Low compliance tester interface

Abstract

Automatic test equipment adapted for testing a plurality of devices-under-test (DUTs) is disclosed. The automatic test equipment includes a mainframe computer and a test head coupled to the mainframe computer. The test head includes a low-profile tester interface having a first interface board and a device board. The device board engages contact points on the DUTs and includes a topside. A hard stop is mounted to the first interface board and defines a reference plane. The hard stop is adapted to engage the device board topside to vertically fix the device board positionally with respect to the first interface board. The automatic test equipment further includes a compliant interconnect array adapted for compression between the first interface board and the device board. The array includes a plurality of elastomeric connectors, each comprising a thin layer of foam material and a plurality of formed contact pins. The pins are embedded in spaced-apart relationship in the foam material. Each of the contact pins includes a substantially straight body of a first thickness and having respective ends bounded by integrally formed and oppositely projecting horizontal tabs. The tabs have respective contact engagement surfaces and are formed with a dimple disposed on the contact engagement surface to provide greater contact engagement reliability.

What is claimed is:  
     
         1 . Automatic test equipment adapted for testing a plurality of device-sunder-test (DUTs), said automatic test equipment including: 
 a mainframe computer; and    a test head coupled to said mainframe computer, said test head including a low-profile tester interface, said low-profile tester interface including    a first interface board,    a device board for engaging contact points on the DUTs, and having a topside,    a hard stop mounted to said first interface board and defining a reference plane, said hard stop adapted to engage said device board topside to vertically fix said device board positionally with respect to said first interface board; and    a compliant interconnect array adapted for compression between said first interface board and said device board, said array including a plurality of elastomeric connectors, each of said connectors comprising    a thin layer of foam material, and    a plurality of formed contact pins embedded in spaced-apart relationship in said foam material, each of said contact pins including a substantially straight body of a first thickness and having respective ends bounded by integrally formed and oppositely projecting horizontal tabs, said tabs having respective contact engagement surfaces and formed with a dimple disposed on said contact engagement surface.    
     
     
         2 . Automatic test equipment according to  claim 1  wherein: 
 said engagement surfaces are formed with chamfered edges.  
 
     
     
         3 . An elastomeric connector for use in an ATE interface, said elastomeric connector comprising: 
 a thin layer of foam material; and    a plurality of formed contact pins embedded in spaced-apart relationship in said foam material, each of said contact pins including a substantially straight body of a first thickness and having respective ends bounded by integrally formed and oppositely projecting horizontal tabs, said tabs having respective contact engagement surfaces and formed with a dimple disposed on said contact engagement surface.    
     
     
         4 . An elastomeric connector according to  claim 3  wherein: 
 said engagement surfaces are formed with chamfered edges.  
 
     
     
         5 . A compliant interconnect array for maintaining electrical connection between opposing arrays of contacts on a prober interface board and a probecard, respectively, said compliant interconnect ring including: 
 a retainer formed with a plurality of spaced-apart windows; and    a plurality of elastomeric connectors, each of said connectors complementally formed to mount within a corresponding window and comprising    a thin layer of foam material; and    a plurality of formed contact pins embedded in spaced-apart relationship in said foam material, each of said contact pins including a substantially straight body of a first thickness and having respective ends bounded by integrally formed and oppositely projecting horizontal tabs, said tabs having respective contact engagement surfaces and formed with a dimple disposed on said contact engagement surface.    
     
     
         6 . A compliant interconnect array according to  claim 5  wherein: 
 said engagement surfaces are formed with chamfered edges.