Heat-dissipating device and method for manufacturing a housing of the heat-dissipating device

Abstract

A heat-dissipating device and a method for manufacturing a housing of the heat-dissipating device have been proposed. A metal plate is stamped to form a blank plate having a central area with a first set of fins, a second set of fins, and a number of assembly holes. The blank plate is further pressed to make the first set of fins and the second set of fins extend upright relative to the central area and surround the central area. The assembly holes allow the housing to be engaged by fasteners to a mounting plate with a fan.

What is claimed is:  
     
         1 . A heat-dissipating device comprising: 
 a housing formed by means of stamping a metal plate, the housing including a central area and a plurality of fins, the fins being formed by means of bending the metal plate, each two adjacent fins having a slit therebetween to provide a channel for air ventilation purpose; and    a mounting plate having a fan mounted thereon, the mounting plate being secured to the housing.    
     
     
         2 . The heat-dissipating device as claimed in    claim 1   , wherein the housing comprises at least one assembly hole for engaging with the mounting plate by a fastener.  
     
     
         3 . The heat-dissipating device as claimed in    claim 1   , wherein the central area of the housing includes a plurality of through-holes.  
     
     
         4 . The heat-dissipating device as claimed in    claim 1   , wherein the central area of the housing includes a plurality of slots.  
     
     
         5 . The heat-dissipating device as claimed in    claim 1   , wherein the housing comprises at least one outwardly extending ear having an assembly hole therein.  
     
     
         6 . The heat-dissipating device as claimed in    claim 1   , wherein the fins on two opposite sides of the housing are lower than the fins on the other two opposite sides of the housing.  
     
     
         7 . A method for manufacturing a housing of a heat-dissipating device, comprising the steps of: 
 forming a blank plate by means of stamping a metal plate, the blank plate including a central area, a first set of fins, and a second set of fins, each two adjacent said fins having a slit therebetween; and    stamping the blank plate to make the first set of fins and the second set of fins extend upright relative to the central area and surround the central area.    
     
     
         8 . The method for manufacturing a housing of a heat-dissipating device as claimed in    claim 7   , wherein the first set of fins is located on two opposite sides of the central area and the second set of fins is located on the other two opposite sides of the central area.  
     
     
         9 . The method for manufacturing a housing of a heat-dissipating device as claimed in    claim 7   , wherein the first set of fins has at least one fin not pressed upright to form an ear that extends outward, the ear including an assembly hole.  
     
     
         10 . The method for manufacturing a housing of a heat-dissipating device as claimed in    claim 8   , wherein the first set of fins has at least one fin not pressed upright to form an ear that extends outward, the ear including an assembly hole.  
     
     
         11 . The method for manufacturing a housing of a heat-dissipating device as claimed in    claim 7   , wherein the second set of fins has at least one fin not pressed upright to form an ear that extends outward, the ear including an assembly hole.  
     
     
         12 . The method for manufacturing a housing of a heat-dissipating device as claimed in    claim 8   , wherein the second set of fins has at least one fin not pressed upright to form an ear that extends outward, the ear including an assembly hole.  
     
     
         13 . The method for manufacturing a housing of a heat-dissipating device as claimed in    claim 8   , wherein the fins on said two opposite sides of the housing lower than the fins on the other two opposite sides of the housing.  
     
     
         14 . The heat-dissipating device as claimed in    claim 7   , wherein the central area of the housing includes at least one assembly hole.  
     
     
         15 . The heat-dissipating device as claimed in    claim 7   , wherein the central area of the housing includes a plurality of through-holes.  
     
     
         16 . The heat-dissipating device as claimed in    claim 7   , wherein the central area of the housing includes a plurality of slots.