The dome: shape and temperature controlled surfaces

Abstract

The present invention provides an HDP-CVD tool using simultaneous deposition and sputtering of doped and undoped silicon dioxide capable of excellent gap fill and blanket film deposition on wafers. The tool of the present invention includes: a dual RF zone inductively coupled plasma source; a dual zone gas distribution system; temperature controlled surfaces within the tool; a symmetrically shaped turbomolecular pumped chamber body; a dual cooling zone electrostatic chuck; an all ceramic/aluminum alloy chamber; and a remote plasma chamber cleaning system.

What is claimed is:  
     
         1 . An apparatus for processing substrates, comprising: 
 (a) a chamber having: 
 (i) a sidewall;  
 (ii) a lid disposed at one end of the sidewall; and  
 (iii) a bottom disposed at the opposite end of the sidewall;  
   (b) a substrate support member cantilever mounted on the sidewall;    (c) one or more gas inlets disposed through one or more of the sidewall and the lid to admit gas into the chamber;    (d) one or more gas inlets disposed through one or more of the sidewall and the lid to admit one or more cleaning gases into the chamber; and    (e) an exhaust port disposed in the bottom of the chamber.    
     
     
         2 . The apparatus of  claim 1  wherein the lid comprises a dome comprised of a dielectric material.  
     
     
         3 . The apparatus of  claim 2  wherein the dome comprises a material selected from the group consisting of Al 2 O 3 , AlN, SiO 2  or combinations thereof.  
     
     
         4 . The apparatus of  claim 3  wherein the dome further comprises a generally annular sidewall and a generally planar top.  
     
     
         5 . The apparatus of  claim 2  further comprising a heat transfer assembly disposed adjacent to the lid.  
     
     
         6 . The apparatus of  claim 5  wherein the heat transfer assembly comprises one or more heat transfer plates.  
     
     
         7 . The apparatus of  claim 6  wherein the one or more heat transfer plates comprise a heating plate and a cooling plate.  
     
     
         8 . The apparatus of  claim 7  wherein the heating and cooling plates are comprised of a thermally conductive material.  
     
     
         9 . The apparatus of  claim 8  wherein the thermally conductive material is selected from the group consisting of AlN, SiN, Al or combinations thereof.  
     
     
         10 . The apparatus of  claim 9  wherein the heating plate includes a resistive heating element disposed therein.  
     
     
         11 . The apparatus of  claim 10  wherein the cooling plate includes one or more fluid passages disposed therein.  
     
     
         12 . The apparatus of  claim 11  wherein a heat conducting member is disposed between the heating plate and the cooling plate.  
     
     
         13 . The apparatus of  claim 12  wherein the heat conducting member comprises a heat transfer material such as grafoil, chromerics, or combinations thereof.  
     
     
         14 . The apparatus of  claim 13  wherein the heat conducting member comprises one or more pucks disposed between the heating and cooling plates.