Heat dissipation apparatus

Abstract

The present invention relates to a heat dissipation apparatus for dispersing heat from a heat source. The heat dissipation apparatus has a sealed space for containing a cooling medium, and the cooling medium is provided at appropriate pressure conditions below room temperature to approach the liquid-gas phase critical state and perform rapid heat convection in the heat dissipation apparatus in the presence of local temperature differential. In addition, the present invention increases the contact area between the cooling medium and the housing of the heat dissipation apparatus by a specific internal structure, so that heat can be rapidly dissipated to the heat dissipation apparatus to achieve a better effect than that of conventional heat dissipation apparatus.

What is claimed is:  
     
         1 . A heat dissipation apparatus for dispersing heat from a heat source, the heat dissipation apparatus comprising: 
 a heat dissipation body having a contact surface and a sealed chamber, wherein the contact surface is in contact with the heat source;    a plurality of first heat conductive strips each having a first end and a second end, the first end of each first heat conductive strip disposed on the heat dissipation body in the sealed chamber, and the second end of each first heat conductive strip extended substantially away from the contact surface;    a plurality of second heat conductive strips each having a third end and a fourth end, the third end of each second heat conductive strip disposed on the heat dissipation body in the sealed chamber, and the fourth end of each second heat conductive strip extended substantially toward the contact surface, wherein certain spaces are respectively formed between the first heat conductive strips and the second heat conductive strips; and    a cooling substance contained in the sealed chamber.    
     
     
         2 . The heat dissipation apparatus according to  claim 1 , further comprising a plurality of heat dissipation fins respectively disposed on the periphery of the heat dissipation body.  
     
     
         3 . The heat dissipation apparatus according to  claim 2 , wherein the heat dissipation body, the heat dissipation fins, the first heat conductive strips, and the second heat conductive strips are respectively made of heat conductive materials.  
     
     
         4 . The heat dissipation apparatus according to  claim 3 , wherein the cooling substance is a cooling medium under a certain condition, the cooling medium suited to performing phase change according to a certain range of temperature change thereof, and the heat conductive materials are selected from the group consisting of copper, aluminum, titanium, copper alloy, aluminum alloy, titanium alloy, and stainless steel.  
     
     
         5 . A heat dissipation apparatus for dispersing heat from a CPU, the heat dissipation apparatus comprising: 
 a heat dissipation body having a contact surface being in contact with the CPU and a column-shaped sealed chamber being substantially perpendicular to the contact surface, wherein the heat dissipation body in the sealed chamber is provided with corresponding first end surface and second end surface, the first end surface and the second end surface being substantially parallel to the contact surface;    a plurality of first heat conductive strips each having a first end and a second end, the first end of each first heat conductive strip disposed on the first end surface, and the second end of each first heat conductive strip extended substantially toward the second end surface;    a plurality of second heat conductive strips each having a third end and a fourth end, the third end of each second heat conductive strip disposed on the second end surface, and the fourth end of each second heat conductive strip extended substantially toward the first end surface, wherein certain spaces are respectively formed between the first heat conductive strips and the second heat conductive strips;    a cooling medium contained in the sealed chamber under a certain condition, the cooling medium suited to performing phase change according to a certain range of temperature change thereof; and    a plurality of heat dissipation fins respectively disposed on the periphery of the heat dissipation body.    
     
     
         6 . The heat dissipation apparatus according to  claim 5 , wherein the heat dissipation body in the sealed chamber has a internal wall provided between the first end surface and the second end surface, and the internal wall comprises a plurality of ridges respectively extended between the first end surface and the second end surface.  
     
     
         7 . The heat dissipation apparatus according to  claim 6 , wherein the heat dissipation body, the heat dissipation fins, the first heat conductive strips, the second heat conductive strips, and the ridges are respectively made of heat conductive materials.  
     
     
         8 . The heat dissipation apparatus according to  claim 7 , wherein the heat conductive materials are selected from the group consisting of copper, aluminum, titanium, copper alloy, aluminum alloy, titanium alloy, and stainless steel.  
     
     
         9 . The heat dissipation apparatus according to  claim 8 , wherein the first heat conductive strips and the second heat conductive strips are respective board-shaped components.  
     
     
         10 . The heat dissipation apparatus according to  claim 8 , further comprising a plurality of protrusions of the heat conductive materials provided on the first heat conductive strips and the second heat conductive strips.  
     
     
         11 . The heat dissipation apparatus according to  claim 8 , wherein each of the first heat conductive strips and the second heat conductive strips respectively has a hollow portion forming a tube structure.  
     
     
         12 . The heat dissipation apparatus according to  claim 11 , further comprising a plurality of heat conductive meshes of the heat conductive materials contained in the hollow portions.  
     
     
         13 . A heat dissipation apparatus for dispersing heat from a CPU, the heat dissipation apparatus comprising: 
 a heat dissipation body having a contact surface being in contact with the CPU and a column-shaped sealed chamber being substantially perpendicular to the contact surface, wherein the heat dissipation body in the sealed chamber is provided with corresponding first end surface and second end surface, the first end surface and the second end surface being substantially parallel to the contact surface;    a plurality of heat conductive strips each having a first end and a second end, the first end of each heat conductive strip disposed on the first end surface, and the second end of each heat conductive strip disposed on the second end surface, wherein certain spaces are respectively formed between the heat conductive strips;    a cooling medium contained in the sealed chamber under a certain condition, the cooling medium suited to performing phase change according to a certain range of temperature change thereof; and    a plurality of heat dissipation fins respectively disposed on the periphery of the heat dissipation body.    
     
     
         14 . The heat dissipation apparatus according to  claim 13 , wherein the heat dissipation body in the sealed chamber has a internal wall provided between the first end surface and the second end surface, and the internal wall comprises a plurality of ridges respectively extending between the first end surface and the second end surface.  
     
     
         15 . The heat dissipation apparatus according to  claim 14 , wherein the heat dissipation body, the heat dissipation fins, the heat conductive strips, and the ridges are respectively made of heat conductive materials.  
     
     
         16 . The heat dissipation apparatus according to  claim 15 , wherein the heat conductive materials is selected from the group consisting of copper, aluminum, titanium, copper alloy, aluminum alloy, titanium alloy, and stainless steel.  
     
     
         17 . The heat dissipation apparatus according to  claim 16 , wherein the heat conductive strips are, respectively, board-shaped components.  
     
     
         18 . The heat dissipation apparatus according to  claim 16 , further comprising a plurality of protrusions of the heat conductive materials provided on the heat conductive strips.  
     
     
         19 . The heat dissipation apparatus according to  claim 16 , wherein each of the heat conductive strips respectively has a hollow portion forming a tube structure.  
     
     
         20 . The heat dissipation apparatus according to  claim 19 , further comprising a plurality of heat conductive meshes of the heat conductive materials contained in the hollow portions.