Heat sink and method for manufacturing same

Abstract

A heat sink capable of permitting heat transfer from an electronic component to the heat sink to be effectively promoted while reducing a manufacturing cost of the heat sink and increasing yields thereof. The heat sink includes a base plate adaptable to be kept in direct contact with an electronic component which requires that heat be dissipated therefrom during operation thereof and radiation fins arranged so as to project from the base plate. The base plate includes a main base plate section made of a main material of which the radiation fins are made and a heat transfer promoting base plate section made of a heat transfer promoting material different from the material of which the main base plate section is made. The heat transfer promoting material is integrated with said main material at a stage at which working of a workpiece. This permits heat generated from the electronic component to be dispersed over the whole heat transfer base plate section and then transferred through the whole main base plate section to the radiation fins, so that the heat sink may be increased in heat dissipation efficiency.

1 . A heat sink for dissipating heat from an electronic component, comprising: 
 a base plate including a main base plate section formed of a main material and a heat transfer promoting base plate section formed of a heat transfer promoting material, said base plate being adaptable to be kept in direct contact with said electronic component; and    radiation fins formed of said main material and projecting from said main base plate section;    
     
     
         2 . A heat sink for dissipating heat from an electronic component, comprising: 
 a base plate formed of a heat transfer promoting material, said base plate being adaptable to be kept in direct contact with said electronic component; and    radiation fins formed of a main material and projecting from said base plate;    
     
     
         3 . A heat sink as defined in  claim 1 , wherein said main material is an aluminum alloy and said heat transfer promoting material has a thermal conductivity larger than the thermal conductivity of aluminum.  
     
     
         4 . A heat sink as defined in  claim 2 , wherein said main material is aluminum alloy and said heat transfer promoting material has a thermal conductivity larger than the thermal conductivity of aluminum.  
     
     
         5 . A heat sink as defined in  claim 1 , wherein said heat transfer promoting material is selected from the group consisting of copper and copper alloy.  
     
     
         6 . A heat sink as defined in  claim 2 , wherein said heat transfer promoting material is selected from the group consisting of copper and copper alloy.  
     
     
         7 . A heat sink as defined in  claim 3 , wherein said heat transfer promoting material is selected from the group consisting of copper and copper alloy.  
     
     
         8 . A heat sink as defined in  claim 4 , wherein said heat transfer promoting material is selected from the group consisting of copper and copper alloy.  
     
     
         9 . A heat sink as defined in  claim 1 , wherein said main material and heat transfer promoting material are coupled together by a technique selected from the group consisting of brazing, pressure welding by forging, deformation with intermeshing, and any combination thereof.  
     
     
         10 . A heat sink as defined in  claim 2 , wherein said main material and heat transfer promoting material are coupled together by a technique selected from the group consisting of brazing, pressure welding by forging, deformation with intermeshing, and any combination thereof.  
     
     
         11 . A heat sink as defined in  claim 3 , wherein said main material and heat transfer promoting material are coupled together by a technique selected from the group consisting of brazing, pressure welding by forging, deformation with intermeshing and any combination thereof.  
     
     
         12 . A heat sink as defined in  claim 4 , wherein said main material and heat transfer promoting material are coupled together by a technique selected from the group consisting of brazing, pressure welding by forging, deformation with intermeshing and any combination thereof.  
     
     
         13 . A heat sink as defined in  claim 1 , wherein said heat transfer promoting material is coupled to said main material by plating said heat transfer promoting material on said main material.  
     
     
         14 . A heat sink as defined in  claim 2 , wherein said heat transfer promoting material is coupled to said main material by plating said heat transfer promoting material on said main material.  
     
     
         15 . A heat sink as defined in  claim 3 , wherein said heat transfer promoting material is coupled to said main material by plating said heat transfer promoting material on said main material.  
     
     
         16 . A heat sink as defined in  claim 4 , wherein said heat transfer promoting material is coupled to said main material by plating said heat transfer promoting material on said main material.  
     
     
         17 . A heat sink as defined in  claim 1 , wherein said main material and said heat transfer promoting material define a joint portion where said main material and said heat transfer material are coupled together increase a contact area therebetween.  
     
     
         18 . A heat sink as defined in  claim 2 , wherein said main material and said heat transfer promoting material define a joint portion where said main material and said heat transfer material are coupled together increase a contact area therebetween.  
     
     
         19 . A heat sink as defined in  claim 3 , wherein said main material and said heat transfer promoting material define a joint portion where said main material and said heat transfer material are coupled together increase a contact area therebetween.  
     
     
         20 . A heat sink as defined in  claim 4 , wherein said main material and said heat transfer promoting material define a joint portion where said main material and said heat transfer material are coupled together increase a contact area therebetween.