Polishing member and apparatus

Abstract

A polishing member is provided in its polishing surface with a plurality of spiral grooves. The polishing surface is rotated while being slidably engaged with a semiconductor wafer to polish the wafer. During polishing, a pumping action is produced at the spiral grooves under a centrifugal force generated by rotation of the polishing member, and harmful large-diameter particles such as diamond particles from a dresser and abrasive particles in a polishing liquid can be discharged, together with the polishing liquid, through the spiral grooves toward an outer peripheral portion of the polishing member.

What is claimed is:  
     
         1 . A polishing member providing a polishing surface which exerts a polishing action by slidable engagement with a substrate to be polished, wherein one or more spiral grooves are formed in the polishing surface so as to extend from a central portion to an outer peripheral edge of the polishing surface.  
     
     
         2 . The polishing member according to  claim 1 , wherein the spiral grooves extend in spiral form in one direction.  
     
     
         3 . The polishing member according to  claim 1 , wherein the spiral grooves comprise one or more first spiral grooves extending in spiral form in one direction and one or more second spiral grooves extending in spiral form in a direction opposite to the direction of extension of the first spiral grooves.  
     
     
         4 . The polishing member according  claim 1 , wherein a spiral angle of each spiral groove is 90° to 450°, the spiral angle being defined as an angle formed by a line connecting the center of the polishing surface and a starting point of the groove and a line connecting the center of the polishing surface and an end point of the groove, as measured in the direction of extension of the groove.  
     
     
         5 . The polishing member according to  claim 2 , wherein a spiral angle of each spiral groove is 90° to 450°, the spiral angle being defined as an angle formed by a line connecting the center of the polishing surface and a starting point of the groove and a line connecting the center of the polishing surface and an end point of the groove, as measured in the direction of extension of the groove.  
     
     
         6 . The polishing member according to  claim 3 , wherein a spiral angle of each spiral groove is 90° to 450°, the spiral angle being defined as an angle formed by a line connecting the center of the polishing surface and a starting point of the groove and a line connecting the center of the polishing surface and an end point of the groove, as measured in the direction of extension of the groove.  
     
     
         7 . The polishing member according to  claim 2 , wherein the polishing member comprises one member selected from a polishing pad and an abrasive plate.  
     
     
         8 . The polishing member according to  claim 3 , wherein the polishing member comprises one member selected from a polishing pad and an abrasive plate.  
     
     
         9 . The polishing member according to  claim 4 , wherein the polishing member comprises one member selected from a polishing pad and an abrasive plate.  
     
     
         10 . The polishing member according to  claim 5 , wherein the polishing member comprises one member selected from a polishing pad and an abrasive plate.  
     
     
         11 . A polishing apparatus comprising a polishing table having attached thereto a polishing member of  claim 1  and a substrate holder adapted to hold the substrate to be polished and press the substrate against the polishing surface of the polishing member on the polishing table.  
     
     
         12 . A polishing apparatus comprising a polishing table having attached thereto a polishing member of  claim 2  and a substrate holder adapted to hold the substrate to be polished and press the substrate against the polishing surface of the polishing member on the polishing table.  
     
     
         13 . A polishing apparatus comprising a polishing table having attached thereto a polishing member of  claim 3  and a substrate holder adapted to hold the substrate to be polished and press the substrate against the polishing surface of the polishing member on the polishing table.  
     
     
         14 . A polishing apparatus comprising a polishing table having attached thereto a polishing member of  claim 4  and a substrate holder adapted to hold the substrate to be polished and press the substrate against the polishing surface of the polishing member on the polishing table.  
     
     
         15 . A polishing apparatus comprising a polishing table having attached thereto a polishing member of  claim 5  and a substrate holder adapted to hold the substrate to be polished and press the substrate against the polishing surface of the polishing member on the polishing table.  
     
     
         16 . A polishing apparatus comprising a polishing table having attached thereto a polishing member of  claim 6  and a substrate holder adapted to hold the substrate to be polished and press the substrate against the polishing surface of the polishing member on the polishing table.  
     
     
         17 . A polishing apparatus comprising a polishing table having attached thereto a polishing member of  claim 7  and a substrate holder adapted to hold the substrate to be polished and press the substrate against the polishing surface of the polishing member on the polishing table.  
     
     
         18 . A polishing apparatus comprising a polishing table having attached thereto a polishing member of  claim 8  and a substrate holder adapted to hold the substrate to be polished and press the substrate against the polishing surface of the polishing member on the polishing table.  
     
     
         19 . A polishing apparatus comprising a polishing table having attached thereto a polishing member of  claim 9  and a wafer holder adapted to hold the substrate to be polished and press the substrate against the polishing surface of the polishing member on the polishing table.  
     
     
         20 . A polishing apparatus comprising a polishing table having attached thereto a polishing member of  claim 10  and a substrate holder adapted to hold the substrate to be polished and press the substrate against the polishing surface of the polishing member on the polishing table.