Thin film magnetic head recessed partially into substrate and including plantarization layersi

Abstract

A combination type thin film magnetic head including an inductive type thin film writing magnetic head and a magnetoresistive type thin film reading magnetic head successively stacked on a substrate is manufactured in the following manner. A recessed portion is formed in a surface of the substrate 21 , a first insulating layer 26 , a first magnetic layer 27 and a thin film coil 29 isolated by a second insulating layer 28 . A pole portion 32 is formed such that it is opposed to a pole portion of the first magnetic layer 27 , and a second magnetic layer 34 is formed such that the third magnetic layer is brought into contact with the pole portion and is coupled with the first magnetic layer 27 at a position remote from in air bearing surface. Then, a MR reproducing element 40 embedded within a shield gap layer 35 is formed, and a third magnetic layer 37 is formed on the shield gap layer 35 . By controlling a thickness of the first insulating layer, the throat height of the inductive type thin film magnetic head can be adjusted independently from the MR height of the magnetoresistive type thin film magnetic head. Therefore, the throat height, apex angle and MR height can be formed accurately, while the throat height can be controlled without destroying a good balanced condition between the throat height and the MR height.

1 . A thin film magnetic head comprising: 
 a first magnetic layer having a pole portion;    a second magnetic layer having a pole portion which is to be opposed to a magnetic record medium and defines a width of record tracks, and end surface of said pole portion constituting an air bearing surface together with an end surface of said pole portion of said first magnetic layer;    a third magnetic layer which is brought into contact with said second magnetic layer on a side opposite to said first magnetic layer and is magnetically coupled with said first magnetic layer at a portion remote from said air bearing surface;    a gap later made of a non-magnetic material and being interposed between the pole portion of the first magnetic layer and the pole portion of the second magnetic layer at least at the air bearing surface;    a thin film coil having a portion which is arranged between said first magnetic layer and said second and third magnetic layers by means of an insulating layer to generate a writing magnetic flux for the magnetic record medium; and    a substrate which supports said first, second and third magnetic layers, gap layer, insulating layer and thin film coil;    wherein said second magnetic layer is extended up to a rear region beyond said pole portion and an extended portion of the second magnetic layer is brought into contact with the third magnetic layer, and a part of said first magnetic layer except for at least said pole portion and the thin film coil isolated by said insulating layer are embedded within a recessed portion formed in the substrate.    
     
     
         2 . A thin film magnetic head as claimed in  claim 1 , wherein the surface of said insulating layer electrically isolating said thin film coil and an interface between said second and third magnetic layers are formed to be coplanar.  
     
     
         3 . A thin film magnetic head as claimed in  claim 1 , wherein said recessed portion formed in the substrate has a side wall which is inclined by 45°-75°.  
     
     
         4 . A thin film magnetic head as claimed in  claim 3 , wherein said side wall of the recessed portion formed in the substrate is inclined by 55°-65°.  
     
     
         5 . A thin film magnetic head as claimed in  claim 1 , wherein said recessed portion has a depth not less than 5 μm.  
     
     
         6 . A thin film magnetic head as claimed in  claim 1 , wherein said second magnetic layer is made of a material having a high saturation magnetic flux density.  
     
     
         7 . A thin film magnetic head as claimed in  claim 1 , wherein a portion of said pole portion of the first magnetic layer opposed to the pole portion of the second magnetic layer via said gap layer has a trim structure having a height which is equal to a whole or a part of a thickness of the first magnetic layer, and has a width which is substantially equal to a width of the pole portion of said second magnetic layer.  
     
     
         8 . A thin film magnetic head as claimed in  claim 7 , wherein said trim structure is formed by etching using the a side wall which is inclined by 45°-75°.  
     
     
         9 . A thin film magnetic head as claimed in  claim 1 , wherein a width of the rear portion of the second magnetic layer beyond the pole portion is widened than a width of the pole portion.  
     
     
         10 . A thin film magnetic head as claimed in  claim 9 , wherein a width of the rear portion of the second magnetic layer beyond the pole portion is gradually increased.  
     
     
         11 . A thin film magnetic head as claimed in  claim 10 , wherein the rear portion of the second magnetic layer beyond the pole portion is widened by an angle of 30-180°.  
     
     
         12 . A thin film magnetic head as claimed in any one of claims  1 - 11 , wherein the thin film magnetic head is constructed as a combination type thin film magnetic head by arranging a magnetoresistive type reproducing element for reading on a surface of the third magnetic layer opposite to the surface which is brought into contact with said second magnetic layer such that an end surface of the reproducing element is exposed on the air bearing surface.  
     
     
         13 . A method of manufacturing a thin film magnetic comprising: 
 the step of forming a recessed portion in a surface of a substrate;    the step of forming a first insulating layer on the surface of the substrate including a surface of the recessed portion;    the step of forming a first magnetic layer on a surface of said first insulating layer;    the step of forming a thin film coil within the recessed portion such that the thin film coil is isolated by a second insulating layer;    the step of forming a gap layer on at least said pole portion of the first magnetic layer as well as on a surface of said second insulating layer after making said first magnetic layer and second insulating layer to have a coplanar surface;    the step of forming a second magnetic layer on said gap layer such that the second magnetic layer includes a pole portion which extends along said pole portion of the first magnetic layer and a rear portion which extents beyond the pole portion;    the step of forming a third magnetic layer such that the second magnetic layer is brought into contact with the second magnetic layer and is brought into contact with said first magnetic layer at a rear portion remote from the air bearing surface; and    the step of forming the air bearing surface to be opposed to a magnetic record medium by polishing said substrate, pole portions of said first and second magnetic layers and gap layer sandwiched by these pole portions while an edge of the recessed portion formed in the substrate is used as a positional reference.    
     
     
         14 . A methodic of manufacturing a thin film magnetic head as claimed in  claim 13 , wherein upon forming said second magnetic layer, a width of said rear portion thereof beyond the pole portion is wider than a width of the pole portion.  
     
     
         15 . A method of manufacturing a thin film magnetic head as claimed in  claim 14 , wherein a width of said rear portion of the second magnetic ayer is gradually increased.  
     
     
         16 . A method of manufacturing a thin film magnetic head as claimed in  claim 15 , wherein said rear portion of the second magnetic layer is widened at an angle of 30-180°.  
     
     
         17 . A method of manufacturing a thin film magnetic head as claimed in  claim 13 , wherein after forming said second magnetic layer, the pole portion of said first magnetic layer is etched while the pole portion of the second magnetic layer is used as a mask to form a trim structure.  
     
     
         18 . A method of manufacturing a thin film magnetic head as claimed in  claim 17 , wherein said etching of the first magnetic layer using the pole portion of the second magnetic layer as the mask is carried out such that a part of a thickness of the first magnetic layer is removed.  
     
     
         19 . A method of manufacturing a thin film magnetic head as claimed in  claim 17 , wherein said etching of the first magnetic layer using the pole portion of the second magnetic layer as the mask is carried out such that the first magnetic layer is removed over its whole thickness.  
     
     
         20 . A method of manufacturing a thin film magnetic head as claimed in  claim 13 , wherein said step of forming the recessed portion in the surface of the substrate comprises: 
 the step of forming a photoresist layer selectively on a part of the surface of the substrate at which the recessed portion is to be formed later;    the step of forming a metal or metal compound layer constituting a mask by a plating, while said photoresist layer is used as a mask;    the step of forming a mask by removing said photoresist layer, said mask having an opening corresponding to the recessed portion to be formed; and    the step of forming the recessed portion in the substrate by a reactive ion etching through the opening.    
     
     
         21 . A method of manufacturing a thin film magnetic head as claimed in  claim 20 , wherein said reactive ion etching for forming the recessed portion is conducted by using, as a reactive gas, a fluorine series gas such as CF 4  and SF 6  or a chlorine series gas such as BCl 3  and Cl 2  or these gases diluted with an oxygen or inert gas.  
     
     
         22 . A method of manufacturing a thin film magnetic head as claimed in  claim 20 , wherein before forming the mask made of metal or metal compound, an insulating layer is formed on the substrate, and then after forming the recessed portion by the etching, said mask made of metal or metal compound is removed by etching while said insulating layer is used as an etching stopper.  
     
     
         23 . A method of manufacturing a thin film magnetic head as claimed in  claim 20 , wherein said recessed portion is formed to have a depth not less than 5 μm.  
     
     
         24 . A method of manufacturing a thin film magnetic head as claimed in  claim 20 , wherein said recessed portion is formed to have a side wall which is inclined by an inclination angle of 45°-75°.  
     
     
         25 . A method of manufacturing a thin film magnetic head as claimed in any one of claims  13 - 24 , wherein a magnetoresistive type reproducing element for reading is formed on said third magnetic layer such that the reproducing element is electrically isolated and magnetically shielded to construct the thin film magnetic head as a combination type thin film magnetic head.  
     
     
         26 . A method of manufacturing a thin film magnetic head as claimed in  claim 25 , wherein after a first shield layer for effecting a magnetic shield is formed on the substrate and a magnetoresistive material layer is formed such that this layer is embedded within an insulating layer, said first magnetic layer which also serves as a second shield is formed and during the polishing process for forming the air bearing surface, said first shield layer as well as said magnetoresistive material layer are polished to form the magnetoresistive type reproducing element whose end surface is exposed on the air bearing surface.  
     
     
         27 . A method of manufacturing a combination type thin film magnetic head having an inductive type writing thin film magnetic head and a magnetoresistive type reading thin film magnetic head for reading successively stached on a substrate comprising: 
 the step of forming a recessed portion in a surface of a substrate;    the step of forming a first insulating layer on an inner surface of the recessed portion as well as on a part of the surface of the substrate;    the step of forming, a first magnetic layer on a surface of said first insulating layer;    the step of forming a thin film coil within the recessed portion such that the thin film coil is isolated by a second insulating layer;    the step of forming a gap layer made of a non-magnetic material on surfaces of said first magnetic layer and second insulating layer;    the step of forming a second magnetic layer on said gap layer such that the second magnetic layer is opposed to a pole portion of the first magnetic layer and is brought into contact with said first magnetic layer at a portion remote from an air bearing surface;    the step of forming a reading magnetoresistive layer on a surface of said second magnetic layer such that the magnetoresistive layer is embedded within a shield gap layer and is electrically isolated and magnetically shielded;    the step of forming a third magnetic layer on said shield gap layer; and    the step of forming the air bearing surface to be opposed to a magnetic record medium by polishing said substrate, pole portions of said first and second magnetic layers, gap layer sandwiched by these pole portions, shield gap layer, magnetoresistive layer and third magnetic layer, while an edge of the recessed portion formed in the substrate is used as a positional reference;    wherein a throat height of the inductive type thin film writing magnetic head is adjusted independently from a MR height of the magnetoresistive type reading thin film magnetic head by controlling a thickness of said first insulating layer.    
     
     
         28 . A method of manufacturing a combination type thin film magnetic head as claimed in  claim 27 , wherein the throat height of said inductive type writing thin film magnetic head is adjusted while the MR height of said magnetoresistive type reading thin film magnetic head is remained constant.  
     
     
         29 . A method of manufacturing a combination type thin film magnetic head as claimed in  claim 7 , wherein a thickness of said first insulating layer is controlled at will within a range of 0.2-0.8 μm.  
     
     
         30 . A method of manufacturing a thin film magnetic head as claimed in  claim 27 , wherein said step of forming the recessed portion in the surface of the substrate comprises: 
 the step of forming a photoresist layer selectively on a part of the surface at the substrate at which the recessed portion is to be formed later;    the step of forming a metal or metal compound layer constituting a mask by a plating, while said photoresist layer is used as a mask;    the step of forming a mask by removing said photoresist layer, said mask having an opening corresponding to the recessed portion to be formed; and    the step of forming the recessed portion in the substrate by a reactive ion etching through the opening.    
     
     
         31 . A method of manufacturing a thin film magnetic head as claimed in  claim 30 , wherein said reactive ion etching for forming the recessed portion is conducted by using, as a reactive gas, a fluorine series gas such as Cl 4  and SF 6  or a chlorine series gas such as BCl 3  and Cl 2  or these gases diluted with tin oxygen or inert gas.  
     
     
         32 . A method of manufacturing a thin film magnetic head as claimed in  claim 30 , wherein before forming the mask made of metal or metal compound, an insulating layer is formed on the substrate, and then after forming the recessed portion by the etching, said mask made of metal or metal compound is removed by etching while said insulating layer is used as an etching stopper.  
     
     
         33 . A method of manufacturing a thin film magnetic head as claimed in  claim 30 , wherein said recessed portion is formed in the surface of the substrate to have a depth not less than 5 μm.  
     
     
         34 . A method of manufacturing a thin film magnetic head as claimed in  claim 30 , wherein said recessed portion is formed to have a side wall which is inclined by an inclination angle of 45°-75°.  
     
     
         35 . A method of manufacturing a combination type thin film magnetic head having an inductive type writing thin film magnetic head and magnetoresistive type reading thin film magnetic head for reading successively stacked on a substrate comprising: 
 the step of forming a recessed portion in a surface of a substrate;    the step of forming a first insulating layer on an inner surface of the recessed portion and a part of the surface of the substrate;    the step of forming a first magnetic layer on a surface of said first insulating layer;    the step of forming a thin film coil within the recessed portion such that the thin film coil is isolated by a second insulating layer;    the step of forming a gap layer made of a non-magnetic material on surfaces of said first magnetic layer and second insulating layer;    the step of forming a second magnetic layer on said gap layer such that said second magnetic layer includes a pole portion which is opposed to a pole portion of the first magnetic layer and a rear portion which extends beyond the pole portion;    the step of forming a third magnetic layer which is brought into contact with said second magnetic layer as well as with said first magnetic layer at a portion remote from an air bearing surface;    the step of forming a reading magnetoresistive layer on said second magnetic layer such that the magnetoresistive layer is embedded within a shield gap layer and is electrically isolated and magnetically shielded;    the step of forming a fourth magnetic layer on said shield gap layer; and    the step of forming the air bearing surface to be opposed to a magnetic record medium by polishing said substrate, first, second and second magnetic layers, gap layer, shield gap layer, magnetoresistive layer and fourth magnetic layer, while an edge of the recessed portion formed in the substrate is used as a positional reference;    wherein a throat height of the inductive type thin film writing magnetic head is adjusted independently from a MR height of the magnetoresistive type reading, thin film magnetic head by controlling a thickness of said first insulating layer.    
     
     
         36 . A method of manufacturing a combination type thin film magnetic head as claimed in  claim 35 , wherein the throat height of said inductive type writing thin film magnetic head is adjusted while the MR height of said magnetoresistive type reading thin film magnetic head is remained constant.  
     
     
         37 . A method of manufacturing a combination type thin film magnetic head as claimed in  claim 35 , wherein a thickness of said first insulating layer is controlled at will within a range of 0.2-0.8 μm.  
     
     
         38 . A method of manufacturing, a combination type thin film magnetic head as claimed in  claim 35 , wherein upon forming said second magnetic layer, a width of the rear portion beyond the pole portion is wider than a width of the pole portion.  
     
     
         39 . A method of manufacturing a combination type thin film magnetic head as claimed in  claim 38 , wherein width of the rear portion of the second magnetic layer is gradually increased.  
     
     
         40 . A method of manufacturing a combination type thin film magnetic head as claimed in  claim 39 , wherein said rear portion of the second magnetic layer is widened by an expansion angle of 30-180°.  
     
     
         41 . A method of manufacturing a combination type thin film magnetic head as claimed in  claim 35 , wherein after forming said second magnetic layer, the pole portion of said first magnetic layer is etched to form a trim structure, while the pole portion of the second magnetic layer is used as a mask.  
     
     
         42 . A method of manufacturing a thin film magnetic head as claimed in  claim 35 , wherein said step of forming the recessed portion in the surface of the substrate comprises: 
 the step of forming a photoresist layer selectively on a part of the surface of the substrate at which the recessed portion is to be formed later;    the step of forming a metal or metal compound layer constituting a mask by a plating, while said photoresist layer is used as a mask;    the step of forming a mask by removing said photoresist layer, said mask having an opening, corresponding to the recessed portion to be formed; and    the step of forming the recessed portion in the substrate by a reactive ion etching through the opening.    
     
     
         43 . A method of manufacturing a thin film magnetic head as claimed in  claim 42 , wherein said reactive ion etching for forming the recessed portion is conducted by using, as a reactive gas, a fluorine series gas such as CF 4  and SF 6  or a chlorine series (as such as BCl 3  and Cl 2  or these gases diluted with an oxygen or inert gas.  
     
     
         44 . A method of manufacturing, a thin film magnetic head as claimed in  claim 42  wherein before forming the mask made of metal or metal compound, an insulating layer is formed on the substrate, and then after forming the recessed portion by the etching, said mask made of metal or metal compound is removed by etching while said insulating layer is used is an etching stopper.  
     
     
         45 . A method of manufacturing a thin film magnetic head as claimed in  claim 42 , wherein said recessed portion is formed in the surface of the substrate to have a depth not less than 5 μm.  
     
     
         46 . A method of manufacturing a thin film magnetic head as claimed in  claim 42 , wherein said recessed portion is formed to have a side wall which is inclined by an inclination angle of 45-75°.  
     
     
         47 . A method of manufacturing a combination type thin film magnetic head having an inductive type writing thin film magnetic head and a magnetoresistive type reading thin film magnetic head for readings successively stacked on a substrate comprising: 
 the step of forming a first magnetic layer on a surface of a substrate in accordance with a given pattern;    the step of forming a recessed portion in the surface of the substrate, while said first magnetic layer is used as a mask;    the step of forming a first insulating layer and a second magnetic layer successively on an inner surface of the recessed portion;    the step of forming a magnetoresistive layer for reading on said first magnetic layer such that the magnetoresistive layer is embedded within a shield gap layer;    the step of forming a second magnetic layer on said first insulating layer within said recessed portion as well as on said shield gap layer;    the step of forming a thin film coil on said second magnetic layer within the recessed portion such that the thin film coil is isolated by a second insulating layer;    the step of forming a gap layer made of a non-magnetic material on said second magnetic layer and second insulating layer;    the step of forming a third magnetic layer which is opposed to said second magnetic layer vial said gap layer and is magnetically coupled with said second magnetic layer at a portion remote from an air bearing surface; and    the step of forming, an air bearing surface to be opposed to a magnetic record medium by polishing said substrate, first magnetic layer, shield gap layer, magnetoresistive layer, second magnetic layer, gap layer and third magnetic layer, while an edge of the recessed portion formed in the substrate is used as a positional reference;    wherein a throat height of the inductive type thin film writing magnetic head is adjusted independently from a MR height of the magnetoresistive type reading thin film magnetic head by controlling a thickness of said first insulating layer.    
     
     
         48 . A method of manufacturing a combination type thin film magnetic head as claimed in  claim 47 , wherein the throat height of said inductive type writing thin film magnetic head is adjusted while the MR height of said magnetoresistive type reading thin film magnetic head is remained constant.  
     
     
         49 . A method of manufacturing a combination type thin film magnetic head as claimed in  claim 47 , wherein a thickness of said first insulating layer is controlled at will within a range of 0.2-0.8 μm.  
     
     
         50 . A method of manufacturing a thin film magnetic head as claimed in  claim 47 , wherein said recessed portion is formed by conducting a reactive ion etching, while said first magnetic layer is used as a mask.  
     
     
         51 . A method of manufacturing a thin film magnetic head as claimed in  claim 50 , wherein said reactive ion etching for forming the recessed portion is conducted by using, as a reactive gas, a fluorine series gas such as CF 4  and SF 6  or a chlorine series gas such as BCl 3  and Cl 2  or these gases diluted with an oxygen or inert gas.  
     
     
         52 . A method of manufacturing a thin film magnetic head as claimed in  claim 51 , wherein said recessed portion is formed in the surface of the substrate to have a depth not less than 5 μm.  
     
     
         53 . A method of manufacturing a thin film magnetic head as claimed in  claim 51 , wherein said recessed portion is formed to have a side wall which is inclined by an inclination angle of 45°-75°.  
     
     
         54 . A method of manufacturing a combination type thin film magnetic head having an inductive type writing thin film magnetic head and a magnetoresistive type reading thin film magnetic head for reading successively stacked on a substrate comprising: 
 the step of forming a first magnetic layer on a surface of a substrate in accordance with a given pattern;    the step of forming a recessed portion in the surface of the substrate, while said first magnetic layer is used as a mask;    the step of forming a first insulating layer on an inner surface of the recessed portion;    the step of forming a magnetoresistive layer for reading on said first magnetic layer such that the magnetoresistive layer is embedded within a shield gap layer;    the step of forming a second magnetic layer on said first insulating layer within said recessed portion as well as on said shield gap layer;    the step of forming, a thin film coil on said second magnetic layer within the recessed portion such that the thin film coil is isolated by a second insulating layer;    the step of forming a gap layer made of a non-magnetic material on said second magnetic layer and second insulating layer;    the step of forming a third magnetic layer which is opposed to said second magnetic layer via said gap layer and is magnetically coupled with said second magnetic layer at a portion remote from an air bearing surface; and    the step of forming an air bearing surface to be opposed to a magnetic record medium by polishing said substrate, first magnetic layer, shield gap layer, magnetoresistive layer, second magnetic layer, gap layer and third magnetic layer, while an edge of the recessed portion formed in the substrate is used as a positional reference;    wherein a throat height of the inductive type thin film writing magnetic head is adjusted independently from a MR height of the magnetoresistive type reading thin film magnetic head by controlling a thickness of said first insulating layer.    
     
     
         55 . A method of manufacturing a combination type thin film magnetic head as claimed in  claim 54 , wherein the throat height of said inductive type writing thin film magnetic head is adjusted while the MR height of said magnetoresistive type reading thin film magnetic head is remained constant.  
     
     
         56 . A method of manufacturing a combination type thin film magnetic head as claimed in  claim 54 , wherein a thickness of said first insulating layer is controlled at will within a range of 0.2-0.8 μm.  
     
     
         57 . A method of manufacturing a thin film magnetic head as claimed in  claim 54 , wherein said recessed portion is formed by conducting a reactive ion etching, while said first magnetic layer is used as a mask.  
     
     
         58 . A method of manufacturing a thin film magnetic head as claimed in  claim 57 , wherein said reactive ion etching for forming the recessed portion is conducted by using, as a reactive gas, a fluorine series gas such as CF 4  and SF 6  or a chlorine series gas such as BCl 3  and Cl 2  or these gases diluted with an oxygen or inert gas.  
     
     
         59 . A method of manufacturing a thin film magnetic head as claimed in  claim 57 , wherein said recessed portion is formed in the surface of the substrate to have a depth not less than  5  lam.  
     
     
         60 . A method of manufacturing a thin film magnetic head as claimed in  claim 57 , wherein said recessed portion is formed to have a side wall which is inclined by an inclination angle of 45°-75°.