Mounting apparatus of electronic components and mounting methods of the same

Abstract

An electronic component mounting apparatus and an electronic component mounting method are provided which improve the productivity by reducing the cycle time. The electronic component mounting method includes the steps of a) picking up an electronic component from a first supplying section or a second supplying section respectively disposed on each side of a substrate, b) recognizing the electronic component by a recognition section, and c) moving and mounting the electronic component on the substrate. Frequently used electronic components are stored in both of the first and second supplying sections. The electronic components are picked up from the first supplying section and mounted on the substrate in the normal operating conditions. When the electronic components stored in the first supplying section run out, the same kind of components are provided by the second supplying section to continue the mounting operation. In the mean time, the first supplying section is replenished with the electronic components, and when replenishment is completed, the electronic components are again, provided by the first supplying section, to continue the mounting operation. Thereby, carriage distance in the normal operating conditions becomes shorter which reduces the cycle time.

What is claimed is:  
     
         1 . An electronic component mounting method comprising the steps of; 
 a) obtaining electronic components from a supplying section including a first supplying section, having parts feeders, disposed on one side of a substrate holding section for holding a substrate, and a supplying section including a second supplying section, having parts feeders, disposed on another side of said substrate holding section;    b) recognizing said electronic components by a recognition section provided at a side of said substrate holding section facing said supplying section including said first supplying section; and    c) mounting said electronic components on a substrate held by said substrate holding section,    wherein electronic components of a first type are provided in said first supplying section and said second supplying section.    
     
     
         2 . The electronic component mounting method as set forth in    claim 1   , wherein said electronic components of said first type are required in large numbers.  
     
     
         3 . The electronic component mounting method as set forth in    claim 1   , wherein said electronic components are obtained from said supplying section including said second supplying section and are mounted on said substrate when said first supplying section in depleted of electronic components.  
     
     
         4 . The electronic component mounting method as set forth in claim  3 , further comprising the steps of; 
 a) replenishing said first supplying section which has been depleted of electronic components with electronic components of the first type, and    b) resuming the obtaining of electronic components from said first supplying section so as to continue mounting said electronic components.    
     
     
         5 . The electronic component mounting method as set forth in    claim 3   , further comprising the steps of; 
 resuming the obtaining of electronic components from a supplying section having a supply of electronic components when another of said supplying sections has been depleted of electronic components.    
     
     
         6 . The electronic component mounting method as set forth in    claim 5   , further comprising the steps of; 
 displacing said supplying section depleted of said electronic components by displacing means to a location where a replenishing operation can be conducted; and    replenishing said supplying section depleted of said electronic components;    obtaining and mounting of said electronic components continues from said supplying section with a supply of said electronic components while said supplying section depleted said electronic components is replenished.    
     
     
         7 . An electronic component mounting method comprising the steps of; 
 a) obtaining electronic components from a first supplying section and a second supplying section, said supplying sections disposed respectively on both sides of a substrate holding section for holding a substrate,    b) recognizing said electronic components by a recognition section provided at a side of said substrate holding section facing said first supplying section, and    c) mounting the electronic components on said substrate held by said substrate holding section,    wherein the electronic components provided in said first supplying section and said second supplying section are of a same type.    
     
     
         8 . An electronic component mounting method comprising the steps of: 
 a) obtaining electronic components from a first supplying section and a second supplying section, said supplying sections disposed respectively on both sides of said substrate holding section for holding a substrate,    b) recognizing the electronic components by a recognition section provided at a side of said substrate holding section facing said first supplying section, and    c) mounting the electronic components on said substrate held by said substrate holding section,    wherein said electronic component mounting method further comprises the steps of: 
 i) providing a same type of electronic component in both said first supplying section and said second supplying section,  
 ii) mounting the electronic components onto said substrate from said first supplying section,  
 iii) mounting electronic components from said second supplying section, when the supply of electronic components in said first supplying section is depleted,  
 iv) replenishing said first supplying section with the electronic components, and  
 v) continuing to mount electronic components from said first supplying section.  
   
     
     
         9 . An electronic component mounting method comprising the steps of; 
 a) obtaining electronic components from a plurality of supplying sections disposed on both sides of a substrate holding section,    b) mounting the electronic components on said substrate held in said substrate holding section, and    continuing to mount the electronic components from supplying sections with electronic components while one of said supplying sections is depleted of the electronic components, said electronic mounting method further comprises the steps of; 
 i) displacing said supplying section depleted of electronic components by displacing means to a location where a replenishing operation can be conducted, and  
 ii) replenishing the depleted electronic components to said supplying section depleted of electronic components.  
   
     
     
         10 . The electronic component mounting method as set forth in    claim 9   , further comprising the step of lowering said supplying section depleted of electronic components before said supplying section is displaced to said location where the replenishing operation can be conducted.  
     
     
         11 . An electronic component mounting apparatus comprising: 
 a) a substrate holding section for holding a substrate;    b) a first supplying section and a second supplying section respectively disposed at sides of said substrate holding section, each of said first supplying section and said second supplying section comprising; 
 i) parts feeders;  
 ii) a table on which said parts feeders are disposed,  
 iii) means for moving said table up and down, and  
 iv) position determining means for determining the height direction position of said parts feeders when said table ascends,  
   c) a mounting head for obtaining electronic components from said first supplying section and said second supplying section; and    d) a recognition section for recognizing an electronic component held by said mounting head.    
     
     
         12 . The electronic component mounting apparatus as set forth in    claim 11   , further comprising means for displacing said first supplying section and second supplying section toward an opposite direction from said substrate holding section.