US2002050373A1PendingUtilityA1

Clad polymer EMI shield

Priority: Oct 31, 1997Filed: Aug 3, 2001Published: May 2, 2002
Est. expiryOct 31, 2017(expired)· nominal 20-yr term from priority
Inventors:Joseph Kaplo
H05K 9/0016Y10T29/49067H05K 9/0015Y10S277/92
39
PatentIndex Score
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Cited by
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References
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Claims

Abstract

An electromagnetic interference shield for use around access panels and doors in electronic equipment enclosures includes a base and profile manufactured from an electrically nonconductive solid material such as a thermoplastic resin polymer. An electrically conductive layer of a metallized fabric is bonded to the profile to provide effective shielding and grounding functions. The underlying polymer provides elastic compliancy and resiliency to the shield.

Claims

exact text as granted — not AI-modified
What is claimed is:  
     
         1 . A method of manufacturing a shield for shielding electromagnetic interference from passing through a seam between a first electrically conductive body and a second electrically conductive body comprising the steps of: 
 forming a base and a profile of an electrically nonconductive solid material in a predetermined configuration; and    disposing an electrically conductive layer comprising a metallized fabric on the profile.    
     
     
         2 . A method according to  claim 1  wherein the forming step is accomplished by extrusion.  
     
     
         3 . A method according to  claim 1  wherein the forming step and the disposing step are accomplished by in-line crosshead extrusion.  
     
     
         4 . A method according to  claim 1  wherein the metallized fabric is bonded to the profile.  
     
     
         5 . A method according to  claim 1  further comprising the step of dividing the profile into a plurality of independently flexible fingers.  
     
     
         6 . A method of manufacturing a shield for shielding electromagnetic interference from passing through a seam between a first electrically conductive body and a second electrically conductive body comprising the steps of: 
 disposing an electrically conductive layer comprising a metallized fabric on an electrically nonconductive solid sheet material; and    forming the sheet into a base and a profile of a predetermined configuration.    
     
     
         7 . A method according to  claim 6  wherein the forming step is accomplished by thermoforming.  
     
     
         8 . A method according to  claim 6  wherein the metallized fabric is bonded to the sheet material.  
     
     
         9 . A method according to  claim 6  further comprising the step of dividing the profile into a plurality of independently flexible fingers.  
     
     
         10 . A shield for shielding electromagnetic interference from passing through a seam between a first electrically conductive body and a second electrically conductive body, the shield comprising: 
 a base for securing the shield to the first body;    a profile of an electrically nonconductive solid material attached to the base for contacting the second body; and    an electrically conductive layer comprising a metallized fabric disposed on the profile.    
     
     
         11 . A shield according to  claim 10  wherein the base and the profile are formed integrally.  
     
     
         12 . A shield according to  claim 10  wherein the metallized fabric is bonded to the profile.  
     
     
         13 . A shield according to  claim 10  wherein the profile comprises a plurality of independently flexible fingers.  
     
     
         14 . A shield according to  claim 10  wherein the profile is attached to the base by a hinge.  
     
     
         15 . A shield according to  claim 10  further comprising an adhesive strip attached to the base.  
     
     
         16 . A shield according to  claim 10  wherein the base includes a return.  
     
     
         17 . A shield according to  claim 16  wherein the return includes barbing.

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