Method for molding substance on substrate and device formed thereby

Abstract

A method for molding a molded substance to a substrate is provided. A substrate connected to a fixing portion by a connecting portion is prepared. The substrate is placed in a mold, wherein a portion of the fixing portion is protruding from the mold. The fixing portion is fixed by a fixing device outside the mold. Then, the molded substance covering the substrate is formed within the mold.

What is claimed is:  
     
         1 . A method for molding a molded substance to a substrate; comprising: 
 preparing said substrate connected to a fixing portion by a connecting portion;    placing said substrate in a mold, wherein a portion of said fixing portion is protruding from said mold;    fixing said fixing portion by a fixing device outside said mold; and    executing a molding process in said mold to form said molded substance covering said substrate.    
     
     
         2 . A method according to  claim 1 , further comprising a step of removing said fixing portion from said substrate and said molded substance.  
     
     
         3 . A method according to  claim 2  wherein said connecting portion is capable of being separated by an external force exerted on said portion of said fixing portion protruding from said mold.  
     
     
         4 . A method according to  claim 2  wherein said fixing portion and said substrate are formed integrally.  
     
     
         5 . A method according to  claim 4  wherein said connecting portion is a groove.  
     
     
         6 . A method according to  claim 2  wherein a hole is formed on said molded substance when said fixing portion is removed from said molded substance.  
     
     
         7 . A method according to  claim 6 , further comprising a step of filling up said hole by a filling substance.  
     
     
         8 . A method according to  claim 7  wherein said filling substance is pre-molded.  
     
     
         9 . A method according to  claim 7  wherein said filling substance and said molded substance are made of the same material.  
     
     
         10 . A method according to  claim 1  wherein said fixing portion includes a structure for preventing said substrate moving away from said fixing device.  
     
     
         11 . A method according to  claim 10  wherein said structure of said fixing portion includes: 
 a body portion connecting to said substrate; and  
 a top portion connecting to and larger than said body portion.  
 
     
     
         12 . A method according to  claim 11  wherein said fixing device further includes an opening having a width smaller than that of said top portion for preventing said top portion from leaving said fixing device.  
     
     
         13 . A method for molding a first substance to a second substance; comprising steps of: 
 preparing said second substance, wherein said second substance is connected to a plurality of fixing portions;    placing said second substance in a mold, wherein said plurality of fixing portions are protruding from said mold;    fixing said second substance by fixing said plurality of fixing portions; and    injecting a material of said first substance into said mold to form said first substance on said second substance.    
     
     
         14 . A method according to  claim 13  wherein a first one of said plurality of fixing portions is connected to said second substance by a connecting portion capable of being broken for separating said first fixing portion from said second substance.  
     
     
         15 . A method according to  claim 14  wherein said first fixing portion is integrally formed with said second substance.  
     
     
         16 . A method according to  claim 15  wherein said connecting portion is a groove.  
     
     
         17 . A method according to  claim 14 , wherein a hole is formed on said first substance when said first fixing portion is separated from said second substance, and said method further comprises a step of: 
 filling up said hole with a filling substance.    
     
     
         18 . A method according to  claim 13  wherein a second one of said plurality of fixing portions and said first substance are made of the same material.  
     
     
         19 . A method according to  claim 13 , further comprising a step of: 
 forming an opening on said second substance; and    plugging one of said plurality of fixing portions onto said second substance through said opening.    
     
     
         20 . A molded device comprising: 
 a substrate;    a molded substance covering said substrate except at least one hole,    wherein said molded substance is formed by only one molding process; and    a filling substance filling up said at least one hole.    
     
     
         21 . A molded device according to  claim 20  wherein said filling substance and said molded substance are made of the same material.  
     
     
         22 . A molded device according to  claim 20  wherein said substrate is made of metal.  
     
     
         23 . A molded device according to  claim 20  wherein said molded substance is made of plastic.  
     
     
         24 . A molded device according to  claim 20 , further comprising an opening formed on said substrate and an element capable of performing a specific function, wherein said element is plugged on said opening.  
     
     
         25 . A molded device according to  claim 24  wherein a portion of said element is covered by said molded substance.