Chemical-mechanical polishing apparatus with megasonic energy slurry supply system

Abstract

An apparatus for chemical-mechanical polishing is disclosed. The apparatus includes the following elements. A pump is used for forcing slurry to be flown inward to receive the slurry from a supply reservoir. A first pipe having a first end, is coupled to an outlet of the forcing means through which the forced slurry flows therein. A megasonic generator coupled in approximately midway of the first pipe and surrounded the first pipe, is used for generating megasonic wave. A second pipe, coupled to a second end of the first pipe, is used for conducting the slurry and then exhausting the slurry through an outlet of the second pipe. A polishing pad, onto that the slurry from the second pipe is dropped, is fixed on a polishing table. The polishing table underlying the polishing pad is used for supporting the polishing pad. A wafer holder, located above the polishing pad, is used for fixing the wafer to the wafer holder while in rotational movement with respect to the polishing pad.

What is claimed is:  
     
         1 . A chemical-mechanical polishing apparatus, comprising: 
 means for forcing slurry to be flown inward to receive the slurry from a supply reservoir;    a first pipe having a first end coupled to an outlet of said forcing means through which the forced slurry flows therein, wherein said first pipe has an interior passage way configured to conduct the slurry;    means for generating sonic wave, coupled in approximately midway of said first pipe and surrounded said first pipe, therefore said generated sonic wave transmitting into and affecting the slurry in the interior passage way of said first pipe, thereby grain size of the affected slurry is made small enough or the grains of the affected slurry are prevented from being aggregated, thereby improving the polishing of the chemical-mechanical polishing apparatus;    a second pipe, coupled to a second end of said first pipe, for further conducting the slurry and then exhausting the slurry through an outlet of said second pipe;    a polishing pad onto which the slurry from said second pipe is dropped, wherein said polishing pad is located under the outlet of said second pipe, therefore a wafer under polishing and said polishing pad are in rotational contact such that the dropped slurry facilitates the polishing of the chemical-mechanical polishing apparatus;    a polishing table underlying said polishing pad for supporting said polishing pad; and    a wafer holder, located above said polishing pad, for fixing the wafer to said wafer holder while in rotational movement with respect to said polishing pad.    
     
     
         2 . The apparatus according to    claim 1   , wherein said forcing means includes a pump.  
     
     
         3 . The apparatus according to    claim 2   , wherein said pump includes a peristalsis pump.  
     
     
         4 . The apparatus according to    claim 1   , wherein said generating means includes a megasonic generator.  
     
     
         5 . The apparatus according to    claim 1   , wherein said polishing table includes a rotary polishing table.  
     
     
         6 . The apparatus according to    claim 1   , wherein said wafer holder includes a rotary wafer holder.  
     
     
         7 . A slurry supply system for chemical-mechanical polishing (CMP), comprising: 
 means for forcing slurry to be flown inward to receive the slurry from a supply reservoir;    a first pipe having a first end coupled to an outlet of said forcing means through which the forced slurry flows therein, wherein said first pipe has an interior passage way configured to conduct the slurry;    means for generating sonic wave, coupled in approximately midway of said first pipe and surrounded said first pipe, therefore said generated sonic wave transmitting into and affecting the slurry in the interior passage way of said first pipe, thereby grain size of the affected slurry is made small enough or the grains of the affected slurry are prevented from being aggregated, thereby improving the polishing of the chemical-mechanical polishing apparatus;    a second pipe, coupled to a second end of said first pipe, for further conducting the slurry and then exhausting the slurry through an outlet of said second pipe;    
     
     
         8 . The apparatus according to    claim 7   , wherein said forcing means includes a pump.  
     
     
         9 . The apparatus according to    claim 7   , wherein said pump includes a peristalsis pump.  
     
     
         10 . The apparatus according to    claim 7   , wherein said generating and transmitting means includes a megasonic generator.