Method of fabrication of a microstructure having an internal cavity
Abstract
The present invention relates to a method of fabricating a microstructure having an inside cavity comprising the steps of: depositing a first layer or a first stack of layers in a substantially closed geometric configuration on a first substrate; performing an indent on the first layer or on the top layer of said first stack of layers; depositing a second layer or a second stack of layers substantially with said substantially closed geometric configuration on a second substrate; aligning and bonding said first substrate on said second substrate such that a microstructure having a cavity is formed according to said closed geometry configuration.
Claims
exact text as granted — not AI-modified1 . A microstructure including a sealed cavity, wherein said cavity is defined by walls according to a closed geometric configuration between two substrates, said walls being a stack of layers comprising at least the first metallization layer, a reflowed solder layer, and a second metallization layer.
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