Application of vapor phase HFACAC-based compound for use in copper decontamination and cleaning processes

Abstract

An effective copper decontamination method in the fabrication of integrated circuits is achieved. An organic-based HFACAC decontamination compound in vapor phase is sprayed over elemental copper found on equipment or tools or as a spill wherein the compound reacts with all of the elemental copper and forms a volatile compound that can be flushed away thereby completing copper decontamination.

What is claimed is:  
     
         1 . A method of copper decontamination in the fabrication of an integrated circuit comprising: 
 introducing a decontamination compound in vapor form over elemental copper wherein said compound reacts with all of said elemental copper and forms a volatile compound that can be flushed away thereby completing said copper decontamination.    
     
     
         2 . The method according to  claim 1  wherein said decontamination compound comprises an organic-based HFACAC compound.  
     
     
         3 . The method according to  claim 1  wherein said decontamination compound comprises an organic-based HFAC compound.  
     
     
         4 . The method according to  claim 1  wherein said step of introducing said decontamination compound is done by spraying said decontamination compound from a nozzle.  
     
     
         5 . The method according to  claim 1  wherein said step of introducing said decontamination compound is done under pressure.  
     
     
         6 . The method according to  claim 1  wherein said step of spraying said decontamination compound comprises combining said decontamination compound with an inert gas as a carrier.  
     
     
         7 . The method according to  claim 1  wherein said elemental copper is found on surfaces of equipment and tools.  
     
     
         8 . The method according to  claim 1  wherein said elemental copper is found on wafers to be reclaimed.  
     
     
         9 . The method according to  claim 1  wherein said elemental copper is found on surfaces after a spill.  
     
     
         10 . A method of copper decontamination in the fabrication of an integrated circuit comprising: 
 spraying an organic-based HFACAC compound in vapor form over elemental copper wherein said compound reacts with all of said elemental copper and forms a volatile compound that can be flushed away thereby completing said copper decontamination.    
     
     
         11 . The method according to  claim 10  wherein said step of spraying said organic-based HFACAC compound comprises combining said compound with an inert gas as a carrier.  
     
     
         12 . The method according to  claim 10  wherein said elemental copper is found on surfaces of equipment and tools.  
     
     
         13 . The method according to  claim 10  wherein said elemental copper is found on wafers to be reclaimed.  
     
     
         14 . The method according to  claim 10  wherein said elemental copper is found on surfaces after a spill.  
     
     
         15 . A copper decontamination compound comprising: 
 an organic-based HFACAC compound in vapor form.    
     
     
         16 . The compound according to  claim 15  further comprising an inert gas as a carrier.  
     
     
         17 . The copper decontamination compound according to  claim 15  wherein said copper decontamination compound reacts with elemental copper found on surfaces of equipment and tools and forms a volatile compound that can be flushed away thereby completing copper decontamination.  
     
     
         18 . The copper decontamination compound according to  claim 15  wherein said copper decontamination compound reacts with elemental copper found on wafers to be reclaimed and forms a volatile compound that can be flushed away thereby completing copper decontamination.  
     
     
         19 . The copper decontamination compound according to  claim 15  wherein said copper decontamination compound reacts with elemental copper found on surfaces after a spill and forms a volatile compound that can be flushed away thereby completing copper decontamination.  
     
     
         20 . The copper decontamination compound according to  claim 15  wherein said copper decontamination compound is used to dissolve contaminants in a copper preconcentrate wherein said copper preconcentrate can then be subjected to copper metallic trace detection and analysis.