Polishing pad, polishing apparatus and polishing method using the same

Abstract

A metal polishing pad having a functional group which captures a metal ion, a polishing apparatus comprising an apparatus of contacting a polishing subject having a metal surface with the confronting polishing pad according to claim 1 and applying pressure uniformly between them, an apparatus of rotating or transferring a polishing subject and a polishing pad while maintaining contact between them, and an apparatus of feeding a polish promoting agent for promoting polishing into between a polishing subject and a polishing pad, and a method for polishing a metal by chemical mechanical polishing with the metal polishing apparatus.

What is claimed is:  
     
         1 . A metal polishing pad having a functional group which captures a metal ion.  
     
     
         2 . The polishing pad according to  claim 1 , wherein the functional group which captures a metal ion contains at least one atom selected from the group consisting of oxygen atom, nitrogen atom, sulfur atom, phosphorus atom, arsenic atom and selenium atom.  
     
     
         3 . The polishing pad according to  claim 1 , wherein the functional group which captures a metal ion is at least one group selected from the group consisting of —OH, —COOM, >C═O, — 0 —, —COOR, —CONH 2 , —NO, —NO 2 , ≡N—O, —SO 3 M, —PHO(OM), —PO(OM) 2 , —AsO(OM) 2 , —NH 2 , >NH, ≡N, —N═N—, >C═N—, >C═N—OH, >C═NH, —SCN, —SH, —S—, >C═S, —COSM, —CSSM, —CSNH 2 , —NCS, >P—, >As—, —SeH, >S═Se, —CSeSeM 
 wherein, M represents hydrogen atom, alkali metal, alkaline earth metal or ammonium group, and R represents hydrocarbon.  
 
     
     
         4 . The polishing pad according to  claim 1 , wherein the pad comprises an ion exchange resin, or ion exchange fiber.  
     
     
         5 . The polishing pad according to  claim 1 , wherein the pad comprises a chelate resin, or chelate fiber.  
     
     
         6 . The polishing pad according to  claim 1 , where in the metal is a copper-based metal.  
     
     
         7 . A metal polishing apparatus comprising a metal polishing pad according to  claim 1 .  
     
     
         8 . A polishing apparatus comprising an apparatus of contacting a polishing subject having a metal surface with a confronting polishing pad according to  claim 1  and applying pressure uniformly between them, an apparatus of rotating or transferring a polishing subject and a polishing pad while maintaining contact between them, and an apparatus of feeding a polish promoting agent for promoting polishing into between a polishing subject and a polishing pad.  
     
     
         9 . The polishing apparatus according to  claim 8 , wherein the polish promoting agent contains an oxidizer.  
     
     
         10 . The polishing apparatus according to  claim 7  further comprising a functional group regeneration treatment apparatus of contacting a regenerating agent which regenerates a functional group deactivated by capturing a metal with a polishing pad according to  claim 1  after polishing a polishing subject.  
     
     
         11 . The polishing apparatus according to  claim 10 , wherein the regenerating agent is an acidic aqueous solution or an alkaline aqueous solution.  
     
     
         12 . The polishing apparatus according to  claim 7 , wherein the metal is a copper-based metal.  
     
     
         13 . A method for polishing a metal by chemical mechanical polishing with a metal polishing apparatus according to  claim 7 .  
     
     
         14 . A method for polishing a metal comprising the steps of 
 rotating or transferring a polishing pad, a polishing subject, or both of them while keeping the condition of the polishing pad according to  claim 1  pushed to the polishing subject having a metal surface, and    feeding a polish promoting agent between the metal surface and polishing pad.    
     
     
         15 . The method according to  claim 14 , wherein the polishing pad is a pad regenerated by a functional group regeneration treatment apparatus according to  claim 10 .  
     
     
         16 . The polishing method according to  claim 13 , wherein the metal is a copper-based metal.