Magazine for semiconductor device

Abstract

A magazine 12 for storing a plurality of packaged semiconductor integrated circuit devices 10 , such as BGA packages, having connection terminals 1 located on a lower surface of the package, includes an elongated housing 9 having a pair of opposite end open mouths fitted with a rubber stopper or a bottle stopper. The housing includes a horizontal bottom plate 6 , a pair of first side plates 4 extending from opposite edges of the horizontal bottom plate 6 in an inclined upward direction, a pair of second side plates 5 extending vertically upward from an upper edge of the pair of first side plates 4 , respectively, and a horizontal upper plate 7 bridging an upper edge of the pair of second side plates 5 . The pair of first side plates 4 have an inclined angle α which is necessary and sufficient to ensure that the connection terminals 1 of the semiconductor device 10 never contact with the first side plate 4 and the bottom plate 6 when the semiconductor device 10 is stored in the housing 9.

1 . A semiconductor device magazine for storing therein a semiconductor device having connection terminals formed on a lower surface of the semiconductor device, the semiconductor device magazine comprising a housing for storing said semiconductor device therein, said housing having at least one pair of inclined walls located to support said semiconductor device interposed between said one pair of inclined walls by the fact that opposite edges of said lower surface of said semiconductor device are abutted against the pair of inclined walls, and in such a condition that said connection terminals are in no contact with any internal wall surface of said housing.  
     
     
         2 . A semiconductor device magazine claimed in  claim 1  wherein said housing further includes a pair of vertical walls extending vertically upward from an upper end of said one pair of inclined walls, respectively, said pair of vertical walls being separated from each other by such a distance ensuring that when one end of said semiconductor device becomes in contact with one of said pair of vertical walls, said connection terminals are in no contact with any internal wall surface of said housing.  
     
     
         3 . A semiconductor device magazine claimed in  claim 2  wherein said housing further includes a first horizontal wall coupling between a lower end of said one pair of inclined walls and a second horizontal wall coupling between an upper end of said pair of vertical walls, said first horizontal wall being separated from said second horizontal wall by such a distance ensuring that when said semiconductor device becomes in contact with said first horizontal wall, said connection terminals are in no contact with any internal wall surface of said housing.  
     
     
         4 . A semiconductor device magazine claimed in  claim 1  wherein said housing includes a second pair of inclined walls which are respectively located at positions corresponding to opposite ends of said semiconductor device stored in said housing and which are respectively inclined in directions opposite to respective inclined directions of said one pair of inclined walls.  
     
     
         5 . A semiconductor device magazine claimed in  claim 4  wherein at the respective positions corresponding to the opposite ends of said semiconductor device stored in said housing, said second pair of inclined walls are coupled directly to said one pair of inclined walls, respectively.  
     
     
         6 . A semiconductor device magazine claimed in  claim 4  wherein at the respective positions corresponding to the opposite ends of said semiconductor device stored in said housing, said second pair of inclined walls are coupled to said one pair of inclined walls by a pair of vertical walls, respectively.  
     
     
         7 . A semiconductor device magazine claimed in  claim 4  wherein said housing further includes a first horizontal wall coupling between a lower end of said one pair of inclined walls and a second horizontal wall coupling between an upper end of said second pair of inclined walls.  
     
     
         8 . A semiconductor device magazine claimed in  claim 5  wherein said housing further includes a first horizontal wall coupling between a lower end of said one pair of inclined walls and a second horizontal wall coupling between an upper end of said second pair of inclined walls.  
     
     
         9 . A semiconductor device magazine claimed in  claim 6  wherein said housing further includes a first horizontal wall coupling between a lower end of said one pair of inclined walls and a second horizontal wall coupling between an upper end of said second pair of inclined walls.  
     
     
         10 . A semiconductor device magazine claimed in  claim 1  wherein each of said inclined walls has an inclined angle of not less than 45 degrees.  
     
     
         11 . A semiconductor device magazine claimed in  claim 2  wherein each of said inclined walls has an inclined angle of not less than 45 degrees.  
     
     
         12 . A semiconductor device magazine claimed in  claim 3  wherein each of said inclined walls has an inclined angle of not less than 45 degrees.  
     
     
         13 . A semiconductor device magazine claimed in  claim 4  wherein each of said inclined walls has an inclined angle of not less than 45 degrees.  
     
     
         14 . A semiconductor device magazine claimed in  claim 5  wherein each of said inclined walls has an inclined angle of not less than 45 degrees.  
     
     
         15 . A semiconductor device magazine claimed in  claim 6  wherein each of said inclined walls has an inclined angle of not less than 45 degrees.  
     
     
         16 . A semiconductor device magazine claimed in  claim 7  wherein each of said inclined walls has an inclined angle of not less than 45 degrees.  
     
     
         17 . A semiconductor device magazine claimed in  claim 8  wherein each of said inclined walls has an inclined angle of not less than 45 degrees.  
     
     
         18 . A semiconductor device magazine claimed in  claim 9  wherein each of said inclined walls has an inclined angle of not less than 45 degrees.  
     
     
         19 . A semiconductor device magazine claimed in  claim 2  wherein said housing is formed of polystrene or polyvinyl chloride.  
     
     
         20 . A semiconductor device magazine claimed in  claim 4  wherein said housing is formed of polystrene or polyvinyl chloride.