Methods and apparatus for handling packaged IC's

Abstract

Apparatus and methods are provided for handling packaged integrated circuits (IC's), particularly for inserting packaged IC's in and removing packaged IC's from low-insertion-force (LIF) sockets. The apparatus includes a precisor having a chip precisor feature for receiving an IC package and a socket precisor feature for receiving a socket in a predetermined alignment relative to the chip precisor feature. One or more releasable chip retainers are provided, such as a vacuum nozzle for pulling the packaged IC into a seated position within the chip precisor feature and a pair of gripper fingers for holding the packaged IC within the chip precisor feature during extraction from a LIF socket. A method of inserting a packaged IC into a socket comprises centering a precisor relative to an expected location of a packaged integrated circuit, moving the precisor to a predetermined height relative to the expected location, applying vacuum to a nozzle so that a packaged IC is pulled into a chip precising feature of the precisor, centering the precisor relative to a socket, and moving the precisor into a seated position on the socket in which the packaged IC is aligned with and inserted into the socket. A method of removing a packaged IC from a socket comprises positioning a precisor relative to a socket containing a packaged IC, moving the precisor into a seated position on the socket in which the packaged IC is seated in a chip precising feature of the precisor, closing a gripper to retain the packaged IC within the chip precising feature, and moving the precisor away from the seated position while retaining the packaged IC within the chip precising feature.

1 . Apparatus for handling packaged integrated circuits, comprising: 
 a. a chip precisor feature ( 860 ,  865 ,  870 ) for receiving an IC package;    b. a socket precisor feature ( 820 ,  825 ,  830 ,  835 ) for receiving a socket in a predetermined alignment relative to the chip precisor feature; and    c. a releasable chip retainer ( 842 ,  844 / 870 ) for retaining an IC package within the chip precisor feature.    
     
     
         2 . The apparatus of    claim 1   , wherein the chip precisor feature comprises a well defined by a surface ( 860 ) and a pair of opposed ridges ( 865 ,  870 ) for capturing an IC package in a repeatable position relative to the socket precisor feature.  
     
     
         3 . The apparatus of    claim 1   , wherein the socket precisor feature comprises at least one chamfered wall ( 840 ,  845 ,  850 ,  855 ,  860 ) for aligning the socket precisor feature with a socket as a socket is received in the socket precisor feature.  
     
     
         4 . The apparatus of    claim 1   , wherein the releasable chip retainer comprises a member ( 842 ,  844 ) having an orifice to which vacuum is applied to retain an IC package against the member.  
     
     
         5 . The apparatus of    claim 4   , wherein the member ( 842 ,  844 ) is mounted for movement relative to the chip precisor feature so that, when vacuum is applied to retain an IC package against the member, the IC package is displaced toward the chip precisor feature.  
     
     
         6 . The apparatus of    claim 1   , wherein the releasable chip retainer comprises at least one displaceable gripper finger  470  for retaining an IC package in position relative to the chip precisor feature.  
     
     
         7 . The apparatus of    claim 1   , wherein the chip precisor feature and the socket precisor feature comprise features of a handler head ( 420 ) and wherein the apparatus further comprises at least one servo ( 402 ,  404 ,  406 ) for displacing the handler head relative to a socket ( 440 ).  
     
     
         8 . The apparatus of    claim 7   , further comprising a flexible mount ( 455 ) for coupling the handler head to said at least one servo such that the socket precisor feature is able to align itself to receive a socket as the head is displaced toward the socket.  
     
     
         9 . The apparatus of    claim 1   , further comprising at least one active member ( 870 ) for aligning an IC package within the chip precising feature.  
     
     
         10 . A method of inserting a packaged IC into a socket, comprising: 
 a. centering a precisor ( 480 ) relative to an expected location of a packaged integrated circuit;    b. moving the precisor to a predetermined height relative to the expected location;    c. applying vacuum to a nozzle ( 484 ), causing a packaged IC to be pulled into a chip precising feature of the precisor;    d. centering the precisor relative to a socket; and    e. moving the precisor into a seated position on the socket in which the packaged IC is aligned with and inserted into the socket.    
     
     
         11 . The method of    claim 10   , further comprising the steps of removing vacuum from the nozzle and moving the precisor away from the socket.  
     
     
         12 . The method of    claim 10   , further comprising the step of detecting when the precisor is seated on the socket.  
     
     
         13 . The method of    claim 10   , further comprising the step of closing a gripper to move the packaged IC into an aligned position within the chip precising feature.  
     
     
         14 . A method of extracting a packaged IC from a socket, comprising 
 a. positioning a precisor relative to a socket containing a packaged IC;    b. moving the precisor into a seated position on the socket in which the packaged IC is seated in a chip precising feature of the precisor;    c. closing a gripper to retain the packaged IC within the chip precising feature; and    d. moving the precisor away from the seated position while retaining the packaged IC within the chip precising feature.    
     
     
         15 . The method of    claim 14   , further comprising the step of detecting when the precisor is seated on the socket.  
     
     
         16 . The method of    claim 14   , further comprising the step of applying vacuum to an orifice in communication with the packaged IC to verify presence of a packaged IC within the chip precising feature.  
     
     
         17 . The method of    claim 14   , further comprising the step of applying vacuum to an orifice in communication with the packaged IC to retain the packaged IC within the chip precising feature.  
     
     
         18 . The method of    claim 17   , further comprising the step of opening the gripper after applying vacuum to retain the packaged IC within the chip precising feature.  
     
     
         19 . The method of    claim 18   , further comprising the steps of: positioning the precisor over a location where the packaged IC is to be deposited; and removing vacuum to allow the packaged IC to separate from the chip precising feature.