Semiconductor device and semiconductor assembly apparatus for semiconductor device

Abstract

In a semiconductor device, a plurality of linear semiconductors of a predetermined length, on which electronic element are formed, are aligned laterally and in parallel. A semiconductor assembly apparatus for assembling the semiconductor device, aligns the linear semiconductors in parallel via an arranging member. The linear semiconductors are interconnected by a connecting member in the semiconductor assembly apparatus.

1 . A semiconductor device comprising: 
 a plurality of linear semiconductors of a predetermined length that are aligned laterally and in parallel, at least one electronic element being formed on an outer surface of said linear semiconductors.    
     
     
         2 . The semiconductor device of    claim 1   , wherein ends of said linear semiconductors are aligned in a square matrix arrangement.  
     
     
         3 . The semiconductor device of    claim 1   , wherein ends of said linear semiconductors are aligned in a 60 degrees rhombic arrangement.  
     
     
         4 . The semiconductor device of    claim 1   , wherein said linear semiconductors are electrically interconnected.  
     
     
         5 . The semiconductor device of    claim 1   , wherein each of said linear semiconductors comprises at least one projection electrode fixed to and electrically connected with a corresponding projection electrode of an adjacent linear semiconductor.  
     
     
         6 . A semiconductor assembly apparatus that assembles said semiconductor device of    claim 1   , comprising: 
 an arrangement member that aligns said plurality of linear semiconductors laterally and in parallel; and    a connecting member that interconnects said linear semiconductors aligned by said arranging member.    
     
     
         7 . The semiconductor assembly apparatus of    claim 6   , wherein said arrangement member arranges ends of said linear semiconductors in a square matrix arrangement.  
     
     
         8 . The semiconductor assembly apparatus of    claim 6   , wherein said arrangement member arranges ends of said linear semiconductors in a 60 degrees rhombic arrangement.  
     
     
         9 . The semiconductor assembly apparatus of    claim 6   , wherein said arrangement member includes an alignment member that securely positions said linear semiconductors.  
     
     
         10 . The semiconductor assembly apparatus of    claim 9   , wherein said connecting member electrically interconnects said linear semiconductors when heated, and said arrangement member is liquefied when heated.  
     
     
         11 . The semiconductor assembly apparatus of    claim 9   , wherein said arrangement member includes longitudinal rhomboid cross-section members and connecting members connecting adjacent longitudinal members.  
     
     
         12 . The semiconductor assembly apparatus of    claim 11   , wherein side surfaces of said longitudinal members contact said outer surface of said linear semiconductors.  
     
     
         13 . The semiconductor assembly apparatus of    claim 11   , wherein said connecting member is provided with holes that receive and engage projection electrodes formed on said outer surface of said linear semiconductors.  
     
     
         14 . The semiconductor device of    claim 1   , further comprising a coolant fluid that flows adjacent to said linear semiconductors so as to cooling said liear semiconductors.