US2002077053A1PendingUtilityA1

Flexible polishing pad having reduced surface stress

30
Priority: Dec 30, 1999Filed: Dec 30, 1999Published: Jun 20, 2002
Est. expiryDec 30, 2019(expired)· nominal 20-yr term from priority
Inventors:Xuyen Pham
B24B 37/26B24D 11/02B24B 21/04
30
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

A polishing member for use in the chemical mechanical planarization of a semiconductor wafer has a first surface for contacting the semiconductor wafer, a second surface opposite the first surface oriented away from the wafer. A plurality of grooves formed in the second surface. The plurality of grooves enable the polishing member to conform to the surface of the wafer and provide uniform polishing of the wafer. In one embodiment the polishing member comprises a linear belt having at least two portions mated at a joint. The plurality of grooves reduce the stress on the joints by increasing the flexibility of the belt thereby reducing the risk of delamination of the belt and joints.

Claims

exact text as granted — not AI-modified
I claim:  
     
         1 . A polishing member belt for use in chemical mechanical planarization of a semiconductor wafer, the polishing member comprising: 
 a first surface for contacting the semiconductor wafer;    a second surface opposite the first surface; and    a plurality of grooves formed in the second surface.    
     
     
         2 . The invention of  claim 1 , wherein the plurality of grooves have a triangular cross section.  
     
     
         3 . The invention of  claim 1 , wherein the plurality of grooves have a trapezoidal cross section.  
     
     
         4 . The invention of  claim 1 , wherein the plurality of grooves have a rectangular cross section.  
     
     
         5 . The invention of  claim 1 , wherein the polishing member comprises a belt that is movable in a linear path and the plurality of grooves are substantially perpendicular to the linear path.  
     
     
         6 . The invention of  claim 1 , further comprising a substrate coupled with the second surface.  
     
     
         7 . The invention of  claim 1 , further comprising a steel belt coupled with the second surface.  
     
     
         8 . A polishing member for use in chemical mechanical planarization of a semiconductor wafer, the polishing member comprising: 
 a linear belt having a first surface for contacting the semiconductor wafer and a second surface opposite the first surface; and    a plurality of grooves formed in the second surface.    
     
     
         9 . The invention of  claim 8 , wherein the polishing member is movable in a linear path and the plurality of grooves are oriented perpendicular to the linear path.  
     
     
         10 . The invention of  claim 8 , wherein the plurality of grooves have a triangular cross section.  
     
     
         11 . The invention of  claim 8 , wherein the plurality of grooves have a trapezoidal cross section.  
     
     
         12 . The invention of  claim 8 , wherein the plurality of grooves have a rectangular cross section.  
     
     
         13 . The invention of  claim 8 , further comprising a substrate coupled with the second surface.  
     
     
         14 . The invention of  claim 8 , further comprising a steel belt coupled with the second surface.  
     
     
         15 . A polishing member for use in chemical mechanical planarization of a semiconductor wafer, the polishing member comprising: 
 a plurality of serially linked polishing pad sections forming a linear belt;    a first surface for contacting the semiconductor wafer;    a second surface opposite the first surface; and    a plurality of grooves formed in the second surface.    
     
     
         16 . The invention of  claim 15 , wherein the polishing member is movable in a linear path and the plurality of grooves are oriented perpendicular to the linear path.  
     
     
         17 . The invention of  claim 15 , wherein the plurality of grooves have a triangular cross section.  
     
     
         18 . The invention of  claim 15 , wherein the plurality of grooves have a trapezoidal cross section.  
     
     
         19 . The invention of  claim 15 , wherein the plurality of grooves have a rectangular cross section.  
     
     
         20 . The invention of  claim 15 , further comprising a substrate coupled with the second surface.  
     
     
         21 . The invention of  claim 15 , further comprising a steel belt coupled with the second surface.

Join the waitlist — get patent alerts

Track US2002077053A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.