Polishing pad of a polyurethane of propane diol

Abstract

This invention is directed to a polishing pad for chemical mechanical polishing of substrates, for example, the surface of electrical devices such as semiconductors or other substrates; wherein the pad comprises a polyurethane that is the reaction product of an organic polyisocyanate and 1,3 propane diol; preferably, the pad has a porous structure and more preferably has a microporous structure.

What is claimed is:  
     
         1 . A polishing pad for chemical mechanical polishing substrates; 
 wherein the pad comprises a polyurethane comprising the reaction product of an organic polyisocyanate and 1,3 propane diol.    
     
     
         2 . The polishing pad of    claim 1    wherein the polyurethane has a porous structure.  
     
     
         3 . The polishing pad of    claim 2    wherein the polyurethane has a microporous structure.  
     
     
         4 . The polishing pad of    claim 1    in which the polyurethane consists essentially of the reaction product of an aromatic diisocyanate and 1,3 propane diol.  
     
     
         5 . The polishing pad of    claim 2    in which the polyurethane consists essentially of an isocyanate terminated polyurethane prepolymer of an organic diisocyanate and a diol and chain extended with 1,3 propane diol.  
     
     
         6 . The polishing pad of    claim 5    in which the isocyanate terminated prepolymer consists of the reaction product of an aromatic diisocyanate and 1,3 propane diol.  
     
     
         7 . The polishing pad of    claim 2    in which the polyurethane consists essentially of an isocyanate terminated prepolymer of an aromatic diisocyanate and 1,3 propane diol that is chain extended with a compound selected from the group of dihydroxy terminated organic compound, a diamine and a hydroxy/amine terminated organic compound.  
     
     
         8 . The polishing pad of    claim 2    in which the polyurethane consist essentially of the reaction product of methylene bis (4 phenyl isocyanate) and a mixture of 1,3 propane diol and polybutylene adipate.  
     
     
         9 . The polishing pad of    claim 2    for polishing and planarizing the surface of electrical devices in which the polyurethane consists of the reaction product of an aromatic diisocyanate, 1,3 propane diol chain extended with a diamine.  
     
     
         10 . The polishing pad of    claim 2    for polishing and planarizing the surface of electrical devices in which the polyurethane consists of the reaction product of an aromatic diisocyanate, 1,3 propane diol and an ester and is chain extended with a diamine.  
     
     
         11 . A process for chemical mechanical polishing of substrates which comprises contacting the substrate with a polishing pad and having a polishing slurry at the interface of the substrate and the polishing pad; 
 wherein the pad is formed from a polyurethane comprising the reaction product of an organic polyisocyanate and 1,3 propane diol.