Flexible lead surface-mount semiconductor package

Abstract

A diode chip is mounted on two bottom metal leads of a surface-mount package through two flexible links. The links are zigzag cantilevers attached to the metallic plates. The cantilevers serve as springs to support the device and to cushion any temperature stress or bending stress so as not to damage the connection between the device and the metallic leads.

1 . A surface mount semiconductor device package, comprising; 
 a semiconductor device; and    at least two metallic plates on which said semiconductor device is mounted,    said metallic plates having bottom contacts for surface mounting to a motherboard and zigzag cantilevers for making connections to said semiconductor device.    
     
     
         2 . A surface mount semiconductor device package as described in  claim 1 , wherein said semiconductor device is a diode.  
     
     
         3 . A surface mount semiconductor device package as described in  claim 2 , wherein said zigzag cantilevers are horizontal.  
     
     
         4 . A surface mount semiconductor device package as described in  claim 3 , wherein said zigzag cantilevers are of inverted-U shape.  
     
     
         5 . A surface mount semiconductor device package as described in  claim 3 , wherein said zigzag cantilevers are of inverted-V shape.  
     
     
         6 . A surface mount semiconductor device package as described in  claim 2 , wherein said zigzag cantilevers are vertical.  
     
     
         7 . A surface mount semiconductor device package as described in  claim 1 , further comprising a glue to seal said semiconductor device.  
     
     
         8 . A surface mount semiconductor device package as described in  claim 2 , wherein said diode has two bottom electrodes.  
     
     
         9 . A surface mount semiconductor device as described in  claim 2 , wherein said diode has a top electrode and a bottom electrode.  
     
     
         10 . A surface mount semiconductor device as described in  claim 9 , wherein said bottom electrode rests on the first plate of said metallic plates and said top electrode is wire-bonded to the second plate of said metallic plates.