Semiconductor manufacturing apparatus with an improved wafer cassette

Abstract

The first present invention provides a wafer cassette mechanism comprising: a plurality of wafer tray sets, each set storing a single semiconductor wafer; a supporting mechanism for mechanically supporting the wafer tray sets which are laminated together with each other, and so that adjacent two of the wafer tray sets are in contact directly with each other, the supporting mechanism adjusting level of the laminated wafer trays; and a locking mechanism for locking selected ones of the wafer tray sets so that a target one of the wafer trays is distanced from adjacent underlying and overlying ones of the wafer tray sets.

What is claimed is:  
     
         1 . A wafer cassette mechanism comprising: 
 a plurality of wafer tray sets, each set storing a single semiconductor wafer;    a supporting mechanism for mechanically supporting the wafer tray sets which are laminated together with each other, and so that adjacent two of the wafer tray sets are in contact directly with each other, said supporting mechanism adjusting level of the laminated wafer trays; and    a locking mechanism for locking selected ones of the wafer tray sets so that a target one of the wafer trays is distanced from adjacent underlying and overlying ones of said wafer tray sots.    
     
     
         2 . The wafer cassette mechanism as claimed in  claim 1 , wherein the wafer cassette mechanism is provided in a load lock chamber.  
     
     
         3 . The wafer cassette mechanism as claimed in  claim 1 , wherein said supporting mechanism further comprises: 
 a driving motor;    an elevation rod connected with the driving motor;    a stacking stage connected through the elevation rod to the driving motor for allowing the wafer trays to be stacked over the stacking stage and    a guide mechanism supporting the wafer trays and the stacking stage for allowing the wafer trays and the stacking stage to be elevated by a driving force of the driving motor.    
     
     
         4 . The wafer cassette mechanism as claimed in  claim 1 , wherein the locking mechanism further comprises: 
 at least two sets of locking members provided different in level by a first pitch which is larger than a second pitch which is defined between adjacent laminated two of said wafer trays in contact directly with each other.    
     
     
         5 . The wafer cassette mechanism as claimed in  claim 4 , wherein each of said locking members comprises a locking pin.  
     
     
         6 . The wafer cassette mechanism as claimed in  claim 5 , wherein each of said wafer trays further comprises; 
 a body having a flat top surface and a flat bottom face and a thickness as well as having a locking hole, into which said locking pin is inserted and    a contact portion inwardly extending from the body for allowing an edge of semiconductor wafer to be in contact with an upper surface of the contact portion.    
     
     
         7 . The wafer cassette mechanism as claimed in  claim 6 , wherein the contact portion is tapered.  
     
     
         8 . A wafer cassette mechanism comprising; 
 a plurality of wafer tray sets, each set storing a single semiconductor wafer;    a supporting mechanism for mechanically supporting the wafer tray sets which are laminated together with each other, and so that adjacent two of the wafer tray sets are in contact directly with each other, said supporting mechanism adjusting level of the laminated wafer trays; and    a locking mechanism for locking selected ones of the wafer tray sets so that a first pitch defined between a target one of the wafer trays and an adjacent overlying one of the wafer tray as well as a second pitch defined between the target wafer tray and an adjacent underlying one of the wafer tray are larger than a third pitch defined between laminated adjacent two of the wafer trays.    
     
     
         9 . The wafer cassette mechanism as claimed in  claim 8 , wherein the wafer cassette mechanism is provided in a load lock chamber.  
     
     
         10 . The wafer cassette mechanism as claimed in  claim 8 , wherein said supporting mechanism further comprises: 
 a driving motor;    an elevation rod connected with the driving motor;    a stacking stage connected through the elevation rod to the driving motor for allowing the wafer trays to be stacked over the stacking stage; and    a guide mechanism supporting the wafer trays and the stacking stage for allowing the wafer trays and the stacking stage to be elevated by a driving force of the driving motor.    
     
     
         11 . The wafer cassette mechanism as claimed in  claim 8 , wherein the locking mechanism further comprises; 
 at least two sets of locking members provided different in level by the first pitch.    
     
     
         12 . The wafer cassette mechanism as claimed in  claim 11 , wherein each of said locking members comprises a locking pin.  
     
     
         13 . The wafer cassette mechanism as claimed in  claim 12 , wherein each of said wafer trays further comprises: 
 a body having a flat top surface and a flat bottom face and a thickness, well as having a locking hole, into which said locking pin is inserted and    a contact portion inwardly extending from the body for allowing an edge of semiconductor wafer to be in contact with an upper surface of the contact portion.    
     
     
         14 . The wafer cassette mechanism as claimed in  claim 13 , wherein the contact portion is tapered.  
     
     
         15 . A semiconductor manufacturing apparatus comprising: 
 a plurality of process chambers;    at least a load lock chamber having a first type wafer cassette;    a carrier chamber connected with all of the process chambers load lock chamber, and the carrier chamber having a first carrier robot arm;    a cassette stage having a plurality of second type wafer cassettes; and    a second carrier robot arm between the cassette stage and the at least load lock chamber,    wherein the wafer cassette further comprises;    a plurality of wafer tray sets, each set storing a single semiconductor wafer;    is a supporting mechanism for mechanically supporting the wafer tray sets which are laminated together with each other, and so that adjacent two of the wafer tray sets are in contact directly with each other, said supporting, mechanism adjusting level of the laminated wafer trays; and    a locking mechanism for locking selected ones of the wafer tray sets so that a target one of the wafer trays is distanced from adjacent underlying and overlying ones of said wafer tray sets.    
     
     
         16 . The semiconductor manufacturing apparatus as claimed in  claim 15 , wherein the wafer cassette mechanism is provided in a load lock chamber.  
     
     
         17 . The semiconductor manufacturing apparatus as claimed in  claim 15  wherein said supporting mechanism further comprises 
 driving motor.  
 an elevation rod connected with the driving motor;  
 a stacking stage connected through the elevation rod to the driving motor for allowing the wafer trays to be stacked over the stacking stage; and  
 a guide mechanism supporting the wafer trays and the stacking stage for allowing the wafer trays and the stacking stage to be elevated by a driving force of the driving motor.  
 
     
     
         18 . The semiconductor manufacturing apparatus as claimed in  claim 15 , wherein the locking mechanism further comprises: 
 at least two sets of locking members provided different in level by a first pitch which is larger than a second pitch which is defined between adjacent laminated two of said wafer trays in contact directly with each other.    
     
     
         19 . The semiconductor manufacturing apparatus as claimed in  claim 18 , wherein each of said locking members comprises a locking pin.  
     
     
         20 . The semiconductor manufacturing apparatus as claimed in claim  19 , wherein each of said wafer trays further comprises: 
 a body having a flat top surface and a flat bottom face and a thickness as well as having a locking hole, into which said locking pin is inserted; and    a contact portion inwardly extending from the body for allowing an edge of semiconductor wafer to be in contact with an upper surface of the contact portion.    
     
     
         21 . The wafer cassette mechanism as claimed in  claim 20 , wherein the contact portion is tapered.  
     
     
         22 . A semiconductor manufacturing apparatus comprising: 
 a plurality of process chambers;    at least a load lock chamber having a first type wafer cassette,    a carrier chamber connected with all of the process chambers load look chamber, and the carrier chamber having a first carrier robot arm;    a cassette stage having a plurality of second type wafer cassettes; and    a second carrier robot arm between the cassette stage and the at least load lock chamber,    wherein the wafer cassette further comprises    a plurality of wafer tray sets, each set storing a single semiconductor wafer;    a supporting mechanism for mechanically supporting the wafer tray sets which are laminated together with each other, and so that adjacent two of the wafer tray sets are in contact directly with each other, said supporting mechanism adjusting level of the laminated wafer trays; and    a locking mechanism for locking selected ones of the wafer tray sets so that a first pitch defined between a target one of the wafer trays and an adjacent overlying one of the wafer tray as well as a second pitch defined between the target wafer tray and an adjacent underlying one of the wafer tray are larger than a third pitch defined between laminated adjacent two of the wafer trays.    
     
     
         23 . The semiconductor manufacturing apparatus as claimed in  claim 22 , wherein the wafer cassette mechanism is provided in a load lock chamber.  
     
     
         24 . The semiconductor manufacturing apparatus as claimed in  claim 22 , wherein said supporting mechanism further comprises: 
 a driving motor;    an elevation rod connected with the driving motor;    a stacking stage connected through the elevation rod to the driving motor for allowing the wafer trays to be stacked over the stacking stage and    a guide, mechanism supporting the wafer trays and the stacking stage for allowing the wafer trays and the stacking stage to be elevated by a driving force of the driving motor.    
     
     
         25 . The semiconductor manufacturing apparatus as claimed in  claim 22 , wherein the locking mechanism further comprises: 
 at least two sets of locking members provided different in level by the fir&t pitch.    
     
     
         26 . The semiconductor manufacturing apparatus as claimed in  claim 25 , wherein each of said locking members comprises a locking pin.  
     
     
         27 . The semiconductor manufacturing apparatus as claimed in  claim 26 , wherein each of said wafer trays further comprises: 
 body having a flat Lop surface and a flat bottom face and a thickness as well as having a locking hole, into which said locking pin is inserted; and    a contact portion inwardly extending from the body for allowing an edge of semiconductor wafer to be in contact with an upper surface of the contact portion.    
     
     
         28 . The semiconductor manufacturing apparatus as claimed in  claim 27 , wherein the contact portion is tapered.