US2002055001A1PendingUtilityA1
Chemical vapor deposition method and related material
Priority: Sep 1, 2000Filed: Aug 31, 2001Published: May 9, 2002
Est. expirySep 1, 2020(expired)· nominal 20-yr term from priority
C23C 16/45523C23C 16/18C23C 16/40Y10T428/31678
44
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Claims
Abstract
A process for chemical vapor deposition includes depositing a film using a metal β-diketonate complex and an α, β-unsaturated alcohol. The metal β-diketonate complex and the α, β-unsaturated alcohol is contacted on the substrate at the same time, at different times or alternately.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A process for chemical vapor deposition comprising depositing a film using a metal β-diketonate complex and an α, β-unsaturated alcohol.
2 . A process for chemical vapor deposition for forming a film on a substrate comprising contacting a metal β-diketonate complex and an α, β-unsaturated alcohol at the same time, at different times or alternately on the substrate.
3 . A process for chemical vapor deposition according to any one of claims 1 and 2 wherein the α, β-unsaturated alcohol is a compound characterized as:
where R 1 , R 2 , R 3 , R 4 and R 5 are chosen from the base groups X (halogens), H, alkyl bases and silicon type compounds, and each can be the same or different.
4 . A process for chemical vapor deposition according to any one of claims 1 - 3 , wherein the α, β-unsaturated alcohol is one or two types selected from the group consisting of: aryl alcohol, crotyl alcohol, cis-2-hexen-1-ol, trans-2-hexen-1-ol, 3-methyl-2-butene-1-ol, 1-butene-3-ol, 1-pentene-3-ol, 1-hexen-3-ol, 3-hexen-2, 5-diol, 2-methyl-3-butene-2-ol, 2, 4-hexadiene- 1-ol.
5 . A process for chemical vapor deposition according to any one of claims 1 and 2 wherein the metal β-diketonate complex is a compound characterized as:
where R 6 , R 7 , R 8 , R 9 and R are chosen from the base groups X (halogens), H, alkyl bases and silicon type compounds, and each can be the same or different, n is an integer from 1-4 and m is an integer from 0-5 and M is a metal.
6 . A process for chemical vapor deposition according to any one of claims 1 , 2 and 5 wherein β-diketone of the metal β-diketonate complex is selected from the group consisting of acetylacetone, dipivaloylmethane, hexafluoroacetylacetone, trifluoroacetylacerone.
7 . A process for chemical vapor deposition according to any one of claims 1 - 6 , wherein the film includes one of a metal film, a metal oxide film, a metal nitride film, a metal and a metal carbide film.
8 . A material for use in chemical vapor deposition, the material being characterized as an α, β-unsaturated alcohol and used with a metal β-diketonate complex to form films.
9 . A material for use in chemical vapor deposition to form a film wherein the material is characterized as an α, β-unsaturated alcohol and used with a metal β-diketonate complex, and the α, β-unsaturated alcohol and the metal β-diketonate complex contact the substrate at the same time, at different times or alternately to form the film.
10 . A material for use in chemical vapor deposition process in claim 8 or 9 , wherein the α, β-unsaturated alcohol is a compound characterized as:
where R 1 , R 2 , R 3 , R 4 , and R 5 are chosen from the base groups X (halogens), H, alkyl bases and silicon type compounds, and each can be the same or different.
11 . A material for use in chemical vapor deposition process in any one of claims 8 - 10 wherein the α, β-unsaturated alcohol is one or two types selected from the group consisting of: aryl alcohol, crotyl alcohol, cis-2-hexen-1-ol, trans-2-hexen-1-ol, 3-methyl-2-butene-1-ol, 1-butene-3-ol, 1-pentene-3-ol, 1-hexen-3-ol, 3-hexen-2, 5-diol, 2-methyl-3butene-2-ol 2, 4-hexadiene-1-ol.
12 . A film fabricated by the chemical vapor deposition process in any one of claims 1 - 6 , wherein the film includes a compound oxide film containing Ru and Sr.
13 . A film fabricated by the chemical vapor deposition process in any one of claims 1 - 6 , wherein the film includes a compound oxide film containing Ti, Ba and Sr.
14 . A film fabricated by the chemical vapor deposition process in any one of claims 1 - 6 , where the film includes a compound oxide film containing Ti and Bi.
15 . A film fabricated by the chemical vapor deposition process in any one of claims 1 - 6 , wherein the film includes a compound oxide film containing Sr, Ta and Bi.
16 . A film fabricated by the chemical vapor deposition process in any one of claims 1 - 6 , wherein the film includes a compound oxide film containing Sr, Ta, Nb and Bi.
17 . A film fabricated by the chemical vapor deposition process in any one of claims 1 - 6 , wherein the film includes a compound oxide film containing Pb, Zr and Ti.
18 . A film fabricated by the chemical vapor deposition process in any one of claims 1 - 6 , wherein the film contains as a main component Zr, Hf or La.
19 . A film fabricated by the chemical vapor deposition process in any one of claims 1 - 6 , where the film includes a conductive material and contains Ru, Pt or Ir as a main component.
20 . A film fabricated by the chemical vapor deposition process in any one of claims 1 - 6 , wherein the film includes a conductive material and contains Cu as a main component.
21 . A device fabricated from films formed using the chemical vapor deposition process described in any one of claims 1 - 6 .Join the waitlist — get patent alerts
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