Etching device for glass substrate

Abstract

An etching device for a glass substrate is disclosed, in which an etchant is maintained at a constant amount to uniformly etch the glass substrate. The etching device for a glass substrate includes an etch container having an etchant to etch the glass substrate,. a container cover for covering the etch container, a drain at a corner portion of an upper portion of the etch container, for collecting the etchant overflowed from the etch container, and a drain tube for serving as a path of the etchant between the drain and the etch container.

What is claimed is:  
     
         1 . An etching device for a glass substrate comprising: 
 an etch container having an upper portion, having a comer portion, the etch container for receiving an etchant;    a drain at the comer portion, for collecting etchant overflowed from the etch container; and    a drain tube between the drain and the etch container.    
     
     
         2 . The etching device for a glass substrate of  claim 1 , further comprising: 
 a container cover over the etch container;    a bubble plate established at a lower portion of the etch container;    a gas supply tube for supplying gas to the bubble plate; and    a temperature sensor in the etch container.    
     
     
         3 . The etching device for a glass substrate of  claim 2 , wherein the gas is selected from the group consisting of Nitrogen and Oxygen.  
     
     
         4 . The etching device for a glass substrate of  claim 2 , wherein the bubble plate includes a plurality of holes.  
     
     
         5 . The etching device for a glass substrate of  claim 2 , wherein the container cover includes a comer portion formed in the drain region.  
     
     
         6 . The etching device of  claim 5 , wherein the comer portion of the container cover is dipped into etchant within the drain.  
     
     
         7 . The etching device for a glass substrate of  claim 5 , wherein the container cover further includes an outlet for flowing the supplied gas out.  
     
     
         8 . The etching device for a glass substrate of  claim 5 , wherein the comer portion of the container cover is not dipped into etchant within the drain.  
     
     
         9 . The etching device for a glass substrate of  claim 1 , wherein the etchant includes Hydrofluoric acid (HF).  
     
     
         10 . An etching device for a glass substrate comprising: 
 an etching bath including an etch container for holding an etchant, the etch container including an upper portion having a comer portion, the etch bath having a drain formed at the comer portion;    a drain tube between the drain and the etch container;    a DI supply part and an undiluted etchant supply part for supplying DI water and an undiluted etchant to the etching bath;    an etchant recycling part for recycling the etchant; and    a mixing part for mixing the DI and the undiluted etchant supplied from the DI supply part and the undiluted etchant supply part.    
     
     
         11 . The etching device for a glass substrate of  claim 10 , wherein the etchant is HF.  
     
     
         12 . The etching device for a glass substrate of  claim 10 , further comprising: 
 a cleaning bath for cleaning the glass substrate etched in the etching bath; and    a drying bath for drying the cleaned glass substrate.    
     
     
         13 . The etching device for a glass substrate of  claim 10 , wherein the etching bath further includes: 
 a container cover over the etch container;    a bubble plate at a lower portion of the etch container;    a gas supply tube for supplying gas to the bubble plate; and    a temperature sensor in the etch container.    
     
     
         14 . The etching device for a glass substrate of  claim 13 , wherein the gas includes one of Nitrogen and Oxygen.  
     
     
         15 . The etching device for a glass substrate of  claim 13 , wherein the bubble plate includes a plurality of holes.  
     
     
         16 . The etching device for a glass substrate of  claim 13 , wherein the container cover includes a comer portion formed in the drain.  
     
     
         17 . The etching device for a glass substrate of  claim 16 , wherein the corner portion of the container cover is dipped into etchant within the drain.  
     
     
         18 . The etching device for a glass substrate of  claim 16 , wherein the container cover further includes an outlet for flowing the supplied gas out.  
     
     
         19 . The etching device for a glass substrate of  claim 16 , wherein the comer portion of the container cover not being is dipped into etchant within the drain.