Embossed blister pack
Abstract
The invention herein relates to a method and apparatus for forming (or cold-forming) an embossed blister from a laminated film wherein an indicia is formed on the base of the blister. In particular, the invention involves a single pass process of combining the formation of a blister and the formation of an indicia (embossing) on the blister, wherein the blister-forming pin contains a face with an indicia and is adapted to controllably stretch the laminated film during blister formation to minimize stretching of the film at the base of the blister. The invention is particularly useful in manufacturing processes which involve the formation of blisters having laminated films which contain a metal foil and polymer layer, wherein improved control in the stretching of the laminate during blister formation is desirable.
Claims
exact text as granted — not AI-modifiedI claim:
1 . A blister pack comprising an embossed blister formed from a laminated film comprising forming a blister by advancing a pin having a face with an indicia thereon in transversal direction relative to the film plane towards and into engagement with a platen bearing an indicia forming die thereon and located on the opposite side of said film wherein said advancing movement of the pin controllably stretches the film around the blister in a manner minimizing stretching of the film located at the base of the blister.Join the waitlist — get patent alerts
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