US2002050373A1PendingUtilityA1
Clad polymer EMI shield
Priority: Oct 31, 1997Filed: Aug 3, 2001Published: May 2, 2002
Est. expiryOct 31, 2017(expired)· nominal 20-yr term from priority
Inventors:Joseph Kaplo
H05K 9/0016Y10T29/49067H05K 9/0015Y10S277/92
39
PatentIndex Score
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Claims
Abstract
An electromagnetic interference shield for use around access panels and doors in electronic equipment enclosures includes a base and profile manufactured from an electrically nonconductive solid material such as a thermoplastic resin polymer. An electrically conductive layer of a metallized fabric is bonded to the profile to provide effective shielding and grounding functions. The underlying polymer provides elastic compliancy and resiliency to the shield.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A method of manufacturing a shield for shielding electromagnetic interference from passing through a seam between a first electrically conductive body and a second electrically conductive body comprising the steps of:
forming a base and a profile of an electrically nonconductive solid material in a predetermined configuration; and disposing an electrically conductive layer comprising a metallized fabric on the profile.
2 . A method according to claim 1 wherein the forming step is accomplished by extrusion.
3 . A method according to claim 1 wherein the forming step and the disposing step are accomplished by in-line crosshead extrusion.
4 . A method according to claim 1 wherein the metallized fabric is bonded to the profile.
5 . A method according to claim 1 further comprising the step of dividing the profile into a plurality of independently flexible fingers.
6 . A method of manufacturing a shield for shielding electromagnetic interference from passing through a seam between a first electrically conductive body and a second electrically conductive body comprising the steps of:
disposing an electrically conductive layer comprising a metallized fabric on an electrically nonconductive solid sheet material; and forming the sheet into a base and a profile of a predetermined configuration.
7 . A method according to claim 6 wherein the forming step is accomplished by thermoforming.
8 . A method according to claim 6 wherein the metallized fabric is bonded to the sheet material.
9 . A method according to claim 6 further comprising the step of dividing the profile into a plurality of independently flexible fingers.
10 . A shield for shielding electromagnetic interference from passing through a seam between a first electrically conductive body and a second electrically conductive body, the shield comprising:
a base for securing the shield to the first body; a profile of an electrically nonconductive solid material attached to the base for contacting the second body; and an electrically conductive layer comprising a metallized fabric disposed on the profile.
11 . A shield according to claim 10 wherein the base and the profile are formed integrally.
12 . A shield according to claim 10 wherein the metallized fabric is bonded to the profile.
13 . A shield according to claim 10 wherein the profile comprises a plurality of independently flexible fingers.
14 . A shield according to claim 10 wherein the profile is attached to the base by a hinge.
15 . A shield according to claim 10 further comprising an adhesive strip attached to the base.
16 . A shield according to claim 10 wherein the base includes a return.
17 . A shield according to claim 16 wherein the return includes barbing.Join the waitlist — get patent alerts
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