Method of adhering wafers and wafer adhering device

Abstract

The method and the device of the present invention are capable of uniformly using whole surface of a carrying plate, improving the polishing accuracy of wafers and extending span of life of the carrying plate. The method of adhering a plurality of wafers onto a surface of a carrying plate with predetermined spaces is characterized by regularly shifting wafer adhering positions, at which the wafers are respectively adhered, with respect to a standard position of the carrying plate, in the surface of the carrying plate. The wafer adhering position is regularly shifted when the carrying plate is exchanged or predetermined time elapses.

What is claimed is:  
     
         1 . A method of adhering a plurality of wafers onto a surface of a carrying plate with predetermined spaces, characterized by, 
 regularly shifting wafer adhering positions, at which said wafers are respectively adhered, with respect to a standard position of said carrying plate.    
     
     
         2 . The method according to  claim 1 , 
 wherein said carrying plate is a circular plate, said wafers are initially adhered at initial wafer adhering positions with regular angular spaces, and    wherein the wafer adhering positions are respectively returned to their initial wafer adhering positions when each wafer adhering position reaches the adjacent initial adhering position.    
     
     
         3 . The method according to  claim 1 , 
 wherein the wafer adhering positions are shifted when the carrying plate is exchanged.    
     
     
         4 . The method according to  claim 1 , 
 wherein identification means is provided to said carrying plate, and    wherein the wafer adhering positions are shifted on the basis of stored history of the wafer adhering positions of said carrying plate.    
     
     
         5 . The method according to  claim 1 , 
 wherein the wafer adhering positions are shifted on the basis of number of the wafers polished.    
     
     
         6 . A wafer adhering device for adhering a plurality of wafers onto a surface of a carrying plate with predetermined spaces, comprising: 
 an adhering head positioning the wafers at wafer adhering positions in the surface of said carrying plate, said adhering head pressing the wafers onto said carrying plate;    an adjusting mechanism being capable of adjusting relative positional relationship between said adhering head and said carrying plate;    a mark being provided at a standard position of said carrying plate;    a sensor detecting said mark; and    a control unit detecting the standard position of said carrying plate by said sensor, said control unit controlling said adjusting mechanism so as to regularly shifting the wafer adhering positions with respect to the standard position of said carrying plate.    
     
     
         7 . The wafer adhering device according to  claim 6 , 
 wherein said mark includes an identification code for individually identifying said carrying plate.    
     
     
         8 . The wafer adhering device according to  claim 6 , 
 wherein said adjusting mechanism includes a rotary table for holding and rotating said carrying plate.    
     
     
         9 . A wafer adhering device for adhering a plurality of wafers onto a surface of a carrying plate with predetermined spaces, comprising: 
 an adhering head positioning the wafers at wafer adhering positions in the surface of said carrying plate, said adhering head pressing the wafers onto said carrying plate;    a rotary mechanism including a rotary table for holding and rotating said carrying plate, said rotary mechanism detecting and adjusting relative positional relationship, in the circumferential direction of said carrying plate, between said adhering head and said carrying plate;    a mark being provided at a standard position of said carrying plate;    a plurality of mark detecting means for detecting said mark; and    a control unit detecting the standard position of said carrying plate by one of said mark detecting means, said control unit controlling said rotary mechanism so as to indexing the wafer adhering positions on said carrying plate.    
     
     
         10 . The wafer adhering device according to  claim 9 , wherein even-number of said mark detecting means are symmetrically arranged with respect to said carrying plate.  
     
     
         11 . The wafer adhering device according to  claim 9 , wherein said mark includes an identification code for individually identifying said carrying plate.