Attaratus for socketably receiving interconnection elements of an electronic component

Abstract

Products and assemblies are provided for socketably receiving elongate interconnection elements, such as spring contact elements, extending from electronic components, such as semiconductor devices. Socket substrates are provided with capture pads for receiving ends of elongate interconnection elements extending from electronic components. Various capture pad configurations are disclosed. Connections to external devices are provided via conductive traces adjacent the surface of the socket substrate. The socket substrate may be supported by a support substrate. In a particularly preferred embodiment the capture pads are formed directly on a primary substrate such as a printed circuit board.

What is claimed is:  
     
         1 . An assembly for securing and electrically connecting an electronic component, comprising 
 an electronic component with resilient interconnection elements,    a substrate,    capture pads on the substrate, configured to mate with the resilient interconnection elements of the electronic component, and    a housing connected to secure the electronic component to the substrate.