Component source interchange gantry

Abstract

The present invention is a method and apparatus for automatically storing and replenishing expandable wafers used in component feeders used in automated printed circuit board assembly systems, for example the Hover-Davis Direct Die Feeder (DDF). In the mass production of printed circuit boards automated pick-and-place equipment accepts die from “chip feeders” and then mounts them at a predetermined location on the circuit board. The present invention includes a wafer or tape reel storage bay and a gripping assembly that is moved by a gantry robot to retrieve a wafer or reel from the storage bay and automatically deposit it into a component feeder.

What is claimed is:  
     
         1 . An apparatus for supplying component storage units to a component feeder, comprising: 
 a frame for positioning the apparatus in juxtaposition with the component feeder;    a storage bay located within the confines of said frame for storing a plurality of component storage units therein;    a gripper assembly for gripping one of the plurality of component storage units stored in said storage bay; and    gripper assembly movement means for automatically moving the gripper assembly from a position adjacent the storage bay to a position adjacent the component feeder.    
     
     
         2 . The apparatus of  claim 1 , wherein said gripper assembly includes: 
 a mount for attaching the gripper assembly to the gripper assembly movement means; and    a pair of opposed clamping members for releasably clamping the expandable wafer.    
     
     
         3 . The apparatus of  claim 2 , wherein said mount is a breakaway mount to prevent damage to the gripper assembly or the gripper assembly movement means in the event of interference.  
     
     
         4 . The apparatus of  claim 3 , wherein said breakaway mount includes a pair of magnetized surfaces oriented in opposition to one another, and an alignment mechanism to assure proper alignment of the gripper assembly and the gripper assembly movement means when they are assembled.  
     
     
         5 . The apparatus of  claim 2 , wherein said gripper assembly further includes: 
 a spring for biasing the opposed clamping members toward one another;    an actuator operatively opposed to said spring, wherein the actuator operates to separate the opposed clamping members when actuated; and    a sensor operatively associated with at least one of said clamping members to indicate the presence of an expandable wafer being gripped by the opposed clamping members.    
     
     
         6 . The apparatus of  claim 1 , further including means for moving at least said gripper assembly away from the component feeder so as to allow access to the component feeder.  
     
     
         7 . The apparatus of  claim 6 , wherein said means for moving at least said gripper assembly away from the component feeder includes: 
 at least one pivot point along a first side of said frame so that the apparatus may be swung away from, and thereby allow access to, the component feeder.    
     
     
         8 . The apparatus of  claim 6 , further including: 
 a latch for releasably retaining said frame in an operating position juxtaposed to the component feeder.    
     
     
         9 . The apparatus of  claim 8 , wherein said frame further includes: 
 a frame support for releasably supporting said frame in an operating position juxtaposed to the component feeder.    
     
     
         10 . The apparatus of  claim 1 , further including a user-interface display for depicting at least one indicator as to the status of operation of the system.  
     
     
         11 . The apparatus of  claim 1 , further including a processing station, located within said storage bay, whereby a component storage unit may be automatically placed within said processing station by said gripper assembly.  
     
     
         12 . An apparatus for supplying wafers to a direct die feeder, comprising: 
 a frame for positioning the apparatus in juxtaposition with a direct die feeder;    a wafer bay located within the confines of said frame for storing a plurality of wafers therein;    a gripper assembly for gripping one of the plurality of expandable wafers stored in the wafer bay; and    gripper assembly movement means for moving the gripper assembly from a position adjacent the wafer bay to a position adjacent the direct die feeder.    
     
     
         13 . The apparatus of  claim 12 , wherein said gripper assembly includes: 
 a mount for attaching the gripper assembly to the gripper assembly movement means; and    a pair of opposed clamping members for releasably clamping the expandable wafer.    
     
     
         14 . The apparatus of  claim 13 , wherein said gripper assembly further includes: 
 a spring for biasing the opposed clamping members toward one another;    an actuator (air operated) operatively opposed to said spring, wherein the actuator operates to separate the opposed clamping members when actuated; and    a sensor operatively associated with at least one of said clamping members to indicate the presence of an expandable wafer being gripped by the opposed clamping members.    
     
     
         15 . The apparatus of  claim 12 , further including: 
 means for moving at least said gripper assembly away from the direct die feeder so as to allow access to the direct die feeder and a host to which the direct die feeder is operatively attached; and    a latch associated with said frame for releasably retaining said frame in an operating position juxtaposed to the direct die feeder.    
     
     
         16 . A method for automatically supplying components to a component feeder, comprising the steps of: 
 positioning a collection of component storage units in a bay in juxtaposition with a component feeder;    releasably gripping a component storage unit in the bay; and    moving the component storage unit from a position within the bay to a position adjacent the component feeder to facilitate the automatic insertion of the component storage unit into the feeder for use.    
     
     
         17 . The method of  claim 16 , further comprising the steps of: 
 releasably gripping a component storage unit in the component feeder;    removing the component storage unit from the component feeder;    moving the component storage unit to an open position within the bay; and    inserting the component storage unit into the open position within the bay.    
     
     
         18 . A method for automatically supplying wafers to a direct die feeder, comprising the steps of: 
 positioning a collection of wafers in a wafer bay in juxtaposition with a direct die feeder;    releasably gripping a wafer stored in the wafer bay; and    moving the wafer from a position adjacent the wafer bay to a position adjacent the direct die feeder to facilitate the automatic insertion of the die into the feeder for use.    
     
     
         19 . The method of  claim 18 , further comprising the step of: 
 verifying, subsequent to the step of releasably gripping a wafer stored in the wafer bay, that a wafer has been gripped.    
     
     
         20 . The method of  claim 18 , further comprising the step of: 
 sending a signal to the direct die feeder to indicate that a new wafer is available.