US2002001981A1PendingUtilityA1

Method and apparatus for protecting and strengthening electrical contact interfaces

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Priority: Jul 3, 2000Filed: Dec 29, 2000Published: Jan 3, 2002
Est. expiryJul 3, 2020(expired)· nominal 20-yr term from priority
Inventors:E. C. Ong
Y10T29/49149Y10T29/49144H05K 2203/025H05K 2201/0379H05K 3/3436H05K 2201/10977H10W 72/9415H10W 72/07251H10W 72/5522H10W 72/01331H10W 72/01225H10W 72/923H10W 72/252H10W 72/244H10W 72/90H10W 72/20H10W 72/012H10W 90/701H10W 72/0198H10W 70/093H10W 72/019Y02P70/50
34
PatentIndex Score
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Cited by
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References
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Claims

Abstract

A method for providing electrical contact to pads on a surface of a device involves steps of adding a first contact extension to individual ones of the pads, covering the pads and contact extensions with a layer of protective material, removing a portion of the layer of protective material such that a portion of each of the contact extensions is exposed, and applying a second contact extension to individual ones of the exposed first contact extensions. The first extensions may be any of several different kinds, including wires or solder balls, and the protective material layer provides both protection from environmental effects and added lateral strength for the connection of the first extensions to the contact pads.

Claims

exact text as granted — not AI-modified
What is claimed is:  
     
         1 . A method for providing electrical contact to pads on a surface of a device, comprising the steps of: 
 (a) adding a first contact extension to individual ones of the pads;    (b) covering the pads and contact extensions with a layer of protective material;    (c) removing a portion of the layer of protective material such that a portion of each of the contact extensions is exposed; and    (d) applying a second contact extension to individual ones of the exposed first contact extensions.    
     
     
         2 . The method of  claim 1  wherein the first contact extensions are one of solder or wire extensions.  
     
     
         3 . The method of  claim 1  wherein, in step (b) the protective material is applied by one of screening, spraying, dispense and spinning, or injection into a mold.  
     
     
         4 . The method of  claim 1  wherein, in step (c), removal is by one of physical machining or etching.  
     
     
         5 . The method of  claim 1  wherein, in step (d), the second extension is of the same material as the first extension, and a contiguous interface is provided.  
     
     
         6 . The method of  claim 1  wherein the first extension is a solder ball, providing a ball-grid array (BGA).  
     
     
         7 . The method of  claim 6  wherein the second extension is also a solder ball.  
     
     
         8 . An electrical contact system, comprising: 
 a first surface of a device having electrical contact pads;    a first contact extension bonded to individual ones of the pads at a first interface;    a layer of protective material encapsulating the first interfaces and at least a portion of the first extensions; and    a second contact extension bonded to individual ones of the first contact extensions.    
     
     
         9 . The system of  claim 8  wherein the first contact extensions are one of solder or wire extensions.  
     
     
         10 . The system of  claim 8  wherein the protective material is a polymer material.  
     
     
         11 . The system of  claim 8  wherein the second extension is of the same material as the first extension, and a contiguous interface is provided.  
     
     
         12 . The system of  claim 8  wherein the first extension is a solder ball, providing a ball-grid array (BGA).  
     
     
         13 . The system of  claim 12  wherein the second extension is also a solder ball.

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