Film-forming apparatus, method of cleaning the same, and method of manufacturing a light-emitting device

Abstract

A cleaning method of removing a vapor-deposition material adhering to equipments without exposure to the atmosphere is provided. A vapor-deposition material adhering to equipments (components of a film-forming apparatus) such as a substrate holder, a vapor-deposition mask, a mask holder, or an adhesion preventing shield provided in a film-forming chamber are subjected to heat treatment. Because of this, the adhering vapor-deposition material is re-sublimated, and removed by exhaust through a vacuum pump. By including such a cleaning method in the steps of manufacturing an electro-optical device, the manufacturing steps are shortened, and an electro-optical device with high reliability can be realized.

What is claimed is:  
     
         1 . A film-forming apparatus characterized by having means for irradiating a component provided in a film-forming chamber with at least one selected from the group consisting of infrared light, UV-light, and visible light.  
     
     
         2 . A film-forming apparatus characterized by having a lamp light source for irradiating a component provided in a film-forming chamber with at least one selected from the group consisting of infrared light, UV-light, and visible light.  
     
     
         3 . A film-forming apparatus according to  claim 2 , characterized in that the lamp light source is in a rectangular or oblong shape.  
     
     
         4 . A film-forming apparatus characterized by having means for heating a component provided in a film-forming chamber with radiation heat.  
     
     
         5 . A film-forming apparatus, characterized in that a component provided in a film-forming chamber is equipped with a conductor for heating the component with radiation heat.  
     
     
         6 . A film-forming apparatus according to  claim 1 , characterized in that the component is an adhesion preventing shield.  
     
     
         7 . A film-forming apparatus according to  claim 1 , characterized in that an exhaust treatment chamber is connected to the film-forming chamber.  
     
     
         8 . A film-forming apparatus according to  claim 7 , characterized in that plasma is generated in the exhaust treatment chamber.  
     
     
         9 . A method of cleaning a film-forming apparatus, comprising the steps of: irradiating a component provided in a film-forming chamber with at least one selected from the group consisting of infrared light, UV-light, and visible light, thereby sublimating a vapor-deposition material adhering to the component; and exhausting the sublimated evaporation material.  
     
     
         10 . A method of cleaning according to  claim 9 , characterized in that at least one selected from the group consisting of the infrared light, UV-light, and visible light is radiated by using a lamp light source provided in the film-forming chamber.  
     
     
         11 . A method of cleaning according to  claim 9 , characterized in that an irradiation surface of at least one selected from the group consisting of the infrared light, UV-light, and visible light is in a rectangular or oblong shape.  
     
     
         12 . A method of cleaning according to  claim 9 , characterized in that, in the sublimation step, gas containing a halogen-group element is flowed in the film-forming chamber.  
     
     
         13 . A method of cleaning according to  claim 9 , characterized in that the sublimated vapor-deposition material is exposed to plasma during exhaust.  
     
     
         14 . A method of cleaning according to  claim 13 , characterized in that the plasma is oxygen plasma.  
     
     
         15 . A method of cleaning according to  claim 9 , characterized in that the vapor-deposition material is an organic EL material.  
     
     
         16 . A method of manufacturing an electro-optical device including the method of cleaning of  claim 9 .  
     
     
         17 . A method of manufacturing an electro-optical device including the method of cleaning of  claim 9 .  
     
     
         18 . A film-forming apparatus according to  claim 2 , characterized in that the component is an adhesion preventing shield.  
     
     
         19 . A film-forming apparatus according to  claim 2 , characterized in that an exhaust treatment chamber is connected to the film-forming chamber.  
     
     
         20 . A film-forming, apparatus according to  claim 19 , characterized in that plasma is generated in the exhaust treatment chamber.  
     
     
         21 . A film-forming apparatus according to  claim 4 , characterized in that the component is an adhesion preventing shield.  
     
     
         22 . A film-forming apparatus according to  claim 4 , characterized in that an exhaust treatment chamber is connected to the film-forming chamber.  
     
     
         23 . A film-forming apparatus according to  claim 22 , characterized in that plasma is generated in the exhaust treatment chamber.  
     
     
         24 . A film-forming apparatus according to  claim 5 , characterized in that the component is an adhesion preventing shield.  
     
     
         25 . A film-forming apparatus according to  claim 5 , characterized in that an exhaust treatment chamber is connected to the film-forming chamber.  
     
     
         26 . A film-forming apparatus according to  claim 25 , characterized in that plasma is generated in the exhaust treatment chamber.