Gasketed cover, cover for electronic equipment and process for producing the covers

Abstract

There are disclosed a first gasketed cover which has excellent sealing properties and comprises a cover body composed of a thermoplastic resin and a gasket composed of a thermoplastic elastomer and integrated with the cover body; a second gasketed cover which has excellent sealing properties and is capable of preventing the generation of noises due the vibration of the cover and which comprises a cover body, a gasket composed of an elastic body and integratedly attached to the cover body, and a member composed of the elastic body of a type same as or different from that in the gasket and integratedly installed on at least part of the cover body plane portion excluding the gasket portion; an electronic equipment cover which is capable of preventing pressure difference between the inside and the outside thereof and which comprises a cover body and a membrane composed of an elastic body and installed on a hole placed on the plane portion of the cover body, in which the cover body is integrated with the membrane; and processes for producing the first and second gasketed covers and the electronic equipment cover each by any of two-color molding method and inserting molding method.

What is claimed is:  
     
         1 . A gasketed cover comprising a cover body which is composed of a thermoplastic resin and a gasket which is composed of a thermoplastic elastomer, said cover body being fitted with said gasket and integrated therewith.  
     
     
         2 . The gasketed cover according to  claim 1 , wherein the thermoplastic resin which constitutes the cover body is integrated with the thermoplastic elastomer which constitutes the gasket by means of fused adhesion therebetween.  
     
     
         3 . The gasketed cover according to  claim 1 , wherein the thermoplastic resin is incorporated with a filler capable of imparting electroconductivity thereto, and said thermoplastic resin incorporated with a filler has a volume resistivity of at most 1×10 8  Ωcm.  
     
     
         4 . The gasketed cover according to  claim 1 , wherein the thermoplastic resin is incorporated with a filler capable of imparting electroconductivity thereto, and said thermoplastic resin incorporated with a filler has a volume resistivity of at most 1×10 8  Ωcm and a JIS hardness-A of at most 80 degrees.  
     
     
         5 . The gasketed cover according to  claim 1 , wherein the thermoplastic resin which constitutes the cover body comprises a liquid crystal polymer or polyphenylene sulfide resin.  
     
     
         6 . A process for producing the gasketed cover as set forth in  claim 1 , which comprises integrating the cover body with the gasket by means of a two-color molding method.  
     
     
         7 . A process for producing the gasketed cover as set forth in  claim 1 , which comprises integrating the cover body with the gasket by means of an inserting molding method.  
     
     
         8 . A gasketed cover comprising a cover body; a gasket which is composed of an elastic body and integratedly attached to said cover body; and a member which is composed of the elastic body of a type same as or different from that of the gasket and integratedly installed on at least part of the plane portion of the cover body excluding the gasket portion.  
     
     
         9 . The gasketed cover according to  claim 8 , wherein the elastic body which constitutes the gasket is composed of a thermoplastic elastomer.  
     
     
         10 . The gasketed cover according to  claim 8 , wherein the cover body is composed of a thermoplastic resin.  
     
     
         11 . The gasketed cover according to  claim 10 , wherein the thermoplastic resin which constitutes the cover body is integrated with the elastic body by means of fused adhesion therebetween, said elastic body constituting the gasket and the member which is composed of the elastic body of a type same as or different from that of the gasket.  
     
     
         12 . A process for producing the gasketed cover as set forth in  claim 9 , which comprises integratedly shaping the gasket and the member which is composed of the elastic body of a type same as or different from that of the gasket onto the cover body by means of an injection molding method.  
     
     
         13 . A process for producing the gasketed cover as set forth in  claim 10 , which comprises integrating the cover body with the gasket and the member which is composed of the elastic body of a type same as or different from that of the gasket by means of a two-color molding method.  
     
     
         14 . A process for producing the gasketed cover as set forth in  claim 10 , which comprises integrating the cover body with the gasket and the member which is composed of the elastic body of a type same as or different from that of the gasket by means of an inserting molding method.  
     
     
         15 . An electronic equipment cover comprising a cover body and a membrane which is composed of an elastic body and is installed on a hole placed on the plane portion of the cover body, said cover body and said membrane being integrated with each other.  
     
     
         16 . The electronic equipment cover according to  claim 15 , comprising a cover body and a membrane which is composed of an elastic body and is installed on a hole placed on the plane portion of the cover body, said cover body and said membrane being integrated by that the peripheral portion of said hole is interposed between the outer peripheral portion of said membrane.  
     
     
         17 . The electronic equipment cover according to  claim 15 , which further comprises a gasket which is composed of the elastic body of a type same as or different from that of the membrane on the plane portion of the cover body excluding the hole portion thereof, said cover body and said gasket being integrated to constitute a gasketed cover.  
     
     
         18 . The electronic equipment cover according to  claim 15 , wherein the cover body is composed of a thermoplastic resin.  
     
     
         19 . The electronic equipment cover according to  claim 15 , wherein the elastic body constituting the membrane is a thermoplastic elastomer.  
     
     
         20 . The electronic equipment cover according to  claim 15 , wherein the elastic body constituting the gasket and the membrane is a thermoplastic elastomer.  
     
     
         21 . The electronic equipment cover according to  claim 20 , wherein the thermoplastic resin which constitutes the cover body is integrated with the elastic body which constitutes the gasket and the member by means of fused adhesion therebetween, said member being composed of the elastic body same as that of the gasket.  
     
     
         22 . A process for producing the electronic equipment cover as set forth in  claim 15 , which comprises integratedly shaping the membrane onto the cover body by means of an injection molding method.  
     
     
         23 . A process for producing the electronic equipment cover as set forth in  claim 20 , which comprises integrating the cover body, the gasket and the membrane which is composed of the elastic body same as that of the gasket by means of two-color molding method.  
     
     
         24 . A process for producing the electronic equipment cover as set forth in  claim 20 , which comprises integrating the cover body with the gasket and the membrane which is composed of the elastic body same as that of the gasket by means of an inserting molding method.