Process for preparing novel amorphous non-laminar phosphate alloys

Abstract

The present invention provides amorphous non-laminar nickel phosphorous alloys, amorphous non-laminar nickel cobalt phosphorous alloys, or amorphous non-laminar cobalt phosphorous alloys. These alloys are useful in the formation of metal articles and metal-coated articles, including high precision devices and molds for plastics. In addition, the alloys of the present invention are useful in repairing damaged metal surfaces.

What is claimed is:  
     
         1 . An amorphous non-laminar Ni/P alloy.  
     
     
         2 . An amorphous non-laminar Ni/P alloy according to  claim 1  having a phosphorous content of between about 11% and about 20%.  
     
     
         3 . An amorphous non-laminar Ni/P alloy according to  claim 2  having a phosphorous content of between about 11% and about 13%.  
     
     
         4 . An amorphous non-laminar Ni/P alloy according to  claim 2  having a phosphorous content of between about 13% and about 15%.  
     
     
         5 . An amorphous non-laminar Ni/P alloy according to  claim 2  having a phosphorous content of between about 15% and about 20%.  
     
     
         6 . An amorphous non-laminar Ni/Co/P alloy.  
     
     
         7 . An amorphous non-laminar Co/P alloy.  
     
     
         8 . A process for preparing an amorphous non-laminar Ni/P alloy, an amorphous non-laminar Ni/Co/P alloy, or an amorphous non-laminar Co/P alloy comprising the steps of: 
 a) providing a bath consisting of nickel ions, cobalt ions, or combinations thereof, and phosphorous ions;    b) immersing a suitably dimensioned, load-bearing substrate as a cathode into the bath;    c) immersing an anode into the bath; and    d) applying an electrical potential across the anode and cathode so as to effect electrodeposition of the alloy onto the substrate while maintaining the cathode efficiency at a range of between about 4 and about 10 mg/amp. min.    
     
     
         9 . A process according to  claim 8  wherein the deposition rate is approximately 0.001 inch/hour.  
     
     
         10 . A process according to  claim 8  wherein the cathode efficiency range is between about 6 mg/amp. min. to about 9 mg/amp. min.  
     
     
         11 . A process according to  claim 8  wherein the cathode efficiency is maintained at a range of between about 4 mg/amp. min. to about 6 mg/amp. min.  
     
     
         12 . A process according to  claim 8  wherein the cathode efficiency is maintained by altering the chloride content of the bath.  
     
     
         13 . A process according to  claim 8  wherein the cathode efficiency is maintained by altering the temperature of the bath.  
     
     
         14 . A process according to  claim 8  wherein the anode is a platinum anode.  
     
     
         15 . A process according to  claim 8  wherein the anode is a graphite anode.  
     
     
         16 . A process according to  claim 8  wherein the anode is a ceramic anode.  
     
     
         17 . A process according to  claim 8  wherein the alloy is an amorphous non-laminar Ni/P alloy.  
     
     
         18 . A process according to  claim 17  wherein the bath consists of 0.5-1.4M nickel as metal, 1.5-4.0M phosphorous acid, 0.2-4.0M phosphoric acid and 1.0-3.0M chloride ion.  
     
     
         19 . A process according to  claim 18  wherein the bath consists of 0.8-1.2M nickel as metal, 2.8-3.2M phosphorous acid and 1.8-2.2M chloride ion.  
     
     
         20 . A process according to  claim 19  wherein the bath consists of 1.0M nickel as metal, 3.0M phosphorous acid and 2.0M chloride ion.  
     
     
         21 . A process according to  claim 11  wherein the direct current wave form is modified out of the rectifier.  
     
     
         22 . A process according to  claim 21  wherein the direct current wave form is modified out of the rectifier by pulse plating.  
     
     
         23 . A process according to  claim 21  wherein the direct current wave form is modified out of the rectifier by periodic reverse plating.  
     
     
         24 . An article or device comprised of a substrate having an amorphous non-laminar Ni/P alloy, amorphous non-laminar Ni/Co/P alloy, or amorphous non-laminar Co/P alloy deposited thereon.  
     
     
         25 . An article or device according to  claim 24  wherein the substrate has an amorphous non-laminar Ni/P alloy deposited thereon.  
     
     
         26 . A article or device according to  claim 25 , wherein the amorphous non-laminar Ni/P alloy has a phosphorous content of between about 11% and about 20%.  
     
     
         27 . A article or device according to  claim 26  wherein the amorphous non-laminar Ni/P alloy has a phosphorous content is between about 11% and about 13%.  
     
     
         28 . A article or device according to  claim 26  wherein the amorphous non-laminar Ni/P alloy has a phosphorous content is between about 13% and about 15%.  
     
     
         29 . A article or device according to  claim 26  wherein the amorphous non-laminar Ni/P alloy has a phosphorous content is between about 15% and about 20%.  
     
     
         30 . An article or device according to  claim 25  wherein the article is a non-precision device.  
     
     
         31 . A article or device according to  claim 30  which is a mold or molding insert.  
     
     
         32 . An article or device according to  claim 31  wherein the mold or molding insert is a mold or molding insert for plastic.  
     
     
         33 . An article or device according to  claim 31  wherein the mold or molding insert is a high pressure injection mold, compression mold, thermoset mold, replication mold, or electroforming mold.  
     
     
         34 . An article or device according to  claim 25  wherein the article or device is a high precision device, with the proviso that the article or device not be a mold for contact lenses.  
     
     
         35 . An article or device according to  claim 34  wherein the article or device is selected from information storage disks, Fresnel lenses, photographic lenses, instrument lenses, lenticular lenses, rotogravure cylinders, or reflective surfaces for telescopic laser or infrared sensor applications.  
     
     
         36 . An article or device according to  claim 35  wherein the article or device is an information storage disk.  
     
     
         37 . An article or device according to  claim 36  wherein the information storage disk is a computer memory disk.  
     
     
         38 . An article or device comprised of a substrate having an amorphous non-laminar Ni/P alloy deposited thereon, wherein the article or device is an information storage disk.  
     
     
         39 . An article or device comprised of a substrate having an amorphous non-laminar Ni/P alloy deposited thereon, wherein the article or device is a computer memory disk.  
     
     
         40 . An article or device according to  claim 25  wherein the substrate is a substrate mandrel.  
     
     
         41  An article or device according to  claim 40  wherein the substrate mandrel is precisely-dimensioned.  
     
     
         42 . An amorphous non-laminar Ni/P alloy, amorphous non-laminar Ni/Co/P alloy, or amorphous non-laminar Co/P alloy article or device.  
     
     
         43 . An article or device according to  claim 42  which is an amorphous non-laminar Ni/P alloy article or device.  
     
     
         44 . An article or device according to  claim 43  wherein the article or device is a non-precision article or device.  
     
     
         45 . An article or device according to  claim 43  which is a mold.  
     
     
         46 . An article or device according to  claim 43  wherein the article or device is a high precision article or device.  
     
     
         47 . An article or device according to  claim 46  wherein the article or device is a mold for manufacturing high precision devices.  
     
     
         48 . An article or device according to  claim 47  wherein the mold is a mold for the manufacture of compact disks or digital video disks.  
     
     
         49 . An amorphous non-laminar Ni/P alloy article or device, wherein the article or device is a mold for the manufacture of compact disks or digital video disks.  
     
     
         50 . A method of using an amorphous non-laminar Ni/P alloy, an amorphous non-laminar Ni/Co/P alloy, or an amorphous non-laminar Co/P alloy to make a high precision device comprising subjecting a suitably-dimensioned, load-bearing substrate having an amorphous non-laminar Ni/P alloy, an amorphous non-laminar Ni/Co/P alloy, or an amorphous non-laminar Co/P alloy deposited thereon to high precision tooling.  
     
     
         51 . A method according to  claim 50  wherein an amorphous non-laminar Ni/P alloy is used.  
     
     
         52 . A method according to  claim 51  wherein the high precision tooling is diamond turning.  
     
     
         53 . A method of using an amorphous non-laminar Ni/P alloy, an amorphous non-laminar 
 Ni/Co/P alloy, or an amorphous non-laminar Co/P alloy to make a high precision device comprising subjecting a suitably-dimensioned, load-bearing substrate having an amorphous non-laminar Ni/P alloy, an amorphous non-laminar Ni/Co/P alloy, or an amorphous non-laminar Co/P alloy deposited thereon to high precision tooling, with the proviso that when the alloy is an amorphous non-laminar Ni/P alloy, the substrate is not a mold for contact lenses.    
     
     
         54 . A method according to  claim 53  wherein the high precision tooling is diamond turning.  
     
     
         55 . A method of using an amorphous non-laminar nickel/phosphorous alloy, an amorphous non-laminar nickel/cobalt/phosphorous alloy, or an amorphous non-laminar cobalt/phosphorous alloy to make a device comprising depositing an amorphous non-laminar nickel/phosphorous alloy, an amorphous non-laminar nickel/cobalt/phosphorous alloy, or an amorphous non-laminar cobalt/phosphorous alloy onto the suitably-dimensioned, load-bearing substrate mandrel and then separating the amorphous non-laminar nickel/phosphorous alloy, amorphous non-laminar nickel/cobalt/phosphorous alloy, or amorphous non-laminar cobalt/phosphorous alloy from the substrate mandrel to give the device.  
     
     
         56 . A method according to  claim 55  wherein an amorphous non-laminar nickel/phosphorous alloy is used.  
     
     
         57 . A method of using an amorphous non-laminar nickel/phosphorous alloy, an amorphous non-laminar nickel/cobalt/phosphorous alloy, or an amorphous non-laminar cobalt/phosphorous alloy to make a high precision device comprising depositing an amorphous non-laminar nickel/phosphorous alloy, an amorphous non-laminar nickel/cobalt/phosphorous alloy, or an amorphous non-laminar cobalt/phosphorous alloy onto the precisely-dimensioned surface of a precisely-dimensioned, load-bearing substrate mandrel and then separating the amorphous non-laminar nickel/phosphorous alloy, amorphous non-laminar nickel/cobalt/phosphorous alloy, or amorphous non-laminar cobalt/phosphorous alloy from the substrate mandrel to give the high precision device.  
     
     
         58 . A method according to  claim 57  wherein an amorphous non-laminar nickel/phosphorous alloy is used.  
     
     
         59 . A method of using an amorphous non-laminar nickel/phosphorous alloy, an amorphous non-laminar nickel/cobalt/phosphorous alloy, or an amorphous non-laminar cobalt/phosphorous alloy to repair a damaged metal surface comprising electroplating at least a portion of the damaged metal surface with the amorphous non-laminar nickel/phosphorous alloy, amorphous non-laminar nickel/cobalt/phosphorous alloy, or amorphous non-laminar cobalt/phosphorous alloy.  
     
     
         60 . A method according to  claim 59  wherein amorphous non-laminar nickel/phosphorous alloy is used.  
     
     
         61 . A method according to claim  60  further comprising machining the electroplated amorphous non-laminar nickel/phosphorous alloy, an amorphous non-laminar nickel/cobalt/phosphorous alloy, or an amorphous non-laminar cobalt/phosphorous alloy.  
     
     
         62 . A method according to claim  61  wherein the electroplated amorphous non-laminar nickel/phosphorous alloy is subjected to high precision tooling.  
     
     
         63 . A method according to claim  62  wherein the high precision tooling is diamond turning.