Antistatic floor covering
Abstract
The invention relates to an antistatic floor covering, especially a laminate floor with a counteracting coating on the back and/or with a damping substrate made from a binding agent plus fillers which is, or can be, attached to the back of the floor covering in an at least partial manner. The disadvantage of laminate floorings of this type is that they build up an electrostatic charge. The task of this invention is therefore to identify another way of avoiding or reducing the accumulation of electrostatic charge in floors of this type. According to the invention, this task is solved in that the counteracting coating disposed on the back of the laminate floor is capable of dissipating electrostatic charge, and/or in that electrically conducting materials are used as fillers in the damping substrate disposed on the back of the flooring.
Claims
exact text as granted — not AI-modified1 . A floor covering, especially a laminate floor with a counteracting coating on the back and/or with a damping substrate made from a binding agent plus fillers which is, or can be, attached to the back of the floor covering in an at least partial manner,
characterised in that
the fillers ( 7 ) are electrically conducting materials and/or in that the counteracting coating ( 9 ) is electrostatically dissipating.
2 . The floor covering of claim 1 ,
characterised in that
the electrostatically dissipating counter coating ( 9 ) is contrived from a metal foil coating, metal sheeting or similar.
3 . The floor covering of claim 1 ,
characterised in that
the fillers ( 7 ) are a dissipating carbon, especially in the form of powders, fibres and/or granulate.
4 . The floor covering of claim 1 and/or at least one of the following claims,
characterised in that
the fillers ( 7 ) are electrically conducting graphite powder, iron powder, iron filings or similar.
5 . The floor covering of claim 1 and/or at least one of the following claims,
characterised in that
electrically conducting ammonium salts and/or metal oxides are used as additives.
6 . The floor covering of claim 1 and/or at least one of the following claims,
characterised in that
electrically dissipating formulations, in particular resins, are used for the binding agent ( 6 ).
7 . The floor covering of claim 1 and/or at least one of the following claims,
characterised in that
an electrostatically dissipating adhesive, in particular a thermoplastic adhesive (hotmelt) is used to attach the floor covering ( 1 ), damping substrate ( 8 ) and/or counteracting coating ( 9 ).Join the waitlist — get patent alerts
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