US2002097062A1PendingUtilityA1

Method and process of applying the analysis of scrub mark morphology and location to the evaluation and correction of semiconductor testing analysis, and manufacture

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Priority: Oct 30, 2000Filed: Oct 27, 2001Published: Jul 25, 2002
Est. expiryOct 30, 2020(expired)· nominal 20-yr term from priority
Inventors:John T. Strom
G01R 35/00G01R 1/07342G01R 31/2886G01R 1/06794G01R 31/2891
37
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Claims

Abstract

By examining the scrub mark properties (position and size) directly, the performance of a wafer probing process is evaluated. The scrub mark images are captured, the image data measured, and detailed information about the process is extracted through analysis. The information may then be used to troubleshoot, improve, and monitor the probing process.

Claims

exact text as granted — not AI-modified
What is claimed is:  
     
         1 . An opto-mechanical workstation for loading, systemically moving, imaging, and analyzing the pads of wafers and dies.

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