Polishing cloth for and method of texturing a surface

Abstract

A polishing cloth has a base material of a woven cloth formed by weaving in woven bundles of plastic fibers and its surface layer is formed by portions of these woven bundles which are cut and raised from a surface. Such a polishing cloth can be produced by preparing a woven cloth as its base material by weaving in woven bundles of plastic fibers, cutting portions of these woven bundles over a surface of the woven cloth, and forming a surface layer by raising the cut portions of the woven bundles from a surface. When such a polishing cloth is used for texturing a target surface of a disk substrate, the target surface is rubbed by such a cloth while a liquid slurry containing free abrasive particles are supplied to the surface.

What is claimed is:  
     
         1 . A polishing cloth for a texturing process, said polishing cloth comprising: 
 a base material comprising a woven cloth formed by weaving in woven bundles of plastic fibers; and    a surface layer at a surface of said base material formed by portions of said plastic fibers forming said woven bundles which are cut and raised to stand up from said surface.    
     
     
         2 . The polishing cloth of  claim 1  wherein said plastic fibers have thickness 0.01-0.50 deniers.  
     
     
         3 . The polishing cloth of  claim 1  wherein said bundles are woven in both longitudinally and transversely to form said woven cloth.  
     
     
         4 . A method of producing a polishing cloth for a texturing process, said method comprising the steps of: 
 producing a base material comprising a woven cloth by weaving in woven bundles of plastic fibers;    cutting portions of said woven bundles of said plastic fibers over a surface of said woven cloth; and    forming a surface layer of said woven cloth by raising the cut portions of said woven bundles from said surface.    
     
     
         5 . The method of  claim 4  wherein said plastic fibers have thickness 0.01-0.50 deniers.  
     
     
         6 . The method of  claim 4  wherein said bundles are woven in both longitudinally and transversely to form said woven cloth.  
     
     
         7 . The method of  claim 4  wherein the steps of cutting and forming a surface layer are carried out by rotating a roller having spikes thereon near said surface.  
     
     
         8 . A method of texturing a target surface of a magnetic hard disk substrate, said method comprising the steps of: 
 rubbing said target surface with a polishing cloth; and    supplying a liquid slurry containing free abrading particles onto said target surface;    said polishing cloth comprising: 
 a base material comprising a woven cloth formed by weaving in woven bundles of plastic fibers; and  
 a surface layer at a surface of said base material formed by portions of said plastic fibers forming said woven bundles which are cut and raised from said surface.  
   
     
     
         9 . The method of  claim 8  wherein said plastic fibers have thickness 0.01-0.50 deniers.  
     
     
         10 . The method of  claim 8  wherein said bundles are woven in both longitudinally and transversely to form said woven cloth.