Non-aromatic chromophores for use in polymer anti-reflective coatings

Abstract

An improved light attenuating compound for use in the production of microdevices is provided. Broadly, the light attenuating compound is non-aromatic and can be directly incorporated (either physically or chemically) into photolithographic compositions such as bottom anti-reflective coatings (BARC) and contact or via hole fill materials. The preferred non-aromatic compounds of the invention are conjugated aliphatic and alicyclic compounds which greatly enhance the plasma etch rate of the composition. Furthermore, the light attenuating compounds are useful for absorbing light at shorter wavelengths. In one embodiment, the inventive compounds can be polymerized so as to serve as both the polymer binder of the composition as well as the light absorbing constituent.

We claim:  
     
         1 . In a curable composition for use during microlithographic processes, said composition comprising a polymer binder dissolved in a solvent system, the improvement which comprises a non-aromatic, light attenuating compound which absorbs light at wavelengths of less than about 300 nm in said composition.  
     
     
         2 . The composition of  claim 1 , wherein said light attenuating compound is bonded to the polymer binder.  
     
     
         3 . The composition of  claim 1 , wherein the polymer binder comprises a backbone, and said light attenuating compound is bonded to said backbone.  
     
     
         4 . The composition of  claim 1 , wherein said light attenuating compound is bonded to a linkage unit and said linkage unit is bonded to the polymer binder.  
     
     
         5 . The composition of  claim 4 , wherein said linkage unit comprises a moiety selected from the group consisting of cyclic alkyls, acyclic alkyls, acyclic heteroalkyls, and cyclic heteroalkyls.  
     
     
         6 . The composition of  claim 1 , wherein said light attenuating compound includes a moiety selected from the group consisting of COOH, OH, CONH 2 , CONHR′, CH 2 X, and mixtures thereof, wherein R′ is selected from the group consisting of hydrogen, alkyls, and heteroalkyls, and wherein X is a halogen.  
     
     
         7 . The composition of  claim 1 , wherein after curing, said composition has an etch rate of at least about 4000 Å/minute when utilizing an etchant gas comprising a mixture of HBr and O 2 .  
     
     
         8 . The composition of  claim 1 , wherein said light attenuating compound comprises an olefinic moiety including carbon atoms C 1  and C 2  double-bonded to one another, and an EWG bonded to carbon atom C 1 .  
     
     
         9 . The composition of  claim 8 , wherein the EWG includes a moiety selected from the group consisting of carbonyl, carboxyl, carboxamido, sulfonyl, and non-aromatic heterocyclic groups.  
     
     
         10 . The composition of  claim 8 , said light attenuating compound comprising a diolefin, including carbon atoms C 3  and C 4  double-bonded to one another, and wherein C 3  is bonded to C 2  so as to form conjugated double bonds.  
     
     
         11 . The composition of  claim 10 , further including an EDG bonded to C 4 .  
     
     
         12 . The composition of  claim 11 , wherein the EDG includes a moiety selected from the group consisting of H 3 CO, OH, and R 1 —O—, wherein R 1  is non-aromatic and is selected from the group consisting of hydrogen, acyclic and cyclic alkyls, and heteroalkyls.  
     
     
         13 . The composition of  claim 10 , further including a second EWG, said second EWG being bonded to C 4 .  
     
     
         14 . The composition of  claim 13 , wherein the second EWG includes a moiety selected from the group consisting of carbonyl, carboxyl, carboxamido, sulfonyl, and non-aromatic heterocyclic groups.