Conditioner for polishing pads

Abstract

An apparatus and method for conditioning a polishing pad in a polishing system. One embodiment of the apparatus generally includes a movable support member, a conditioner device coupled to the support member, and a first actuator coupled to the support member and adapted to move the conditioner device along a first path. Another embodiment of the apparatus generally includes a platen, a polishing pad supported on the platen, and a conditioner device coupled to a support member and positioned adjacent a region of the polishing pad outside of a substrate polishing area. One embodiment of the method includes raising a conditioner device adjacent to the polishing pad, providing relational movement between the conditioner device and the polishing pad, and lowering the conditioner device away from the polishing pad.

1 . An apparatus for conditioning a polishing pad outside of a substrate polishing area, comprising: 
 a movable support member;    a conditioner device coupled to the support member; and    a first actuator coupled to the support member and adapted to move the conditioner device along a first path.    
     
     
         2 . The apparatus of  claim 1 , further comprising a second actuator coupled to the support member and adapted to move the conditioner device along a second path.  
     
     
         3 . The apparatus of  claim 1 , wherein the conditioner device comprises at least one of a ceramic bar, a brush bar, a diamond abrasive bar, a ceramic roller, a brush roller, a diamond abrasive roller, or a spray bar.  
     
     
         4 . The apparatus of  claim 3 , wherein the conditioner device comprises a spray bar and at least one of a ceramic bar, a brush bar, a diamond abrasive bar, a ceramic roller, a brush roller, or a diamond abrasive roller.  
     
     
         5 . The apparatus of  claim 3 , wherein the spray bar includes at least one spray nozzle.  
     
     
         6 . The apparatus of  claim 5 , wherein the at least one spray nozzle is adapted to be coupled to at least one fluid supply source.  
     
     
         7 . The apparatus of  claim 1 , further comprising a universal holder releasably mounting the conditioner device on the support member, wherein the conditioner device comprises at least one of a ceramic bar, a brush bar, or a diamond abrasive bar.  
     
     
         8 . The apparatus of  claim 1 , further comprising a gimbal device disposed between the support member and the conditioner device.  
     
     
         9 . The apparatus of  claim 1 , further comprising: 
 a support frame; and    the first actuator is a pneumatic cylinder coupled to the support frame and coupled to the movable support member opposite the conditioner device, wherein the pneumatic cylinder is adapted to move the support member up and down.    
     
     
         10 . The apparatus of  claim 1 , further comprising: 
 a support frame having at least one slide;    the moveable support member is disposed on the at least one slide; and    the first actuator is a pneumatic cylinder disposed on the support frame and adapted to move the support member along the slide.    
     
     
         11 . The apparatus of  claim 2 , further comprising: 
 a support frame having at least one slide;    the first actuator is a first pneumatic cylinder disposed on the at least one slide and coupled to the support member opposite the conditioner device, wherein the first pneumatic cylinder is adapted to move the support member up and down; and    the second actuator is a second pneumatic cylinder disposed on the support frame and coupled to the first pneumatic cylinder, wherein he second pneumatic cylinder is adapted to move the first pneumatic cylinder along the slide.    
     
     
         12 . A substrate polishing apparatus, comprising: 
 a rotatable platen;    a polishing pad supported on the platen; and    a conditioner device coupled to a support member and positioned adjacent a region of the polishing pad outside of a substrate polishing area.    
     
     
         13 . The substrate polishing apparatus of  claim 12 , further comprising: 
 a movement device adapted to create relational movement between the conditioner device and the polishing pad, wherein the movement device can move the conditioner device, the polishing pad, or the platen.    
     
     
         14 . The substrate polishing apparatus of  claim 13 , further comprising: 
 a first actuator coupled to the support member and adapted to move the conditioner device along a first path.    
     
     
         15 . The substrate polishing apparatus of  claim 14 , further comprising: 
 a baseplate supporting the platen and having at least one conditioner recess formed therein, wherein the first actuator is adapted to move the conditioner device between a lower disengaged position in which the conditioner device is housed in the recess and an upper engaged position.    
     
     
         16 . The substrate polishing apparatus of  claim 15 , wherein in the lower disengaged position, the conditioner device is sized and positioned below the base of the platen.  
     
     
         17 . The substrate polishing apparatus of  claim 15 , wherein in the upper engaged position, the conditioner device is positioned to contact a region of the polished pad disposed at the end of the platen between a supply roll and a top roll.  
     
     
         18 . The substrate polishing apparatus of  claim 15 , wherein the movement device is a second actuator coupled to the support member and wherein the second actuator is adapted to move the conditioner device along a second path when the first actuator is in the upper engaged position.  
     
     
         19 . The apparatus of  claim 13 , wherein the conditioner device comprises at least a ceramic bar, a brush bar, a diamond abrasive bar, a ceramic roller, a brush roller, a diamond abrasive roller, or a spray bar.  
     
     
         20 . The apparatus of  claim 19 , wherein the conditioner device comprises a spray bar and at least one of a ceramic bar, a brush bar, a diamond abrasive bar, a ceramic roller, a brush roller, or a diamond abrasive roller.  
     
     
         21 . The apparatus of  claim 19 , wherein the spray bar includes at least one spray nozzle fluidly coupled to at least one fluid supply source.  
     
     
         22 . The apparatus of  claim 21 , wherein the at least one fluid supply source comprises a hot fluid supply source.  
     
     
         23 . The apparatus of  claim 21 , wherein the at least one fluid supply source is adapted to provide at least one fluid to the at least one spray nozzle at varying pressures.  
     
     
         24 . The substrate polishing apparatus of  claim 13 , further comprising a controller coupled to the movement device.  
     
     
         25 . The apparatus of  claim 13 , further comprising a backing plate disposed on the platen opposite the conditioner device, wherein the polishing pad is positioned between the conditioner device and the backing plate.  
     
     
         26 . A method of polishing a substrate on a polishing pad supported on a platen, comprising: 
 a) raising a conditioner device adjacent to the polishing pad;    b) providing relational movement between the conditioner device and the polishing pad; and    c) lowering the conditioner device away from the polishing pad.    
     
     
         27 . A method of polishing a substrate on a polishing pad supported on a platen, comprising: 
 a) positioning a conditioner device adjacent a surface of the polishing pad outside of a substrate polishing area; and    b) conditioning the surface of the polishing pad.    
     
     
         28 . The method of  claim 27 , wherein conditioning comprises providing relational movement between the polishing pad and a conditioner device.  
     
     
         29 . The method of  claim 28 , wherein conditioning further comprises moving the conditioner device laterally across the surface of the polishing pad.  
     
     
         30 . The method of  claim 27 , wherein conditioning comprises abrading the surface of the polishing pad with the conditioner device.  
     
     
         31 . The method of  claim 30 , wherein abrading comprises delivering a fluid to the surface of the polishing pad.  
     
     
         32 . The method of  claim 30 , wherein conditioning further comprises delivering a fluid to the surface of the polishing pad.  
     
     
         33 . The method of  claim 28 , further comprising moving the conditioner device away from the polishing pad.