting region of said wiring member and the adhesive region of said wiring member are formed so as to have different heights.    
     
     
         4 . A part according to  claim 2 , wherein said electronic part has a connecting region in which said wiring member and said functional element chip are electrically connected and an adhesive region in which said wiring member and said protecting member are adhered, and 
 a length of the wiring member connecting said connecting region and said adhesive region is longer than a shortest distance between said connecting region and said adhesive region.    
     
     
         5 . A part according to  claim 2 , wherein said electronic part has a connecting region in which said wiring member and said functional element chip are electrically connected and an adhesive region in which said wiring member and said protecting member are adhered, and 
 said adhesive region is formed on a base edge portion side of said wiring member closer than said connecting region.    
     
     
         6 . A part according to  claim 2 , wherein said adhesive material has a sheet shape, and after said adhesive material is attached by temporarily compression-bonding it onto said protecting member, said wiring member is thermo-compression bonded, thereby adhering said wiring member and said protecting member.  
     
     
         7 . A part according to  claim 2 , wherein said adhesive material is made of a thermoplastic resin, a thermo-setting resin, or a mixed resin of said thermoplastic resin and said thermo-setting resin.  
     
     
         8 . A part according to  claim 2 , further comprising a sealing material for sealing said functional element chip and said protecting member.  
     
     
         9 . A part according to  claim 8 , wherein an elastic modulus of said sealing material is lower than that of said adhesive material.  
     
     
         10 . A part according to  claim 8 , wherein an elastic modulus of said sealing material is equal to or lower than 300 MPa.  
     
     
         11 . A part according to  claim 2 , wherein said functional element chip is a solid state image pick-up element chip, a light emitting element chip, or a light modulating element chip.  
     
     
         12 . A part according to  claim 2 , wherein said protecting member protects said functional element on an operational surface side of said functional element chip and is transparent.  
     
     
         13 . A part according to  claim 2 , wherein in said protecting member, a light shielding member for shielding light is formed at least in a part of a surface which faces said functional element chip.  
     
     
         14 . A part according to  claim 2 , wherein said protecting member has at least one of a reflection preventing film, an optical low pass filter, and an infrared cutting filter.  
     
     
         15 . A part according to  claim 2 , wherein a spacer is arranged between said functional element chip and said protecting member.  
     
     
         16 . A part according to  claim 15 , wherein said spacer is arranged in a region where the functional element is not formed.  
     
     
         17 . A part according to  claim 15 , wherein after a thermoplastic resin, a thermo-setting resin, or their mixed resin is coated, it is cured by ultraviolet rays, heat, or the like, thereby forming said spacer.  
     
     
         18 . A manufacturing method of an electronic part having 
 a functional element chip on which a functional element has been formed,    a wiring member which is electrically connected to said functional element chip, and    a protecting member for protecting said functional element chip,    comprising the steps of: 
 electrically connecting said functional element chip and said wiring member; and  
 adhering said protecting member to said wiring member with an adhesive material so as to have a stair shape.  
   
     
     
         19 . A method according to  claim 18 , wherein said step of adhering said wiring member to said protecting member further has a step of wiring a connecting region in which said functional element chip and said wiring member are connected and an adhesive region in which said protecting member and said wiring member are adhered by a wiring member longer than a shortest distance between them.  
     
     
         20 . A method according to  claim 18 , wherein in said step of adhering said wiring member to said protecting member, they are adhered, as a tension is applied to said wiring member in the direction of a base edge portion side of said wiring member.  
     
     
         21 . A method according to  claim 18 , further comprising the step of sealing a gap between said functional element chip and said protecting member by a sealing material.  
     
     
         22 . A method according to  claim 18 , further comprising the step of forming a layer serving as a light shielding member onto a surface of said protecting member which faces said functional element chip.  
     
     
         23 . A method according to  claim 18 , further comprising the steps of: coating a resin serving as a spacer in a gap between said protecting member and said functional element chip onto said protecting member or said functional element chip; and curing said coated resin.  
     
     
         24 . A method according to  claim 23 , wherein said resin is a thermo-setting resin.  
     
     
         25 . A method according to  claim 23 , wherein said resin is a photo-curing resin.  
     
     
         26 . An electronic part comprising: 
 a functional element chip in which a functional element has been formed; and    a protecting member for protecting said functional element chip,    wherein a spacer is arranged between said functional element chip and said protecting member.    
     
     
         27 . A part according to  claim 26 , wherein said spacer is made of a thermoplastic resin, a thermo-setting resin, their mixed resin, or a photo-curing resin.  
     
     
         28 . A part according to  claim 27 , wherein said spacer is formed in a region of said functional element chip on which said functional element is not formed.  
     
     
         29 . A part according to  claim 26 , further having a sealing material for sealing said functional element chip and said protecting member.  
     
     
         30 . A part according to  claim 29 , wherein said sealing material and said spacer are made of a same resin or resins whose elastic modulus are close.  
     
     
         31 . A part according to  claim 26 , wherein said functional element chip is a solid state image pick-up element chip, a light emitting element chip, or a light modulating element chip.  
     
     
         32 . A part according to  claim 26 , wherein said protecting member protects said functional element on an operational surface side of said functional element chip and is transparent.  
     
     
         33 . A part according to  claim 26 , wherein in said protecting member, a light shielding member for shielding light is formed at least in a part of a surface which faces said functional element chip.  
     
     
         34 . A part according to  claim 26 , wherein said protecting member has at least one of a reflection preventing film, an optical low pass filter, and an infrared cutting filter.  
     
     
         35 . A manufacturing method of an electronic part having 
 a functional element chip in which a functional element has been formed, and    a protecting member for protecting said functional element chip,    comprising the steps of: 
 coating a resin serving as a spacer onto said functional element chip or said protecting member; and  
 curing said coated resin.  
   
     
     
         36 . A method according to  claim 35 , wherein said resin is a thermo-setting resin.  
     
     
         37 . A method according to  claim 35 , wherein said resin is a photo-curing resin.  
     
     
         38 . A method according to  claim 35 , wherein the step of arranging the spacer into a gap between said functional element chip and said protecting member includes a step of forming said spacer into a portion where said functional element is not formed.  
     
     
         39 . A method according to  claim 35 , further comprising the step of sealing a gap between said functional element chip and said protecting member by a sealing material.  
     
     
         40 . A method according to  claim 39 , wherein in said step of curing said spacer, said spacer is cured so as to have an elastic modulus which is close to that of said sealing material.  
     
     
         41 . An electronic part comprising: 
 a functional element chip in which a functional element has been formed;    a wiring member which is electrically connected to said functional element chip; and    a protecting member for protecting said functional element chip,    wherein said wiring member has an adhesive region adhered to said protecting member by an adhesive material and a connecting region electrically connected to said functional element chip, and said adhesive region is formed on a base edge portion side of said wiring member closer than said connecting region.    
     
     
         42 . A part according to  claim 41 , wherein said adhesive material has a sheet shape, and after said adhesive material is attached by temporarily compression-bonding it onto said protecting member, said wiring member is thermo-compression bonded, thereby adhering said wiring member and said protecting member.  
     
     
         43 . A part according to  claim 41 , wherein said adhesive material is made of a thermoplastic resin, a thermo-setting resin, or a mixed resin of said thermoplastic resin and said thermo-setting resin.  
     
     
         44 . A part according to  claim 41 , further comprising a sealing material for sealing said functional element chip and said protecting member.  
     
     
         45 . A part according to  claim 44 , wherein an elastic modulus of said sealing material is lower than that of said adhesive material.  
     
     
         46 . A part according to  claim 44 , wherein an elastic modulus of said sealing material is equal to or lower than 300 MPa.  
     
     
         47 . A part according to  claim 41 , wherein said functional element chip is a solid state image pick-up element chip, a light emitting element chip, or a light modulating element chip.  
     
     
         48 . A part according to  claim 41 , wherein said protecting member protects said functional element on an operational surface side of said functional element chip and is transparent.  
     
     
         49 . A part according to  claim 41 , wherein in said protecting member, a light shielding member for shielding light is formed at least in a part of a surface which faces said functional element chip.  
     
     
         50 . A part according to  claim 41 , wherein said protecting member h as at least one of a reflection preventing film, an optical low pass filter, and an infrared cutting filter.  
     
     
         51 . A part according to  claim 41 , wherein a spacer is arranged between said functional element chip and said protecting member.  
     
     
         52 . A part according to claim  51 , wherein said spacer is arranged in a region where the functional element is not formed.  
     
     
         53 . A part according to claim  51 , wherein after a thermo-setting resin, a thermoplastic resin, or their mixed resin is coated, it is cured by ultraviolet rays, heat, or the like, thereby forming said spacer.