Method for mounting a semiconductor chip on a substrate, and semiconductor device adapted for mounting on a substrate

Abstract

A method for manufacturing a semiconductor device includes the steps of providing a semiconductor chip having a pad-mounting surface with bonding pads, attaching a printed circuit sheet to the pad-mounting surface, forming conductive bonding wires that respectively interconnect the bonding pads and conductive traces on the printed circuit sheet, forming a photoresist layer on the printed surface and the pad-mounting surface, forming access holes in the photoresist layer to expose portions of the conductive traces that are respectively offset from the bonding pads, and forming a plurality of conductive bodies in the access holes such that each of the conductive bodies is electrically connected to a respective one of the bonding pads.

I claim:  
     
         1 . A method for mounting a semiconductor chip on a substrate, the substrate having a chip-mounting region provided with a plurality of solder points, the semiconductor chip having a pad-mounting surface provided with a plurality of bonding pads, which are to be connected to corresponding ones of the solder points and which are disposed on the pad-mounting surface at locations that are offset from locations of the corresponding ones of the solder points on the chip-mounting region, said method comprising the steps of: 
 attaching a printed circuit sheet to the pad-mounting surface, wherein the bonding pads are exposed from the printed circuit sheet, the printed circuit sheet including a non-conductive substrate with a printed surface that is opposite to the pad-mounting surface and that is printed with a plurality of conductive traces which are to be respectively and electrically connected to the bonding pads and which are respectively spaced apart from the bonding pads in lateral directions along the printed surface;    forming a plurality of conductive bonding wires that respectively interconnect the bonding pads and the conductive traces;    forming a photoresist layer on the printed surface and the pad-mounting surface such that the bonding pads and the bonding wires are embedded in the photoresist layer;    forming access holes in the photoresist layer, each of which is registered with and exposes at least a portion of a respective one of the conductive traces; and    forming a plurality of conductive bodies in the access holes, wherein each of the conductive bodies is electrically connected to a respective one of the bonding pads.    
     
     
         2 . The method of  claim 1 , wherein each of the access holes is formed in the photoresist layer at a location corresponding to a respective one of the solder points on the chip-mounting region of the substrate.  
     
     
         3 . A semiconductor device adapted for mounting on a substrate, the substrate having a chip-mounting region provided with a plurality of solder points, said semiconductor device comprising: 
 a semiconductor chip having a pad-mounting surface provided with a plurality of bonding pads which are disposed on said pad-mounting surface at locations that are offset from locations of corresponding ones of the solder points on the chip-mounting region;    a printed circuit sheet attached to said pad-mounting surface and including a non-conductive substrate with a printed surface that is opposite to said pad-mounting surface and that is printed with a plurality of conductive traces which are respectively spaced apart from said bonding pads in lateral directions along said printed surface;    a plurality of conductive bonding wires that respectively interconnect said bonding pads and said conductive traces;    a photoresist layer overlaid on said printed surface and said pad-mounting surface such that said bonding pads and said bonding wires are embedded in said photoresist layer, and formed with a plurality of access holes, each of which is registered with and exposes at least a portion of a respective one of said conductive traces; and    a plurality of conductive bodies respectively disposed in said access holes, and connected electrically and respectively to said bonding pads.    
     
     
         4 . The semiconductor device of  claim 3 , wherein each of said access holes is formed in said photoresist layer at a location corresponding to a respective one of the solder points on the chip-mounting region of the substrate.