US2002079884A1PendingUtilityA1
Tightening rings for integrated circuit tester heads
Assignee: SGS THOMSON MICROELECTRONICSPriority: Apr 24, 1997Filed: Oct 26, 2001Published: Jun 27, 2002
Est. expiryApr 24, 2017(expired)· nominal 20-yr term from priority
G01R 1/04
20
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Claims
Abstract
The present invention relates to an assembly ring, on a test head, of a wafer that provides an interface of electric contact transfer between the test head and a circuit to be tested, including a disk, open in its central portion and meant for supporting the periphery of the wafer; a removable collar assembly of the ring on the test head; and means for rotatably connecting the disk in the vicinity of a free end of the collar.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . An assembly ring, on a test head, of a wafer that provides an interface of electric contact transfer between the test head and a circuit to be tested, including:
a disk, having an open central portion and meant for supporting a periphery of the wafer; a collar of removable assembly of the ring on the test head; means for fixing the disk in translation motion to a free end of the collar; and means for making the disk freely rotatable with respect to the collar.
2 . The assembly ring of claim 1 , wherein the rotatable connection means are formed of a ball bearing.
3 . The assembly ring of claim 1 , wherein die disk includes insulating pads for receiving the periphery of the wafer.
4 . The assembly ring of claim 3 , wherein the pads are formed by concentric rings attached to the upper surface of the disk.
5 . The assembly ring of claim 1 , wherein the wafer is a printed circuit wafer.
6 . The assembly ring of claim 1 , meant for a head for testing integrated circuit chips.
7 . The assembly ring of claim 1 , wherein the assembly ring is meant for an integrated circuit test head.
8 . An integrated circuit testing device, of the type including a test head for receiving, removably, a printed circuit wafer that provides an interface of contact transfer between the test head and an integrated circuit to be tested, including a removable ring assembly on the test head of claim 1 .Join the waitlist — get patent alerts
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