System and method for chemical mechanical polishing

Abstract

A chemical mechanical polishing machine includes a spindle operable to rotate with respect to a central axis. A wafer carrier may be coupled with the spindle, the wafer carrier operable to rotate in response to rotation of the spindle. A substrate may be coupled with the wafer carrier. In accordance with a particular embodiment of the present invention, a plurality of piezoelectric drive elements may be coupled with the wafer carrier.

What is claimed is:  
     
         1 . An apparatus, comprising: 
 a substrate; and    a plurality of piezoelectric drive elements coupled with the substrate, the piezoelectric drive elements operable to cooperate with a silicon wafer to impart forces at predetermined locations upon the silicon wafer.    
     
     
         2 . The apparatus of  claim 1 , wherein at least two of the plurality of piezoelectric drive elements share a common central axis.  
     
     
         3 . The apparatus of  claim 1 , wherein at least two of the plurality of piezoelectric drive elements include approximately circular-ring cross sections, and share a common central axis.  
     
     
         4 . The apparatus of  claim 1 , further comprising a first half and a second half, wherein the second half is approximately a mirrored image of the first half.  
     
     
         5 . The apparatus of  claim 1 , wherein each of the plurality of piezoelectric drive elements include respective first and second electrical contacts.  
     
     
         6 . The apparatus of  claim 5 , wherein the first and second electrical contacts associated with each piezoelectric drive element are operable to couple their respective piezoelectric drive elements with independent frequency generators.  
     
     
         7 . An apparatus, comprising: 
 a spindle operable to rotate with respect to a central axis;    a wafer carrier coupled with the spindle, the wafer carrier operable to rotate in response to rotation of the spindle;    a substrate coupled with the wafer carrier; and    a plurality of piezoelectric drive elements coupled with the wafer carrier.    
     
     
         8 . The apparatus of  claim 7 , wherein the wafer carrier is adapted to receive a silicon wafer.  
     
     
         9 . The apparatus of  claim 7 , further comprising: 
 a structural arm coupled with the spindle;    a rotating platen disposed adjacent the wafer carrier; and    wherein the structural arm is operable to maintain the wafer carrier within a predetermined distance from the platen.    
     
     
         10 . The apparatus of  claim 7 , further comprising liquid delivery dispenser operable to provide a fluid to the platen.  
     
     
         11 . The apparatus of  claim 7 , wherein the piezoelectric drive elements are operable to impart forces upon the wafer carrier in a direction approximately parallel to the central axis.  
     
     
         12 . The apparatus of  claim 7 , wherein the piezoelectric drive elements are operable to impart forces upon a wafer coupled with the wafer carrier along a plane approximately perpendicular to the central axis.  
     
     
         13 . The apparatus of  claim 7 , wherein the wafer carrier includes a rubber mounting pad, configured to receive a silicon wafer.  
     
     
         14 . The apparatus of  claim 7 , further comprising drive electronics electrically coupled with one or more of the piezoelectric drive elements and operable to provide electrical signals to the piezoelectric drive element.  
     
     
         15 . A method for polishing a silicon wafer, comprising: 
 coupling the silicon wafer with a wafer carrier;    coupling the wafer carrier with a plurality of piezoelectric drive elements:    coupling each of the piezoelectric drive elements with respective frequency generators; and    rotating the wafer carrier with respect to a platen, wherein the silicon wafer is disposed between the wafer carrier and the platen.    
     
     
         16 . The method of  claim 15 , further comprising providing a fluid solution to the platen.  
     
     
         17 . The method of  claim 15 , further comprising rotating the platen with respect to a central axis of the wafer carrier in a direction opposite a direction of rotation of the wafer carrier.  
     
     
         18 . The method of  claim 15 , further comprising configuring the piezoelectric drive elements to impart forces upon the silicon wafer in a direction approximately perpendicular to a central axis of the wafer carrier.  
     
     
         19 . The method of  claim 15 , further comprising configuring the piezoelectric drive elements to impart forces upon the silicon wafer in a direction approximately parallel to a central axis of the wafer carrier.  
     
     
         20 . A method for forming a piezoelectric drive, comprising: 
 coupling a plurality of piezoelectric drive elements with a substrate; and    selecting the location of the piezoelectric drive elements to impart forces upon a silicon wafer, in response to contact with the silicon wafer, at predetermined locations upon the silicon wafer.    
     
     
         21 . The method of claim  20 , further comprising configuring the piezoelectric drive elements such that at least two of the piezoelectric drive elements share a common central axis.