Package for semiconductor chip having thin recess portion and thick plane portion

Abstract

In a package for mounting including a metal plate having a recess portion for mounting a semiconductor chip and a plane portion for mounting a metal pattern layer, the recess portion is thinner than the plane portion.

1 . A package comprising a metal plate including a recess portion for mounting a semiconductor chip and a plane potion for mounting a metal pattern layer, 
 said recess portion being thinner than said plane portion.    
     
     
         2 . The package as set forth in  claim 1 , wherein said recess portion has a plurality of protrusions for facing said semiconductor chip.  
     
     
         3 . A method for manufacturing package including a metal plate including a recess portion for mounting a semiconductor chip and a plane portion for mounting a metal pattern layer, comprising the steps of: 
 forming a photoresist pattern layer for covering said plane portion of said metal plate; and    etching said metal plate by using said photoresist pattern layer as a mask.    
     
     
         4 . The method as set forth in  claim 3 , wherein said photoresist pattern layer has a plurality of patterns on said recess portion of said metal plate, so that a plurality of protrusions are formed on said recess portion of said metal plate.  
     
     
         5 . A method for manufacturing a package for mounting including a metal plate including a recess portion for mounting a semiconductor chip and a plane portion for mounting a metal pattern layer, comprising the steps of: 
 forming an insulating layer on a metal plate;    forming a first metal layer on said insulating layer;    forming a first photoresist pattern layer on said first metal layer above said plane portion of said metal plate;    etching said first metal layer by using said first photoresist pattern layer as a mask;    removing said first photoresist pattern layer after said first metal layer is etched;    etching said insulating layer by using said first metal layer as a mask after said first photoresist pattern layer is removed;    forming a second metal layer on said metal plate and said first metal layer after said insulating layer is etched; and    forming a second photoresist pattern layer on said second metal layer above said plane portion of said metal plate;    etching said second metal layer and said recess portion of said metal plate by using said second photoresist pattern.    
     
     
         6 . The method as set forth in  claim 5 , wherein said second photoresist pattern layer has a plurality of patterns on said recess portion of said metal layer.  
     
     
         7 . The method as set forth in  claim 5 , wherein said first photoresist pattern layer has a throughhole on said plane portion of said metal plate.  
     
     
         8 . The method as set forth in  claim 5 , wherein said second metal layer forming step forms said second metal layer by using a plating process.