Apparatus for packaging semiconductor device and method for packaging the same

Abstract

An apparatus for packaging a semiconductor device and a method for packaging the same. The apparatus includes a closed printing chamber having a baseplate on the bottom of the closed printing chamber. A pressure controlling system is connected to the closed printing chamber. The baseplate includes a heating unit. A paste source tank is located in the closed printing chamber.

What is claimed is:  
     
         1 . A method for packaging a semiconductor device, wherein a chip is attached to a carrier and electrically coupled to the carrier, comprising the steps of: 
 providing a closed printing chamber having a baseplate;    mounting the carrier and a stencil having a mesh in sequence on the baseplate, wherein the carrier is located in the mesh;    placing a preheated paste on the stencil;    adjusting a pressure in the closed printing chamber to a first pressure to perform a printing step for filling the mesh with paste and covering the carrier;    adjusting the pressure in the closed printing chamber to a second pressure; and    adjusting the pressure in the closed printing chamber to a third pressure to perform a scraping step for removing the redundant paste.    
     
     
         2 . The method of  claim 1 , wherein the paste is heated by the baseplate during the printing step and the scratching step.  
     
     
         3 . The method of  claim 1 , wherein the paste is heated to a temperature of about 50 to 120° C.  
     
     
         4 . The method of  claim 1 , wherein the preheated temperature of the paste is about 40 to 90° C.  
     
     
         5 . The method of  claim 1 , wherein the first pressure is about 0.01 to 5 Torr.  
     
     
         6 . The method of  claim 1 , wherein the second pressure is about 350 to 1000 Torr when the viscosity of the paste is about 200 to 300 Pa·s.  
     
     
         7 . The method of  claim 1 , wherein the second pressure is about 0.5 to 2 Kg/cm 2  when the viscosity of the paste is about 600 to 1000 Pa·s.  
     
     
         8 . The method of  claim 1 , wherein the third pressure is about 5 to 20 Torr.  
     
     
         9 . A method for packaging a semiconductor device, wherein a plurality of chips is attached to a plurality of carriers, respectively, and electrically coupled to the carriers, comprising the steps of: 
 providing a closed printing chamber having a baseplate;    mounting the carriers and a stencil having a mesh in sequence on the baseplate, wherein the carriers are located in the mesh;    placing a preheated paste on the stencil;    adjusting a pressure in the closed printing chamber to a first pressure to perform a printing step for filling the mesh with paste and covering the carriers;    adjusting the pressure in the closed printing chamber to a second pressure; and    adjusting the pressure in the closed printing chamber to a third pressure to perform a scraping step for removing the redundant paste.    
     
     
         10 . The method of  claim 9 , wherein the paste is heated by the baseplate during the printing step and the scratching step.  
     
     
         11 . The method of  claim 10 , wherein the paste is heated to a temperature of about 50 to 120° C.  
     
     
         12 . The method of  claim 9 , wherein the preheated temperature of the paste is about 40 to 90° C.  
     
     
         13 . The method of  claim 9 , wherein the first pressure is about 0.01 to 5 Torr.  
     
     
         14 . The method of  claim 9 , wherein the second pressure is about 350 to 1000 Torr when the viscosity of the paste is about 200 to 300 Pa·s.  
     
     
         15 . The method of  claim 9 , wherein the second pressure is about 0.5 to 2 Kg/cm 2  when the viscosity of the paste is about 600 to 1000 Pa·s.  
     
     
         16 . The method of  claim 9 , wherein the third pressure is about 5 to 20 Torr.  
     
     
         17 . The method of  claim 9 , further comprising the steps of: 
 removing the stencil;    curing the paste; and    splitting to form individual semiconductor packages.    
     
     
         18 . An apparatus for packaging a semiconductor device, comprising: 
 a closed printing chamber;    a pressure control system connected to the closed printing chamber;    a baseplate located in the closed printing chamber; and    a paste source tank located in the closed printing chamber.    
     
     
         19 . The apparatus of  claim 18 , wherein the baseplate includes a heating unit.  
     
     
         20 . The apparatus of  claim 18 , wherein the paste source tank includes a vacuum chamber having a heating unit and an outlet opening.  
     
     
         21 . An apparatus for packaging a semiconductor device comprising: 
 a closed printing chamber;    a pressure control system connected to the closed printing chamber;    a baseplate having a heating unit located in the closed printing chamber; and    a paste source tank having a vacuum chamber located in the closed printing chamber, wherein the vacuum chamber includes a heating unit and an outlet opening.