Semiconductor chip having pads with plural different junction type

Abstract

The present invention improves development efficiency and mass production efficiency of a semiconductor chip (LSI). The LSI on which an integrated circuit is formed has plural pad parts connecting the integrated circuit with an external circuit. The pad part is provided with the junction consisting of a window formed in the protective film and the pad exposing from the window, and the junction consisting of a window formed in the protective film and the bump deposited on the pad exposing from the window. When it is required the LSI is connected with an external circuit by wire bonding, the junction is connected with the external circuit through the wire, and when it is required to connect with an external circuit with the TAB method or the COG method, the junction is directly connected to the external circuit.

What is claimed is:  
     
         1 . A semiconductor device comprising: 
 a substrate on which an integrated circuit and a plurality of terminals inputting/outputting a signal to/from the integrated circuit are formed;    a film covering a surface of the substrate over the terminals, said film having a plurality of groups of at least two apertures, each of said groups formed at a position corresponding to each of the terminals;    a plurality of pad connecting with an external circuit, each of said pad parts including at least a first junction being exposed through one aperture so as to be electrically connected with the external circuit via a wire and a second junction provided with conductive material and projecting from another aperture so as to be connected with the external circuit via the conductive material.    
     
     
         2 . A semiconductor device according to  claim 1 , wherein said first junction and said second junction are selectively connected to the external circuit.  
     
     
         3 . A semiconductor chip comprising: 
 a substrate on which an integrated circuit and a plurality of terminals inputting/outputting a signal to/from the integrated circuit are formed;    a film covering a surface of the substrate over the terminals, said film having a plurality of groups of at least two apertures, each of said groups formed at a position corresponding to each of the terminals;    a plurality of pad connecting with an external circuit, each of said pad including at least a first junction structured by exposing the terminal through one aperture and a second junction structured by adding conductive material so as to project through another aperture.    
     
     
         4 . A semiconductor chip according to  claim 3 , is wherein the second junction is arranged near a center of surface of the substrate and the first junction is arranged near a circumference of surface of the substrate.  
     
     
         5 . A semiconductor chip according to  claim 3 , wherein at least one of said pad includes a plurality of the first junctions.  
     
     
         6 . A semiconductor chip according to  claim 3 , wherein at least one of said pad includes a plurality of the second junctions.