Multi-position load lock chamber

Abstract

A machine for manufacturing semiconductor devices has a processing chamber for processing the semiconductor wafer. A transfer chamber has at least two positions, one position to facilitate the transfer of a wafer to be processed into the transfer chamber and to facilitate the transfer of a processed wafer from the transfer chamber to the cassette from which the wafer originated. The second position facilitates the transfer of a wafer to and from the processing chamber. A transfer arm simultaneously transfers an unprocessed wafer from the first position to the second position with the transfer of a processed wafer from the second position to the first position.

What is claimed is:  
     
         1 . A method for performing operations on substrates, comprising the steps of: 
 providing a substrate holder at a plurality of spaced substrate stations;    and    positioning a substrate on each of said holders; and    simultaneously transferring said holders, holding a substrate, to an adjacent one of said stations.    
     
     
         2 . The method of  claim 1 , including providing a plurality of supports at each of said stations configured to support one of said holders.  
     
     
         3 . The method of  claim 1 , wherein said handler is centrally positioned with respect to said stations and the handler has a plurality of radially extending arms, one for each of said stations, and said transferring step includes rotating said handler with a substrate holder positioned on each of said arms.  
     
     
         4 . The method of  claim 3 , wherein said transferring step includes: 
 rotating said handler so that one of said arms is beneath each of said holders;    raising said handler so that each of said holders is lifted from supports at each of said stations;    rotating said handler to a position wherein each of said holders is positioned above supports at and adjacent station; and    lowering said handler so that said holders are transferred to the supports at said adjacent stations.    
     
     
         5 . The method of  claim 4 , wherein said stations include a process station and including the steps of; 
 transferring a substrate from a holder at said process station into a process chamber; and    returning the substrate from the process chamber to the holder at said process station.