Electromagnetic interference cover for an electronics module, method of manufacture therefore and an electronic equipment chassis employing the same

Abstract

The present invention provides an electromagnetic interference (EMI) module cover for use in an electronics module that is configured to house electrical components that are capable of generating electromagnetic emissions that cause EMI. In one embodiment a conductive sidepanel has a resilient cantilever member formed therefrom with a fixed end that is integrally formed with the sidepanel and a movable end that is free of a module coupler, thereby allowing the resilient cantilever member to flex as the module is installed in a chassis. The resilient cantilever member has a boss that is formed proximate to the movable free end. The boss extends outward from the sidepanel a distance sufficient to provide a conductive path between the conductive sidepanel and an adjacent conductive surface when the module is installed in the chassis.

What is claimed is:  
     
         1 . For use in an electronics module configured to house electrical components capable of generating electromagnetic emissions that cause electromagnetic interference (EMI), an EMI module cover, comprising: 
 a conductive sidepanel having a resilient cantilever member formed therefrom, said resilient cantilever member having a fixed end integrally formed with said sidepanel and a movable end free of a module coupler, thereby to allow said resilient cantilever member to flex as said module is installed in a chassis; and    a boss formed proximate said movable free end and extending outwardly from said sidepanel a distance sufficient to provide a conductive path between said conductive sidepanel and an adjacent conductive surface when said module is installed in said chassis.    
     
     
         2 . The EMI module cover as recited in    claim 1    wherein said sidepanel has a plurality of said resilient cantilever members.  
     
     
         3 . The EMI module cover as recited in    claim 2    wherein at least one of said resilient cantilever members has an asymmetrical orientation to at least one other of said resilient cantilever members.  
     
     
         4 . The EMI module cover as recited in    claim 1    wherein said sidepanel includes two of said resilient cantilever members, said resilient cantilever members located on opposing ends of said sidepanel.  
     
     
         5 . The EMI module cover as recited in    claim 1    wherein said cantilever member is formed within a perimeter of said sidepanel.  
     
     
         6 . The EMI module cover as recited in    claim 1    wherein said sidepanel further comprises a cantilever member having a fixed end integrally formed with said sidepanel and a movable end having a module coupler.  
     
     
         7 . For use in an electronics module configured to house electrical components capable of generating electromagnetic emissions that cause electromagnetic interference (EMI), a method of manufacturing an EMI module cover, comprising: 
 forming a conductive sidepanel having a resilient cantilever member formed therefrom, said resilient cantilever member having a fixed end integrally formed with said sidepanel and a movable end free of a module coupler, thereby to allow said resilient cantilever member to flex as said module is installed in a chassis; and    forming a boss formed proximate said movable free end and extending outwardly from said sidepanel a distance sufficient to provide a conductive path between said conductive sidepanel and an adjacent conductive surface when said module is installed in said chassis.    
     
     
         8 . The method of manufacturing as recited in    claim 7    further comprising forming a plurality of said resilient cantilever members.  
     
     
         9 . The method of manufacturing as recited in    claim 8    further comprising forming at least one of said resilient cantilever members with an orientation asymmetric to at least one other of said resilient cantilever members.  
     
     
         10 . The method of manufacturing as recited in    claim 7    further comprising forming two of said resilient cantilever members, said resilient cantilever members located on opposing ends of said sidepanel.  
     
     
         11 . The method of manufacturing as recited in    claim 7    further comprising forming said cantilever member within a perimeter of said sidepanel.  
     
     
         12 . The method of manufacturing as recited in    claim 7    further comprising forming a cantilever member having a fixed end integrally formed with said sidepanel and a movable end having a module coupler.  
     
     
         13 . An electronic equipment chassis, comprising: 
 a frame;    an electronics module configured to be received within said frame and configured to house electrical components capable of generating electromagnetic emissions that cause electromagnetic interference (EMI), said electronics module having an EMI module cover, including:    a conductive sidepanel having a resilient cantilever member formed therefrom, said resilient cantilever member having a fixed end integrally formed with said sidepanel and a movable end free of a module coupler, thereby to allow said resilient cantilever member to flex as said module is installed in a chassis; and    a boss formed proximate said movable free end and extending outwardly from said sidepanel a distance sufficient to provide a conductive path between said conductive sidepanel and an adjacent conductive surface when said module is installed in said chassis.    
     
     
         14 . The electronic equipment chassis as recited in    claim 13    wherein said sidepanel has a plurality of said resilient cantilever members.  
     
     
         15 . The electronic equipment chassis as recited in    claim 14    wherein at least one of said resilient cantilever members has an asymmetrical orientation to at least one other of said resilient cantilever members.  
     
     
         16 . The electronic equipment chassis as recited in    claim 13    wherein said sidepanel includes two of said resilient cantilever members, said resilient cantilever members located on opposing ends of said sidepanel.  
     
     
         17 . The electronic equipment chassis as recited in    claim 13    wherein said cantilever member is formed within a perimeter of said sidepanel.  
     
     
         18 . The electronic equipment chassis as recited in    claim 15    wherein said sidepanel further comprises a cantilever member having a fixed end integrally formed with said sidepanel and a movable end having a module coupler.  
     
     
         19 . An electronics module configured to be received within a frame of an electronics chassis and capable of generating electromagnetic emissions that cause electromagnetic interference (EMI), comprising; 
 an electrical components housing having interlocking opposing sidewalls, at least one of said sidewalls being an EMI module cover comprising;    a conductive sidepanel having a resilient cantilever member formed therefrom, said resilient cantilever member having a fixed end integrally formed with said sidepanel and a movable end free of a sidewalls coupler, thereby to allow said resilient cantilever member to flex as said electrical components housing is installed in said electronics chassis; and    a boss formed proximate said movable free end and extending outwardly from said sidepanel a distance sufficient to provide a conductive path between said conductive sidepanel and an adjacent conductive surface when said module is installed in said electronic chassis.    
     
     
         20 . The electronics module as recited in    claim 19    wherein said conductive sidepanel has a plurality of said resilient cantilever members.  
     
     
         21 . The electronics module as recited in    claim 20    wherein at least one of said resilient cantilever members has an asymmetrical orientation to at least one other of said resilient cantilever members.  
     
     
         22 . The electronics module as recited in    claim 19    wherein said conductive sidepanel includes two of said resilient cantilever members, said resilient cantilever members located on opposing ends of said conductive sidepanel.  
     
     
         23 . The electronics module as recited in    claim 19    wherein said cantilever member is formed within a perimeter of said conductive sidepanel.  
     
     
         24 . The electronics module as recited in    claim 19    wherein said conductive sidepanel further comprises a cantilever member having a fixed end integrally formed with said conductive sidepanel and a movable end having a module coupler.