US2002009895A1PendingUtilityA1
Fabrication process of solar cell
Priority: Sep 19, 1996Filed: Aug 13, 2001Published: Jan 24, 2002
Est. expirySep 19, 2016(expired)· nominal 20-yr term from priority
Inventors:Shoji Nishida
Y10S438/955Y02E10/547Y02E10/546H10F 10/14H10F 77/164H10F 71/121Y02P70/50
32
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Claims
Abstract
Metal-grade silicon is melted and solidified in a mold to form a plate-shaped silicon layer and a crystalline silicon layer is made thereon, thereby providing a cheap solar cell without a need for a slicing step.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A fabrication process of solar cell comprising a step of forming a silicon layer on a crystalline silicon substrate by a liquid-phase growth method using a metal solvent, wherein a total concentration of impurities of a surface of said crystalline silicon substrate is 10 ppm or more and wherein said metal solvent is indium.
2 . A fabrication process of solar cell according to claim 1 , wherein said liquid-phase growth method is carried out in a hydrogen atmosphere.
3 . A fabrication process of solar cell according to claim 1 or 2 , wherein said crystalline silicon substrate is comprised of metal-grade silicon containing 10 ppm or more of impurities.
4 . A fabrication process of solar cell comprising a step of melting and solidifying particles of metal-grade silicon put in a mold to form a plate-shaped metal-grade silicon substrate, and a step of forming a silicon layer on a surface of said metal-grade silicon substrate by a liquid-phase growth method using indium.
5 . A fabrication process of solar cell according to claim 4 , wherein a material for said mold is selected from the group consisting of carbon graphite, silicon carbide, and silicon nitride.
6 . A fabrication process of solar cell according to claim 4 or 5 , wherein a surface of said mold to be in contact with said metal-grade silicon substrate is coated with a mold releasing agent containing at least silicon nitride.
7 . A fabrication process of solar cell comprising a step of melting and solidifying particles of metal-grade silicon put in a mold to form a plate-shaped metal-grade silicon substrate, a step of dissolving a surface of said metal-grade silicon substrate with a metal solvent and thereafter precipitating silicon in said metal solvent on the surface of said metal-grade silicon substrate to form a first silicon layer, and a step of further forming a second silicon layer on a surface of said first silicon layer by a liquid-phase growth method using indium.
8 . A fabrication process of solar cell according to claim 7 wherein a material for said mold is selected from the group consisting of carbon graphite, silicon carbide, and silicon nitride.
9 . A fabrication process of solar cell according to claim 7 or 8 , wherein a surface of said mold to be in contact with said metal-grade silicon substrate is coated with a mold releasing agent containing at least silicon nitride.
10 . A fabrication process of solar cell according to claim 7 , wherein said first silicon layer is p-type silicon containing 10 ppm to 100 ppm of impurities.
11 . A fabrication process of solar cell according to claim 7 , wherein said metal solvent is selected from the group consisting of indium, gallium, and tin.
12 . A fabrication process of solar cell according to claim 1 , wherein a thickness of said silicon layer is 10 μm or more.
13 . A fabrication process of solar cell according to claim 7 , wherein a thickness of said silicon layer is 10 μm or more.Join the waitlist — get patent alerts
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