US2002000649A1PendingUtilityA1

Method of fabrication of a microstructure having an internal cavity

Priority: Apr 17, 1998Filed: Aug 7, 2001Published: Jan 3, 2002
Est. expiryApr 17, 2018(expired)· nominal 20-yr term from priority
H10W 72/07251H10W 72/20H10W 95/00H10W 76/60B81C 1/00293H01H 1/0036B81B 7/0077G01L 9/0042H01H 35/14H03H 9/1057G01P 15/125G01J 5/045G01P 15/0802G01L 9/0073
34
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

The present invention relates to a method of fabricating a microstructure having an inside cavity comprising the steps of: depositing a first layer or a first stack of layers in a substantially closed geometric configuration on a first substrate; performing an indent on the first layer or on the top layer of said first stack of layers; depositing a second layer or a second stack of layers substantially with said substantially closed geometric configuration on a second substrate; aligning and bonding said first substrate on said second substrate such that a microstructure having a cavity is formed according to said closed geometry configuration.

Claims

exact text as granted — not AI-modified
1 . A microstructure including a sealed cavity, wherein said cavity is defined by walls according to a closed geometric configuration between two substrates, said walls being a stack of layers comprising at least the first metallization layer, a reflowed solder layer, and a second metallization layer.

Join the waitlist — get patent alerts

Track US2002000649A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.