Producing apparatus of film with through-holes

Abstract

A method for producing a film with through-holes includes using an apparatus having a pair of stretching rollers which sandwich a film therebetween and stretch the film. The producing apparatus further includes a pair of punching rollers which sandwich the film therebetween and punch through-holes in the film. The stretching rollers and the punching rollers are disposed so that the film stretched by the stretching rollers are fed to the punching rollers. The method includes stretching the film by means of the stretching rollers and punching through-holes in the film.

What is claimed is:  
     
         1 . A method for producing a film with through-holes using a film producing apparatus comprising: 
 a pair of stretching rollers which sandwich a film therebetween and stretch said film in at least one direction; and    a pair of punching rollers at least one of which has projections formed on an outer surface thereof, which sandwich said film therebetween and punch through-holes in said film; and    said stretching rollers and said punching rollers are disposed so that said film stretched by said stretching rollers are fed to said punching rollers;    said method comprising: 
 stretching said film by means of said stretching rollers; and  
 punching through-holes in said film.  
   
     
     
         2 . The method according to    claim 1   , wherein said film is made of shape memory resin.  
     
     
         3 . The method according to    claim 2   , wherein in said stretching, said film is heated to a temperature above a shape providing temperature of said shape memory resin.  
     
     
         4 . The method according to    claim 2   , wherein in said punching, said film is heated to a temperature above a glass transition temperature of said shape memory resin.  
     
     
         5 . The method according to    claim 2   , further comprising cooling said film below a shape providing temperature of said shape memory resin, after said stretching.  
     
     
         6 . The method according to    claim 1   , wherein said glass transition temperature of said shape memory resin is below said shape providing temperature, and wherein said punching comprises: 
 punching through-holes in said unpunched shape memory resin film while heating said shape memory resin film to a temperature above a glass transition temperature but below said shape providing temperature of said shape memory resin.