Semiconductor device, method for manufacturing same and portable device

Abstract

In conventional semiconductor devices, customarily, it is sought to position the mounting region of a semiconductor element in the center of a package, and hence the dimensions of the package are increased unnecessarily, but the object of the present invention is to avoid unnecessary increasing of the package dimensions, without impairing the required functions of the semiconductor device. Unnecessary increasing of package dimensions is avoided by providing a semiconductor device comprising a package having a semiconductor element mounting region, a first region containing the aforementioned mounting region, and a second region partially adjoining the periphery of the above-described first region.

What is claims is:  
     
         1 . A method for manufacturing the semiconductor device which includes a package having: 
 a mounting region for mounting at least one semiconductor element;    a first region containing said mounting region and substantially sharing point symmetry with said mounting region, the width of the portions of said first region not including said mounting region being substantially uniform; and    a second region provided at a perimeter edge of said first region and not substantially sharing point symmetry with said mounting region,    said method comprising the steps of: 
 mounting said semiconductor element on the mounting region by means of a flip chip coding;  
 supplying under-fill resin to said second region; and  
 causing said under-fill resin in said second region to move to said first region so that the gap between said semiconductor element and said mounting region is filled with the resin.  
   
     
     
         2 . A method for manufacturing a semiconductor device which includes a package having: 
 a mounting region for mounting at least one semiconductor element;    a first region containing said mounting region and substantially sharing point symmetry with said mounting region, the width of the portions of said first region not including said mounting region being substantially uniform; and    a second region provided at a perimeter edge of said first region and not substantially sharing point symmetry with said mounting region, said method comprising the steps of:    arranging first bonding pads in said first region;    connecting first and second lead wires derived from said semiconductor element respectively to said first and second bonding pads.