Frame for semiconductor package

Abstract

A frame F for semiconductor package has die-pads 3 supported with suspending leads 2 of individual lead frames 10. Semiconductor devices are arranged on die-pads 3. These semiconductor devices are collectively molded with molding compounds, and then the collectively molded semiconductor packages are cut into individual packages by means of dicing saw. In the frame F, suspending leads are formed into fish tails, wherein at least one of longitudinal grid-lead and transverse grid-lead is eliminated within areas enclosed with fish tails of the suspending leads 2. Accordingly, whether R-shape generated by producing frame for semiconductor package by etching process is large or small, to exist metal piece at edges of semiconductor packages in dicing becomes almost nothing.

What is claimed is:  
     
         1 . A frame for semiconductor package comprising plural lead frames arranged in matrix through grid-leads, in which individual semiconductor devices are mounted on die-pads supported with suspending leads of the individual lead frames, respectively, the semiconductor devices are collectively molded with molding compound and the collectively molded semiconductor devices are cut at grid-leads by means of dicing saw to obtain individual semiconductor packages, wherein the suspending leads are formed into fish tails and at least one of longitudinal grid-lead and transverse grid-lead is eliminated within areas enclosed with fish tails of the suspending leads.