Manufacturing method and plating apparatus for film carrier tape

Abstract

Embodiments include a manufacturing method and a plating apparatus for film carrier tapes, in which the plating process does not cause hollowed-out portions in a copper foil at end sections of the solder resist or of the adhesive. A plating apparatus 44 is formed from a first plating bath 46 , a second plating bath 48 and a transfer path 54 . Plating liquid 60 in the first plating bath 46 is set to a liquid temperature level lower than that of the plating liquid 60 in the second plating bath 48 . The transfer path 54 is formed from sprockets that can transfer the film carrier tape 20 . In the plating apparatus 44 thus constructed, the deposition amount is small in the first plating bath 46 , and therefore a plated layer may be uniformly formed on exposed portions. After a plated layer is formed, the film carrier tape 20 is brought in the second plating bath 48 to form a new plated layer over the plated layer that has been formed. As a result, a uniform plated layer having a sufficient thickness can be formed on the exposed portions.

What is claimed:  
     
         1 . A method for manufacturing a film carrier tape in which a wiring pattern is formed on a flexible substrate, the method comprising the steps of: dipping the film carrier tape in a first temperature plating liquid to form a plated layer in an exposed portion of the wiring pattern by a substitution reaction; and then dipping the film carrier tape in a second temperature plating liquid having a higher temperature than the first temperature plating liquid, to increase the thickness of the plated layer.  
     
     
         2 . A method for manufacturing a film carrier tape in which a wiring pattern is formed on an elongated flexible substrate, the method comprising the steps of: transferring the film carrier tape in a longitudinal direction thereof; dipping the film carrier tape in a first temperature plating liquid to form a plated layer in an exposed portion of the wiring pattern by a substitution reaction; and then dipping the film carrier tape in a second temperature plating liquid to increase the thickness of the plated layer, wherein the second temperature plating liquid has a higher temperature than the first temperature plating liquid.  
     
     
         3 . A method for manufacturing a film carrier tape according to    claim 1   , wherein the exposed portion defines at least one of an input terminal and an inner lead.  
     
     
         4 . A method for manufacturing a film carrier tape according to    claim 2   , wherein the exposed portion defines at least one of an input terminal and an inner lead.  
     
     
         5 . A method for manufacturing a film carrier tape according to    claim 1   , wherein the plated layer comprises tin.  
     
     
         6 . A method for manufacturing a film carrier tape according to    claim 2   , wherein the plated layer comprises tin.  
     
     
         7 . A method for manufacturing a film carrier tape according to    claim 3   , wherein the plated layer comprises tin.  
     
     
         8 . A method for manufacturing a film carrier tape according to    claim 4   , wherein the plated layer comprises tin.  
     
     
         9 . A method for manufacturing a film carrier tape according to    claim 1   , wherein the first temperature plating liquid is set at a temperature of 10-40° C. and the second temperature plating liquid is set at a temperature of 65-70° C.  
     
     
         10 . A method for manufacturing a film carrier tape according to    claim 2   , wherein the first temperature plating liquid is set at a temperature of 10-40° C. and the second temperature plating liquid is set at a temperature of 65-70° C.  
     
     
         11 . A method for manufacturing a film carrier tape according to    claim 5   , wherein the first temperature plating liquid is set at a temperature of 10-40° C. and the second temperature plating liquid is set at a temperature of 65-70° C.  
     
     
         12 . A method for manufacturing a film carrier tape according to    claim 6   , wherein the first temperature plating liquid is set at a temperature of 10-40° C. and the second temperature plating liquid is set at a temperature of 65-70° C.  
     
     
         13 . A plating apparatus comprising a first plating bath containing a plating liquid at a first temperature level, a second plating bath containing a plating liquid at a second temperature level that is higher than the first temperature level, and a transfer path for a film carrier tape in which a wiring pattern is formed on an elongated flexible substrate, wherein the transfer path passes through the first plating bath and the second plating bath.  
     
     
         14 . The method of    claim 1   , wherein the first temperature plating liquid has the same composition as the second temperature plating liquid.  
     
     
         15 . The method of    claim 2   , wherein the first temperature plating liquid has the same composition as the second temperature plating liquid.  
     
     
         16 . The apparatus of    claim 13   , wherein the first plating bath has the same composition as the second plating bath.  
     
     
         17 . A plating apparatus comprising: 
 means for delivering a film carrier tape to a first plating bath at a first temperature along a transfer path; and    means for delivering the film carrier tape along the transfer path to a second plating bath at a second temperature that is higher than the first temperature;    wherein the first plating bath and the second plating bath have the same composition.    
     
     
         18 . The plating apparatus of    claim 17   , wherein the first plating bath comprises tin.  
     
     
         19 . The plating apparatus of    claim 17   , wherein the first plating bath is at a temperature in the range of about 10° C. to about 40° C. and the second plating bath is at a temperature in the range of about 65° C. to about 70° C.